JPS5840867U - Masking material for automatic soldering on printed wiring boards - Google Patents
Masking material for automatic soldering on printed wiring boardsInfo
- Publication number
- JPS5840867U JPS5840867U JP13560881U JP13560881U JPS5840867U JP S5840867 U JPS5840867 U JP S5840867U JP 13560881 U JP13560881 U JP 13560881U JP 13560881 U JP13560881 U JP 13560881U JP S5840867 U JPS5840867 U JP S5840867U
- Authority
- JP
- Japan
- Prior art keywords
- pin
- printed wiring
- synthetic resin
- utility
- wiring boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000873 masking effect Effects 0.000 title claims description 5
- 239000000463 material Substances 0.000 title claims 6
- 238000005476 soldering Methods 0.000 title claims 3
- 229920003002 synthetic resin Polymers 0.000 claims 5
- 239000000057 synthetic resin Substances 0.000 claims 5
- 239000007769 metal material Substances 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はマスキング部材の使用状態を示す正面図、第２
図は第一実施例のマスキング部材の正面図、第３図は同
上側面図、第４図は同上ピン部分の断面図、第５図は第
二実施例のピン部分の正面図、第６図は同上側面図であ
る。
尚、図中符号、１・・・本体、２・・・ピン、（以上第
一実施例）、３・・・本体、４・・・側板、５・・・ピ
ン、（以上第二実施例）である。゛Figure 1 is a front view showing how the masking member is used;
The drawings are a front view of the masking member of the first embodiment, FIG. 3 is a side view of the same, FIG. 4 is a sectional view of the pin portion of the same, FIG. 5 is a front view of the pin portion of the second embodiment, and FIG. 6 is a side view of the same as above. In addition, the symbols in the drawings are as follows: 1...Main body, 2...Pin (above first embodiment), 3...main body, 4...side plate, 5...pin, (above second embodiment) ).゛
Claims (1)
も表面が合成樹脂素材で構成されるピンを突設し、この
ピンの径をピン先端については印刷配線板のリード挿入
孔に挿入可能な太さに、ピン基部についてはこの孔を閉
塞する太さに設定し更にこのピンの本数及び配列を各種
電気、電子部品のリードの印刷配線板への挿入時の状態
と一致させたことを特徴とする印刷配線板に於ける自動
半田付は用マスキング部材。 ２ 本体より突設されるピンを金属素材で構成し、この
ピン表面に合成樹脂被膜加工を施すことによりピン表面
を合成樹脂素材で構成した実用新案登録請求の範囲第１
項記載の印刷配線板に於ける自動半田付は用マスキング
部材。 ３−側にピンを突設した側板を合成樹脂素材で構成し、
この側板を本体両側＆ビピンが本体下方より突出するよ
う固着することによりピン表面を合成樹脂素材で構成し
た実用新案登録請求の範囲第１項記載の印刷配線板に於
ける自動半田付は用マスキング部材。[Scope of Claim for Utility Model Registration] 1. A pin whose surface is at least made of a synthetic resin material is protruded from a block-shaped body made of a metal material, and the diameter of this pin is determined by inserting a lead of a printed wiring board at the tip of the pin. The pin base is set to a thickness that can be inserted into the hole, and the pin base is set to a thickness that closes the hole, and the number and arrangement of the pins are set to match the state when the leads of various electrical and electronic components are inserted into the printed wiring board. A masking member for automatic soldering on printed wiring boards characterized by the following features: 2 Utility model registration claim No. 1 in which a pin protruding from the main body is made of a metal material, and the pin surface is made of a synthetic resin material by applying a synthetic resin coating to the surface of the pin.
Masking material for automatic soldering on printed wiring boards as described in section. The side plate with a protruding pin on the 3- side is made of synthetic resin material,
This side plate is fixed to both sides of the main body so that the pins protrude from the bottom of the main body, so that the surface of the pins is made of a synthetic resin material.Registered as a utility model.Registered utility model. Element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13560881U JPS5840867U (en) | 1981-09-14 | 1981-09-14 | Masking material for automatic soldering on printed wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13560881U JPS5840867U (en) | 1981-09-14 | 1981-09-14 | Masking material for automatic soldering on printed wiring boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5840867U true JPS5840867U (en) | 1983-03-17 |
Family
ID=29928966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13560881U Pending JPS5840867U (en) | 1981-09-14 | 1981-09-14 | Masking material for automatic soldering on printed wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5840867U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5448077A (en) * | 1977-09-22 | 1979-04-16 | Tokyo Shibaura Electric Co | Method of soldering parts to be added later |
-
1981
- 1981-09-14 JP JP13560881U patent/JPS5840867U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5448077A (en) * | 1977-09-22 | 1979-04-16 | Tokyo Shibaura Electric Co | Method of soldering parts to be added later |
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