JPS58164265U - dummy parts - Google Patents
dummy partsInfo
- Publication number
- JPS58164265U JPS58164265U JP6127582U JP6127582U JPS58164265U JP S58164265 U JPS58164265 U JP S58164265U JP 6127582 U JP6127582 U JP 6127582U JP 6127582 U JP6127582 U JP 6127582U JP S58164265 U JPS58164265 U JP S58164265U
- Authority
- JP
- Japan
- Prior art keywords
- work
- soldering
- parts
- electronic component
- provides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案のダミーパーツの投影図、第２図はプリ
ント基板のスルーホール部位断面拡大図、第３図はプリ
ント基板にダミーパーツを搭載、はんだ付は後のハンダ
溶融ならびにスルーホール内にフラツクスが充填されて
いる状態を拡大した断面図である。
１・・・・・・ダミーパーツ、２・・・・・・モールド
樹脂本体、３・・・・・・リードピン、４・・・・・・
プリント基板。Figure 1 is a projected view of the dummy part of the present invention, Figure 2 is an enlarged cross-sectional view of the through-hole part of the printed circuit board, and Figure 3 is the dummy part mounted on the printed circuit board.Soldering is done after melting the solder and inside the through-hole. FIG. 3 is an enlarged cross-sectional view of a state in which a flux is filled in the container. 1...Dummy parts, 2...Mold resin body, 3...Lead pin, 4...
Printed board.
Claims (1)
ツ化したグミ−パーツでリード部にテーパリードを設け
、その表面にテフロンコーティングし、また、ショルダ
一部を設け、プリント基板より浮かして塔載し、本パー
ツを供す電子部品塔載積層基板のはんだ付は作業におい
て、自動はんだ付は作業および自動洗浄作業に供し得な
い、後付は部品の代用塔載はんだ付は作業後容易に取外
し得るようにしたことを特徴とするダミーパーツ。Multi-element lead pins are molded and fixed with resin and made into pseudo-gummy parts, with tapered leads on the lead part, Teflon coating on the surface, and a shoulder part, which is mounted floating above the printed circuit board. The soldering of the multilayer board mounted on the electronic component that provides this part is a work process, and automatic soldering cannot be used for work or automatic cleaning work.The soldering on the electronic component tower that provides this part cannot be used for work or automatic cleaning. Dummy parts that are characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6127582U JPS58164265U (en) | 1982-04-28 | 1982-04-28 | dummy parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6127582U JPS58164265U (en) | 1982-04-28 | 1982-04-28 | dummy parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58164265U true JPS58164265U (en) | 1983-11-01 |
Family
ID=30071481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6127582U Pending JPS58164265U (en) | 1982-04-28 | 1982-04-28 | dummy parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58164265U (en) |
-
1982
- 1982-04-28 JP JP6127582U patent/JPS58164265U/en active Pending
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