JPS58145669A - セラミツクスと銅の接合方法 - Google Patents
セラミツクスと銅の接合方法Info
- Publication number
- JPS58145669A JPS58145669A JP57024758A JP2475882A JPS58145669A JP S58145669 A JPS58145669 A JP S58145669A JP 57024758 A JP57024758 A JP 57024758A JP 2475882 A JP2475882 A JP 2475882A JP S58145669 A JPS58145669 A JP S58145669A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- ceramics
- joining
- chromium
- chromium oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 43
- 229910052802 copper Inorganic materials 0.000 title claims description 41
- 239000010949 copper Substances 0.000 title claims description 41
- 238000000034 method Methods 0.000 title claims description 26
- 238000005304 joining Methods 0.000 claims description 23
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 18
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 17
- 229910052804 chromium Inorganic materials 0.000 claims description 17
- 239000011651 chromium Substances 0.000 claims description 17
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 13
- 230000003647 oxidation Effects 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000011282 treatment Methods 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 3
- UOUJSJZBMCDAEU-UHFFFAOYSA-N chromium(3+);oxygen(2-) Chemical class [O-2].[O-2].[O-2].[Cr+3].[Cr+3] UOUJSJZBMCDAEU-UHFFFAOYSA-N 0.000 claims description 2
- -1 chromium oxide gold Chemical compound 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 13
- 229910000831 Steel Inorganic materials 0.000 description 12
- 239000010959 steel Substances 0.000 description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000005219 brazing Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000010583 slow cooling Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57024758A JPS58145669A (ja) | 1982-02-18 | 1982-02-18 | セラミツクスと銅の接合方法 |
| US06/465,043 US4500383A (en) | 1982-02-18 | 1983-02-08 | Process for bonding copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy |
| EP83300744A EP0087881B1 (en) | 1982-02-18 | 1983-02-15 | Process for bonding, copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy |
| DE8383300744T DE3361256D1 (en) | 1982-02-18 | 1983-02-15 | Process for bonding, copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy |
| KR1019830000619A KR870000722B1 (ko) | 1982-02-18 | 1983-02-16 | 세라믹스와 동재 또는 동-크롬합금재와의 접합 방법 |
| IN198/CAL/83A IN158447B (enrdf_load_stackoverflow) | 1982-02-18 | 1983-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57024758A JPS58145669A (ja) | 1982-02-18 | 1982-02-18 | セラミツクスと銅の接合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58145669A true JPS58145669A (ja) | 1983-08-30 |
| JPS6140625B2 JPS6140625B2 (enrdf_load_stackoverflow) | 1986-09-10 |
Family
ID=12147044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57024758A Granted JPS58145669A (ja) | 1982-02-18 | 1982-02-18 | セラミツクスと銅の接合方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS58145669A (enrdf_load_stackoverflow) |
| KR (1) | KR870000722B1 (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS593077A (ja) * | 1982-06-29 | 1984-01-09 | 株式会社東芝 | セラミツク部材と金属との接合方法 |
| JP2015224151A (ja) * | 2014-05-27 | 2015-12-14 | Ｎｇｋエレクトロデバイス株式会社 | Ｃｕ／セラミック基板 |
| JP2019073437A (ja) * | 2018-12-11 | 2019-05-16 | Ｎｇｋエレクトロデバイス株式会社 | Ｃｕ／セラミック基板 |
-
1982
- 1982-02-18 JP JP57024758A patent/JPS58145669A/ja active Granted
-
1983
- 1983-02-16 KR KR1019830000619A patent/KR870000722B1/ko not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS593077A (ja) * | 1982-06-29 | 1984-01-09 | 株式会社東芝 | セラミツク部材と金属との接合方法 |
| JP2015224151A (ja) * | 2014-05-27 | 2015-12-14 | Ｎｇｋエレクトロデバイス株式会社 | Ｃｕ／セラミック基板 |
| JP2019073437A (ja) * | 2018-12-11 | 2019-05-16 | Ｎｇｋエレクトロデバイス株式会社 | Ｃｕ／セラミック基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR840003594A (ko) | 1984-09-15 |
| KR870000722B1 (ko) | 1987-04-09 |
| JPS6140625B2 (enrdf_load_stackoverflow) | 1986-09-10 |
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