JPS58152047A - エポキシ樹脂成形材料 - Google Patents

エポキシ樹脂成形材料

Info

Publication number
JPS58152047A
JPS58152047A JP3397482A JP3397482A JPS58152047A JP S58152047 A JPS58152047 A JP S58152047A JP 3397482 A JP3397482 A JP 3397482A JP 3397482 A JP3397482 A JP 3397482A JP S58152047 A JPS58152047 A JP S58152047A
Authority
JP
Japan
Prior art keywords
molding material
epoxy resin
parts
ester
resin molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3397482A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0221419B2 (enrdf_load_stackoverflow
Inventor
Masayuki Kochiyama
河内山 誠幸
Tatsuo Sato
辰雄 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP3397482A priority Critical patent/JPS58152047A/ja
Publication of JPS58152047A publication Critical patent/JPS58152047A/ja
Publication of JPH0221419B2 publication Critical patent/JPH0221419B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP3397482A 1982-03-05 1982-03-05 エポキシ樹脂成形材料 Granted JPS58152047A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3397482A JPS58152047A (ja) 1982-03-05 1982-03-05 エポキシ樹脂成形材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3397482A JPS58152047A (ja) 1982-03-05 1982-03-05 エポキシ樹脂成形材料

Publications (2)

Publication Number Publication Date
JPS58152047A true JPS58152047A (ja) 1983-09-09
JPH0221419B2 JPH0221419B2 (enrdf_load_stackoverflow) 1990-05-14

Family

ID=12401454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3397482A Granted JPS58152047A (ja) 1982-03-05 1982-03-05 エポキシ樹脂成形材料

Country Status (1)

Country Link
JP (1) JPS58152047A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0839865A1 (de) * 1996-10-30 1998-05-06 Ciba SC Holding AG Härtbare Epoxidharzzusammensetzungen
JP2008007561A (ja) * 2006-06-27 2008-01-17 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いて得られた半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0839865A1 (de) * 1996-10-30 1998-05-06 Ciba SC Holding AG Härtbare Epoxidharzzusammensetzungen
JP2008007561A (ja) * 2006-06-27 2008-01-17 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いて得られた半導体装置

Also Published As

Publication number Publication date
JPH0221419B2 (enrdf_load_stackoverflow) 1990-05-14

Similar Documents

Publication Publication Date Title
US5798400A (en) Epoxy resin compound
JPH066626B2 (ja) 半導体装置封止用エポキシ樹脂組成物
JPS58152047A (ja) エポキシ樹脂成形材料
JPH1036486A (ja) 半導体封止用エポキシ樹脂組成物
JPH11209579A (ja) 封止用のエポキシ樹脂組成物および樹脂封止型光半導体装置
JPH11323097A (ja) エポキシ樹脂組成物及びそれを用いた封止剤
JP2002080695A (ja) エポキシ樹脂組成物及び半導体装置
JPH08337634A (ja) エポキシ樹脂組成物及び樹脂封止型半導体装置
JPS63275626A (ja) エポキシ樹脂組成物
JPH02228354A (ja) 半導体封止用エポキシ樹脂組成物
JPS6181427A (ja) エポキシ樹脂組成物
JPH03275711A (ja) エポキシ樹脂の可とう性付与剤および樹脂組成物
JPH0286149A (ja) 半導体装置
JPH0581607B2 (enrdf_load_stackoverflow)
JP2002161193A (ja) 金型離型回復樹脂組成物
JPH0581622B2 (enrdf_load_stackoverflow)
JPH01313519A (ja) エポキシ樹脂組成物およびエポキシ樹脂成型材料およびエポキシ樹脂成型体
JP2002037983A (ja) エポキシ樹脂組成物
EP0578446A2 (en) Epoxy resin compositions, preparations and uses thereof, semiconductor devices encapsulated therewith
JPH01188518A (ja) エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置
JPS6136771B2 (enrdf_load_stackoverflow)
JPH03212423A (ja) 電子部品封止用エポキシ樹脂成形材料
JPS6143621A (ja) 封止用樹脂組成物
JPS61168620A (ja) 半導体封止用エポキシ樹脂組成物
JPS6261215B2 (enrdf_load_stackoverflow)