JPH049864B2 - - Google Patents
Info
- Publication number
- JPH049864B2 JPH049864B2 JP16867181A JP16867181A JPH049864B2 JP H049864 B2 JPH049864 B2 JP H049864B2 JP 16867181 A JP16867181 A JP 16867181A JP 16867181 A JP16867181 A JP 16867181A JP H049864 B2 JPH049864 B2 JP H049864B2
- Authority
- JP
- Japan
- Prior art keywords
- target
- film
- magnetic
- current
- flat plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004544 sputter deposition Methods 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 8
- 239000010408 film Substances 0.000 description 28
- 238000009826 distribution Methods 0.000 description 26
- 230000005284 excitation Effects 0.000 description 23
- 239000013077 target material Substances 0.000 description 23
- 230000003628 erosive effect Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 239000000696 magnetic material Substances 0.000 description 8
- 230000004907 flux Effects 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16867181A JPS5871372A (ja) | 1981-10-23 | 1981-10-23 | スパッタリングによる成膜方法及びその装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16867181A JPS5871372A (ja) | 1981-10-23 | 1981-10-23 | スパッタリングによる成膜方法及びその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5871372A JPS5871372A (ja) | 1983-04-28 |
| JPH049864B2 true JPH049864B2 (enrdf_load_stackoverflow) | 1992-02-21 |
Family
ID=15872329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16867181A Granted JPS5871372A (ja) | 1981-10-23 | 1981-10-23 | スパッタリングによる成膜方法及びその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5871372A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8402012A (nl) * | 1983-07-19 | 1985-02-18 | Varian Associates | Magnetron spetter deklaag opbrengbron voor zowel magnetische als niet-magnetische trefplaatmaterialen. |
| JPS63140078A (ja) * | 1986-11-29 | 1988-06-11 | Tokyo Electron Ltd | スパツタリングによる成膜方法 |
| JPH0768616B2 (ja) * | 1992-03-11 | 1995-07-26 | 富士ゼロックス株式会社 | 薄膜形成方法及び薄膜形成装置 |
-
1981
- 1981-10-23 JP JP16867181A patent/JPS5871372A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5871372A (ja) | 1983-04-28 |
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