JPS58144871U - Pattern for repairing multilayer printed circuit boards - Google Patents
Pattern for repairing multilayer printed circuit boardsInfo
- Publication number
- JPS58144871U JPS58144871U JP4264782U JP4264782U JPS58144871U JP S58144871 U JPS58144871 U JP S58144871U JP 4264782 U JP4264782 U JP 4264782U JP 4264782 U JP4264782 U JP 4264782U JP S58144871 U JPS58144871 U JP S58144871U
- Authority
- JP
- Japan
- Prior art keywords
- spare
- hole
- multilayer printed
- pattern
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は多層プリント板の従来の回路パターンの一例を
示す図、第2図は本考案の一実施例で第1図に対応する
イは修復用パターン図、口、ハはそれぞれ修復例を示す
図である。
図中、1は塔載部品、2はリード、〜3.4はスルーホ
ール、9. 10. 1.1は予備スルーホール、5、
6. 7. 8. 17. 18. 19は回路パタ
ーン、12,13,14.15.16は予備パターン、
20はストラップ線、21は抵抗器を示す。Fig. 1 is a diagram showing an example of a conventional circuit pattern for a multilayer printed board, Fig. 2 is an embodiment of the present invention, and corresponding to Fig. 1, A is a diagram of a pattern for repair, and C and A are examples of repair, respectively. FIG. In the figure, 1 is a tower component, 2 is a lead, ~3.4 is a through hole, and 9. 10. 1.1 is a spare through hole, 5,
6. 7. 8. 17. 18. 19 is a circuit pattern, 12, 13, 14, 15, 16 are preliminary patterns,
20 is a strap wire, and 21 is a resistor.
Claims (1)
されたスルーホールを有する多層プリント板において、
スルーホールの周辺に少(とも1個の予備スルーホール
は基本格子上にある複数の子iスルーホールが設けられ
、搭載部品のリードが挿着される該スルーホールと該予
備スルーホール間および該予備スルーホール同志間は外
層に形成された予備パターンで接続され、内層に形成さ
れた該回路パターンはそれぞれ該予備スルーホールに直
接接続されてなる二生を特徴とする多層プリント板の修
復用パターン。A multilayer printed board with through holes into which leads of mounted components are inserted and multiple circuit patterns are connected.
A plurality of child through-holes are provided around the through-hole (at least one spare through-hole is on the basic grid, and there are holes between the through-hole into which the lead of the mounted component is inserted and the spare through-hole, and between the spare through-hole and the spare through-hole. A pattern for repairing a multilayer printed board, characterized in that spare through holes are connected by a spare pattern formed on an outer layer, and the circuit patterns formed on an inner layer are each directly connected to the spare through holes. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4264782U JPS58144871U (en) | 1982-03-26 | 1982-03-26 | Pattern for repairing multilayer printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4264782U JPS58144871U (en) | 1982-03-26 | 1982-03-26 | Pattern for repairing multilayer printed circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58144871U true JPS58144871U (en) | 1983-09-29 |
Family
ID=30053762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4264782U Pending JPS58144871U (en) | 1982-03-26 | 1982-03-26 | Pattern for repairing multilayer printed circuit boards |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58144871U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62239596A (en) * | 1986-04-11 | 1987-10-20 | 株式会社日立製作所 | Wiring board |
US7352067B2 (en) | 2004-06-30 | 2008-04-01 | Nec Corporation | Stacked semiconductor device |
-
1982
- 1982-03-26 JP JP4264782U patent/JPS58144871U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62239596A (en) * | 1986-04-11 | 1987-10-20 | 株式会社日立製作所 | Wiring board |
US7352067B2 (en) | 2004-06-30 | 2008-04-01 | Nec Corporation | Stacked semiconductor device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS58144871U (en) | Pattern for repairing multilayer printed circuit boards | |
JPS6018566U (en) | Connection positioning structure between circuit boards | |
JPS585370U (en) | printed wiring board | |
JPS6016577U (en) | printed board | |
JPS5978648U (en) | Printed board | |
JPS60172362U (en) | printed wiring board | |
JPS58166063U (en) | printed wiring board | |
JPS58191669U (en) | printed wiring board | |
JPH0430720U (en) | ||
JPS59112972U (en) | multilayer printed board | |
JPS60960U (en) | Mounting structure for electronic components on printed wiring boards | |
JPS5926272U (en) | printed wiring board | |
JPS5926273U (en) | printed wiring board | |
JPS6099574U (en) | printed wiring board | |
JPS6096859U (en) | Printed board | |
JPS628692U (en) | ||
JPS59182976U (en) | printed wiring board | |
JPH0410359U (en) | ||
JPS59112971U (en) | multilayer printed wiring board | |
JPS58129674U (en) | How to solder chip type components to a composite board | |
JPS58189559U (en) | multilayer printed circuit board | |
JPS5974751U (en) | complex electronic circuit | |
JPS5849463U (en) | printed board | |
JPS59143071U (en) | combination hole of printed wiring board | |
JPS609257U (en) | Printed board |