JPS58145189A - 配線基板の表裏両導電パタ−ン間の接続方法 - Google Patents
配線基板の表裏両導電パタ−ン間の接続方法Info
- Publication number
- JPS58145189A JPS58145189A JP2792782A JP2792782A JPS58145189A JP S58145189 A JPS58145189 A JP S58145189A JP 2792782 A JP2792782 A JP 2792782A JP 2792782 A JP2792782 A JP 2792782A JP S58145189 A JPS58145189 A JP S58145189A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- pin
- wiring board
- conductive ink
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 13
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2792782A JPS58145189A (ja) | 1982-02-22 | 1982-02-22 | 配線基板の表裏両導電パタ−ン間の接続方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2792782A JPS58145189A (ja) | 1982-02-22 | 1982-02-22 | 配線基板の表裏両導電パタ−ン間の接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58145189A true JPS58145189A (ja) | 1983-08-29 |
| JPH035077B2 JPH035077B2 (enrdf_load_stackoverflow) | 1991-01-24 |
Family
ID=12234513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2792782A Granted JPS58145189A (ja) | 1982-02-22 | 1982-02-22 | 配線基板の表裏両導電パタ−ン間の接続方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58145189A (enrdf_load_stackoverflow) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51127374A (en) * | 1975-04-28 | 1976-11-06 | Sanwa Denki Seisakusho Kk | Method of connecting conductors at opposite surfaces of printed wiring substrate |
-
1982
- 1982-02-22 JP JP2792782A patent/JPS58145189A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51127374A (en) * | 1975-04-28 | 1976-11-06 | Sanwa Denki Seisakusho Kk | Method of connecting conductors at opposite surfaces of printed wiring substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH035077B2 (enrdf_load_stackoverflow) | 1991-01-24 |
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