JPS5814600A - 電子機器のシ−ルド板取付け装置 - Google Patents
電子機器のシ−ルド板取付け装置Info
- Publication number
- JPS5814600A JPS5814600A JP11257481A JP11257481A JPS5814600A JP S5814600 A JPS5814600 A JP S5814600A JP 11257481 A JP11257481 A JP 11257481A JP 11257481 A JP11257481 A JP 11257481A JP S5814600 A JPS5814600 A JP S5814600A
- Authority
- JP
- Japan
- Prior art keywords
- shield plate
- legs
- clamping member
- clamping
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Connection Of Plates (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11257481A JPS5814600A (ja) | 1981-07-17 | 1981-07-17 | 電子機器のシ−ルド板取付け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11257481A JPS5814600A (ja) | 1981-07-17 | 1981-07-17 | 電子機器のシ−ルド板取付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5814600A true JPS5814600A (ja) | 1983-01-27 |
| JPS6329839B2 JPS6329839B2 (enrdf_load_stackoverflow) | 1988-06-15 |
Family
ID=14590117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11257481A Granted JPS5814600A (ja) | 1981-07-17 | 1981-07-17 | 電子機器のシ−ルド板取付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5814600A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6370015B2 (en) | 2000-03-17 | 2002-04-09 | Murata Manufacturing Co., Ltd. | Laminated ceramic electronic device |
| JP2002267099A (ja) * | 2001-03-06 | 2002-09-18 | Taisei Corp | 低温タンク及び低温液の貯蔵方法 |
| WO2003030609A1 (en) * | 2001-09-28 | 2003-04-10 | Matsushita Electric Industrial Co., Ltd. | Electric apparatus comprising shield structure |
| JP2004197850A (ja) * | 2002-12-19 | 2004-07-15 | Nippon Thompson Co Ltd | 保持器のずれ防止機構を備えた有限直動案内ユニット |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0257072U (enrdf_load_stackoverflow) * | 1988-10-19 | 1990-04-25 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5492362U (enrdf_load_stackoverflow) * | 1977-12-13 | 1979-06-29 |
-
1981
- 1981-07-17 JP JP11257481A patent/JPS5814600A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5492362U (enrdf_load_stackoverflow) * | 1977-12-13 | 1979-06-29 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6370015B2 (en) | 2000-03-17 | 2002-04-09 | Murata Manufacturing Co., Ltd. | Laminated ceramic electronic device |
| JP2002267099A (ja) * | 2001-03-06 | 2002-09-18 | Taisei Corp | 低温タンク及び低温液の貯蔵方法 |
| WO2003030609A1 (en) * | 2001-09-28 | 2003-04-10 | Matsushita Electric Industrial Co., Ltd. | Electric apparatus comprising shield structure |
| JP2004197850A (ja) * | 2002-12-19 | 2004-07-15 | Nippon Thompson Co Ltd | 保持器のずれ防止機構を備えた有限直動案内ユニット |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6329839B2 (enrdf_load_stackoverflow) | 1988-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5917701A (en) | Heat sink hold-down clip | |
| US6873528B2 (en) | Supplemental heat conduction path for card to chassis heat dissipation | |
| EP0855089B1 (en) | Solderable transistor clip and heat sink | |
| US5991154A (en) | Attachment of electronic device packages to heat sinks | |
| US7167369B1 (en) | Methods and apparatus for installing a heat sink using surface mount technology | |
| US6053240A (en) | Heat sink | |
| JPS5814600A (ja) | 電子機器のシ−ルド板取付け装置 | |
| US7190591B2 (en) | Heat sink assembly | |
| JP4188831B2 (ja) | 交換可能な面実装素子用クリップ | |
| JP2579333Y2 (ja) | 電子部品の取り付け構造 | |
| JP3264780B2 (ja) | 回路ユニットの放熱装置 | |
| US5374205A (en) | Fuse holder | |
| US7974097B2 (en) | Printed circuit board and heat sink | |
| JP2010219415A (ja) | 半導体素子の取付構造 | |
| JPH0888303A (ja) | Ｉｃの放熱装置 | |
| JPH05191071A (ja) | 発熱部品の取付構造 | |
| JPH11135693A (ja) | 電子素子パッケージをヒートシンクに取り付ける器具 | |
| JP2800495B2 (ja) | 電子部品の取付装置 | |
| TWI388256B (zh) | 印刷電路板及其散熱結構 | |
| JP2571595Y2 (ja) | 回路基板に実装された電気部品のための放熱構造 | |
| JP2002190495A (ja) | 集積回路装着部材および集積回路組立体 | |
| JPS5833759Y2 (ja) | 放熱板取付装置 | |
| JP2005038878A (ja) | 放熱装置 | |
| JPH08335656A (ja) | 放熱装置およびそれを用いた電子機器 | |
| WO1998007304A1 (en) | Heat sink |