JPS5815240A - 半導体製造装置 - Google Patents
半導体製造装置Info
- Publication number
- JPS5815240A JPS5815240A JP56112144A JP11214481A JPS5815240A JP S5815240 A JPS5815240 A JP S5815240A JP 56112144 A JP56112144 A JP 56112144A JP 11214481 A JP11214481 A JP 11214481A JP S5815240 A JPS5815240 A JP S5815240A
- Authority
- JP
- Japan
- Prior art keywords
- section
- distribution
- mold
- lead frame
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H05K13/0046—
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56112144A JPS5815240A (ja) | 1981-07-20 | 1981-07-20 | 半導体製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56112144A JPS5815240A (ja) | 1981-07-20 | 1981-07-20 | 半導体製造装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29128289A Division JPH02168633A (ja) | 1989-11-10 | 1989-11-10 | 半導体製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5815240A true JPS5815240A (ja) | 1983-01-28 |
| JPH0225253B2 JPH0225253B2 (enExample) | 1990-06-01 |
Family
ID=14579317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56112144A Granted JPS5815240A (ja) | 1981-07-20 | 1981-07-20 | 半導体製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5815240A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009267414A (ja) * | 2008-04-25 | 2009-11-12 | Sts Semiconductor & Telecommunications Co Ltd | 幅広リードフレーム用の半導体パッケージ製造装置及びこれを利用した半導体パッケージ製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54105479A (en) * | 1978-02-06 | 1979-08-18 | Mitsubishi Electric Corp | Manufacture unit of resin sealed type semiconductor device |
| JPS5596642A (en) * | 1979-01-17 | 1980-07-23 | Hitachi Ltd | Automatic molding machine |
| JPS5617238A (en) * | 1979-07-24 | 1981-02-19 | Toshiba Corp | Mold device for molding resin |
| JPH0225253A (ja) * | 1988-07-14 | 1990-01-26 | Nkk Corp | 連続鋳造用浸漬ノズル |
-
1981
- 1981-07-20 JP JP56112144A patent/JPS5815240A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54105479A (en) * | 1978-02-06 | 1979-08-18 | Mitsubishi Electric Corp | Manufacture unit of resin sealed type semiconductor device |
| JPS5596642A (en) * | 1979-01-17 | 1980-07-23 | Hitachi Ltd | Automatic molding machine |
| JPS5617238A (en) * | 1979-07-24 | 1981-02-19 | Toshiba Corp | Mold device for molding resin |
| JPH0225253A (ja) * | 1988-07-14 | 1990-01-26 | Nkk Corp | 連続鋳造用浸漬ノズル |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009267414A (ja) * | 2008-04-25 | 2009-11-12 | Sts Semiconductor & Telecommunications Co Ltd | 幅広リードフレーム用の半導体パッケージ製造装置及びこれを利用した半導体パッケージ製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0225253B2 (enExample) | 1990-06-01 |
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