JPS58154234A - 半導体基体の腐食方法 - Google Patents
半導体基体の腐食方法Info
- Publication number
- JPS58154234A JPS58154234A JP3777182A JP3777182A JPS58154234A JP S58154234 A JPS58154234 A JP S58154234A JP 3777182 A JP3777182 A JP 3777182A JP 3777182 A JP3777182 A JP 3777182A JP S58154234 A JPS58154234 A JP S58154234A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- substrates
- jig
- semiconductor
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3777182A JPS58154234A (ja) | 1982-03-09 | 1982-03-09 | 半導体基体の腐食方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3777182A JPS58154234A (ja) | 1982-03-09 | 1982-03-09 | 半導体基体の腐食方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58154234A true JPS58154234A (ja) | 1983-09-13 |
| JPH049376B2 JPH049376B2 (enExample) | 1992-02-20 |
Family
ID=12506727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3777182A Granted JPS58154234A (ja) | 1982-03-09 | 1982-03-09 | 半導体基体の腐食方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58154234A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5172901A (en) * | 1990-07-31 | 1992-12-22 | Sharp Kabushiki Kaisha | Paper feeding device |
| JPH05128640A (ja) * | 1991-11-06 | 1993-05-25 | Fujitsu Ten Ltd | テープ再生装置 |
| US8821054B2 (en) | 2007-01-17 | 2014-09-02 | Nisca Corporation | Printer apparatus |
-
1982
- 1982-03-09 JP JP3777182A patent/JPS58154234A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5172901A (en) * | 1990-07-31 | 1992-12-22 | Sharp Kabushiki Kaisha | Paper feeding device |
| JPH05128640A (ja) * | 1991-11-06 | 1993-05-25 | Fujitsu Ten Ltd | テープ再生装置 |
| US8821054B2 (en) | 2007-01-17 | 2014-09-02 | Nisca Corporation | Printer apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH049376B2 (enExample) | 1992-02-20 |
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