JPS5816501A - Electronic part and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] The present invention provides a capacitive element, an inductance element, a resistive element,
The present invention relates to an electronic component in which a component element such as an active element is hermetically housed in an exterior case made of aluminum or an aluminum-based alloy with a space provided around the component element.

2. Description of the Related Art As electronic devices become smaller and the number of parts reduced, there is an increasing demand for electronic components in which a plurality of component elements are packed and housed in a single exterior case in an integrated manner. By the way, in this type of electronic component, the method of shielding the component element housed in the outer case from the outside is as follows.
Insulating resin is injected all around the parts and elements housed in the outer case, and the parts and elements are covered with insulating resin, and the printed circuit board on which the parts and elements are electrically wired and attached is inserted into the opening of the outer case. There is a method of fitting the parts and injecting an insulating resin from above to seal the opening, and placing the component element in a sealed space. The present invention relates to an electronic component having a structure in which a component element is hermetically packaged with a space provided around it.

The following points can be cited as reasons for creating a gap around the circumference of a component element.

(1) Avoid the adverse effects of the insulating resin itself or its solvent to be injected.

(2) When the component element itself contains an organic solvent, incomplete curing of the insulating resin is prevented.

(3) Avoid shadows on component elements caused by stress during resin curing.

(4) Reduce the weight of electronic components.

Furthermore, if high insulation is required between the component elements themselves and circuit wiring, not only should air gaps be created around the component elements, but also the insulation properties of the outer case and single-cast insulating resin used should be We need something extremely good. Resin is often used as an exterior case for sealed electronic components. However, due to the structure of the material, resin cases have poor gas and moisture barrier properties, and have a large coefficient of thermal expansion, so they are not very suitable as external cases for highly insulating electronic components, and are often used for inexpensive electronic components. used in

Metal cases are used especially for electronic components that require high insulation. Although metal cases have good barrier properties against gas and moisture, they have high thermal conductivity, and if thermal shock is applied, they will not be able to withstand casting resin. There was a high risk of cracks occurring between the metal case and the insulating resin, and there were problems with the adhesive strength between the metal case and the insulating resin. Also, in order to reduce the weight of electronic parts, aluminum is the appropriate metal.
It was necessary to improve the adhesion between the aluminum case and the insulating resin.

The present invention has been made in view of the above-mentioned problem, and its features include using aluminum or an aluminum-based alloy having a porous alumite film on the surface as an exterior case, and using R-grid as a cast insulating resin. The reason is that a liquid epoxy thermosetting resin containing sidoxyalkyltrimethoxysilane was used.

The present invention will be explained below based on the drawings; FIG. 1 is a sectional side view of an electronic component according to an embodiment of the present invention.

(1) is aluminum (hereinafter referred to as A/) or AJ
An exterior case made of a base alloy, (2) is the exterior case (1)
), the porous alumite film formed on the surface of (3) is
A printed circuit board (which also serves as a sealing material for the exterior case (1))
The printed circuit board (3) is equipped with component elements (4) such as capacitive elements, inductance elements, resistance elements, and active elements, and external terminals (5). This terminal board (3) is fitted into a step aη provided in the opening of the outer case (1) so that the component element (4) is located inside the outer case (1). . (6) is a cast insulating resin made of an epoxy thermosetting resin that is fitted into the opening of the outer case (1) and then filled onto the printed circuit board (3); 6) contains 0.1 to 5 wt* of r-glycidoxyalkyltrimethoxysilane based on the total resin amount.

Next, a method for manufacturing electronic components will be explained. First, a plate-shaped
An exterior case (1) is produced by applying processing such as pressing or impact processing to a l or triht-based alloy into a predetermined shape, and after degreasing and pickling, the exterior case (1) is anodized. An alumite treatment is performed by a method to form a porous alumite film (2) on the surface. As the alumite treatment bath by the anodizing method, a sulfuric acid bath had excellent adhesion to the epoxy thermosetting resin and a nine-porous alumite film was obtained. Further, the following conditions are suitable as the alumite treatment conditions.

Bath composition: Sulfuric acid 130-17Of/L Person t" 1001/min or below Bath temperature: 22-30℃ Current: 1 degree 0.6-1μ/- Treatment time: 8-30 minutes ' After the alumite treatment, the outer case is washed and dried. , use it as it is porous.Next, insert 1 into the opening of the outer case (1).
Fit the printed circuit board (3) on which the component element (4) and external terminal (5) are attached so that the component element (4) is inside the outer case (1), and then remove the total resin amount. A cast insulating resin (6) made of a liquid epoxy thermosetting resin containing 0.1 to 5 wt* of γ-glycidoxyalkyltrimethoxysilane is filled onto the printed circuit board (3). , heat and harden the component element (4), and place it in the outer case (
1) After being sealed and housed inside, the porous alumite film is sealed by exposing it to steam to form a dense film and complete the electronic component.

Next, r-glycidoxyalkyltrimethoxysilane will be explained.゛r-glycidoxyalkyltrimethoxysilane has the molecular formula:
s (n: Sei-ai)\1 is a silane coupling agent that is used as a structural reinforcing agent for various resins, but its effect as a bond reinforcing copper for AI is weak, and it is used as a liquid epoxy thermosetting resin. Even if γ-glycidoxyalkyltrimethoxysilane is added to
The adhesive strength with Al is low, and the T-peel strength is 10#/cI.
/ is as low as below.

However, when the surface of the AJ coat is subjected to alumite treatment in a sulfuric acid bath to form a porous alumite film, the following reactions occur on the surface of the porous alumite film.

