JPS5816068A - プレ−ナマグネトロン方式のスパッタリング方法 - Google Patents
プレ−ナマグネトロン方式のスパッタリング方法Info
- Publication number
- JPS5816068A JPS5816068A JP11366081A JP11366081A JPS5816068A JP S5816068 A JPS5816068 A JP S5816068A JP 11366081 A JP11366081 A JP 11366081A JP 11366081 A JP11366081 A JP 11366081A JP S5816068 A JPS5816068 A JP S5816068A
- Authority
- JP
- Japan
- Prior art keywords
- target
- magnetic
- spatter
- magnetic field
- magnetic pole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3492—Variation of parameters during sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
- H01J37/3429—Plural materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3458—Electromagnets in particular for cathodic sputtering apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electromagnetism (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11366081A JPS5816068A (ja) | 1981-07-22 | 1981-07-22 | プレ−ナマグネトロン方式のスパッタリング方法 |
US06/400,258 US4444635A (en) | 1981-07-22 | 1982-07-21 | Film forming method |
EP82106621A EP0070574B1 (en) | 1981-07-22 | 1982-07-22 | Film forming method |
DE8282106621T DE3272887D1 (en) | 1981-07-22 | 1982-07-22 | Film forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11366081A JPS5816068A (ja) | 1981-07-22 | 1981-07-22 | プレ−ナマグネトロン方式のスパッタリング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5816068A true JPS5816068A (ja) | 1983-01-29 |
JPS6116347B2 JPS6116347B2 (enrdf_load_stackoverflow) | 1986-04-30 |
Family
ID=14617910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11366081A Granted JPS5816068A (ja) | 1981-07-22 | 1981-07-22 | プレ−ナマグネトロン方式のスパッタリング方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5816068A (enrdf_load_stackoverflow) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58171569A (ja) * | 1982-03-31 | 1983-10-08 | Hidetoshi Tsuchiya | スパッタリング方法 |
JPS6039160A (ja) * | 1983-07-19 | 1985-02-28 | バリアン・アソシエイツ・インコーポレイテツド | 磁性及び非磁性双方のターゲツト物質のためのマグネトロンスパツタコーテイング源 |
JPS6039161A (ja) * | 1983-07-19 | 1985-02-28 | バリアン・アソシエイツ・インコーポレイテツド | スパツタ・コーテイングを制御する方法及び装置 |
JPS60148951A (ja) * | 1984-01-11 | 1985-08-06 | 菊水化学工業株式会社 | 無釉タイルを塗りメヂとする工法 |
JPS6112863A (ja) * | 1984-06-28 | 1986-01-21 | Toshiba Corp | 合金膜の形成方法 |
US4606806A (en) * | 1984-05-17 | 1986-08-19 | Varian Associates, Inc. | Magnetron sputter device having planar and curved targets |
JPS63262462A (ja) * | 1987-04-17 | 1988-10-28 | Ube Ind Ltd | プラズマ制御マグネトロンスパツタリング装置及び方法 |
JPS6419749U (enrdf_load_stackoverflow) * | 1987-07-25 | 1989-01-31 | ||
JPH0289137U (enrdf_load_stackoverflow) * | 1988-12-28 | 1990-07-16 | ||
JPH0358536U (enrdf_load_stackoverflow) * | 1989-10-14 | 1991-06-07 | ||
JPH03126940U (enrdf_load_stackoverflow) * | 1990-04-03 | 1991-12-20 | ||
JP2007527839A (ja) * | 2004-03-01 | 2007-10-04 | プラクスエア・テクノロジー・インコーポレイテッド | 低ジルコニウムのハロゲン化ハフニウム組成物 |
-
1981
- 1981-07-22 JP JP11366081A patent/JPS5816068A/ja active Granted
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58171569A (ja) * | 1982-03-31 | 1983-10-08 | Hidetoshi Tsuchiya | スパッタリング方法 |
JPS6039160A (ja) * | 1983-07-19 | 1985-02-28 | バリアン・アソシエイツ・インコーポレイテツド | 磁性及び非磁性双方のターゲツト物質のためのマグネトロンスパツタコーテイング源 |
JPS6039161A (ja) * | 1983-07-19 | 1985-02-28 | バリアン・アソシエイツ・インコーポレイテツド | スパツタ・コーテイングを制御する方法及び装置 |
JPS60148951A (ja) * | 1984-01-11 | 1985-08-06 | 菊水化学工業株式会社 | 無釉タイルを塗りメヂとする工法 |
US4606806A (en) * | 1984-05-17 | 1986-08-19 | Varian Associates, Inc. | Magnetron sputter device having planar and curved targets |
JPS6112863A (ja) * | 1984-06-28 | 1986-01-21 | Toshiba Corp | 合金膜の形成方法 |
JPS63262462A (ja) * | 1987-04-17 | 1988-10-28 | Ube Ind Ltd | プラズマ制御マグネトロンスパツタリング装置及び方法 |
JPS6419749U (enrdf_load_stackoverflow) * | 1987-07-25 | 1989-01-31 | ||
JPH0289137U (enrdf_load_stackoverflow) * | 1988-12-28 | 1990-07-16 | ||
JPH0358536U (enrdf_load_stackoverflow) * | 1989-10-14 | 1991-06-07 | ||
JPH03126940U (enrdf_load_stackoverflow) * | 1990-04-03 | 1991-12-20 | ||
JP2007527839A (ja) * | 2004-03-01 | 2007-10-04 | プラクスエア・テクノロジー・インコーポレイテッド | 低ジルコニウムのハロゲン化ハフニウム組成物 |
JP4852527B2 (ja) * | 2004-03-01 | 2012-01-11 | プラクスエア・テクノロジー・インコーポレイテッド | 低ジルコニウムのハロゲン化ハフニウム組成物 |
Also Published As
Publication number | Publication date |
---|---|
JPS6116347B2 (enrdf_load_stackoverflow) | 1986-04-30 |
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