^t-o-5r-t In this way, a polysiloxane having a γ-glycidoxy group, which is a functional group for an epoxy group, is formed on the surface of the alumite film.Moreover, the adhesive strength with AJ increases, and the liquid epoxy heat It is thought that the curable resin penetrated into the pores of the porous alumite film, reducing the wedge effect and dramatically increasing the adhesive strength. Furthermore, after the epoxy resin is cured, will the appropriate sealing treatment of the porous alumite film remain in the porous alumite film? (OH)
The wedge is fixed by crystallization and volume expansion of the alumite film, and the unreacted it
It is thought that the adhesion strength is further increased by hydrolyzing the γ-glycidoxyalkylmethoxysilane/glycidoxyalkylmethoxysilane, promoting polysiloxanization, and removing the adverse effects of r-glycidoxyalkylmethoxysilane.

Hereinafter, the present invention will be explained in more detail based on Examples.

Example 1 As a cast insulating resin, as a liquid epoxy thermosetting resin, Akmex X7750 A/H7 manufactured by Nippon Gosei Co., Ltd.
0 is used, and 1 wt% of r-glycidogysiglobylmethoxycin is added. We fabricated electronic components by varying the alumite treatment time of the AI exterior case without sealing the porous alumite film, and measured the T-peel strength of each. FIG. 2 is a graph showing the results of this measurement.

The alumite treatment bath and conditions are as follows.

H, So, 150g//kl" 10fi/1 Bath temperature 27℃ Current density 0.8 A/d7fi" From the measurement results in Figure 2, the alumite treatment time is such that the T-peel strength is 20#IA-r/l It is understood that 8 to 30 minutes is appropriate since it requires more than a certain amount of time.

Example 2 The cast insulating resin was the same as Example 1. Similarly, electronic components were manufactured by setting the alumite treatment time of the λ exterior case to 20 minutes and changing the pore sealing treatment time of the porous alumite film. The alumite treatment bath and conditions are as in Example 1. is the same as The T-peel strength of the manufactured electronic component was measured. The results are shown in FIG. In addition, the sealing treatment was performed at 100°C.
I understand that there is something.

Example 3 Electronic components were manufactured by varying the amount of r-glycidoxypropylmethoxysilane added to a liquid epoxy thermosetting resin (Akmex X7750A/H70 manufactured by Nippon Gosei Co., Ltd.). i The alumite treatment bath and conditions for the exterior case are as in Example 1. Same as above, the treatment time is 20 minutes, and the porous alumite treatment bath film treatment time is 1 hour. The T-peel strength of the manufactured electronic component was measured, and the results are shown in FIG. From this result, it can be seen that the appropriate amount of γ-glycidoxypropylmethoxysilane to be added is 0.1 to 5 wt% when the T-peel strength is 20 kV or more.

Example 4 For comparison with the conventional example, an electronic component was manufactured under the following conditions.

The outer case is kl.

The manufactured electronic components were subjected to a high temperature and high humidity test at 60°C and 90 SRH, and a heat cycle test in which one cycle consisted of leaving the parts in steam at 100°C for 8 hours and then immersing them in ice water at θ°C for 5 minutes. .

These test results are shown in Figure 5 (a) and middle).
It was shown to.

As is clear from the graphs in Figures 5 (a) and (b), the FC electronic component obtained by the present invention has high airtightness, high temperature and high humidity resistance, and thermal shock resistance, which are significantly improved compared to conventional examples. are doing. In particular, regarding thermal shock resistance, conventional heat cycle tests (100℃ latm steam 8 hours, exposure → O℃ ice water 5 hours)
While the adhesive surface of the outer case and the casting agent peeled off after about 2 times (separate immersion), in this example, no peeling of the adhesive surface was observed until about 100 times.

[Brief explanation of drawings]

Figure 1 is a cross-sectional side view of the electronic component of the present invention, Figure 2 is 1, @3.
4 are graphs showing the T-shaped peel i degree test results of the examples of the present invention, and FIG. This is a graph showing the results. (1) Exterior case (2) Porous alumite film (3) Printed circuit board (4) Component element (5) External terminal (6) Casting insulating resin 00 step patent applicant Alps Electric Co., Ltd. Figure 1 “T+” 'v14toa4Ayl CI?IIg)
10σpiItst,,i,ha*g
wt, chr] (Shi 16-141)

Claims (5)

[Claims] (1) Liquid epoxy thermosetting resin containing γ-glycidoxyalkyltrimethoxysilane was used as an opening sealing material for an exterior case made of aluminum or aluminum-based alloy with an alumite film on the surface. Electronic components featuring: (2) Claim 1, wherein the opening sealing material is a liquid epoxy thermosetting resin containing 0.1 to 5 wt% of γ-glycidoxyalkyltrimethoxysilane. Section Electronic Components. (3) A process of performing alumite treatment on the exterior case made of aluminum or an aluminum-based alloy to form a porous alumite film on the surface of the exterior case, and mounting the component elements and inserting the printed circuit board into the opening of the exterior case. A step of filling the printed circuit board with a liquid epoxy thermosetting resin containing r-glycidoxyalkyltrimethoxysilane, curing it by heating, and sealing the component element in an outer case. 1. A method for manufacturing an electronic component, comprising the steps of: performing a sealing treatment on a porous alumite film. (4) The method for manufacturing an electronic component according to claim 3, wherein the alumite treatment is performed in a sulfuric acid bath. (5) The method for manufacturing an electronic component according to claim 3, wherein the alumite treatment time is 8 to 30 minutes.