JPS58144841U - semiconductor manufacturing equipment - Google Patents

semiconductor manufacturing equipment

Info

Publication number
JPS58144841U
JPS58144841U JP4297182U JP4297182U JPS58144841U JP S58144841 U JPS58144841 U JP S58144841U JP 4297182 U JP4297182 U JP 4297182U JP 4297182 U JP4297182 U JP 4297182U JP S58144841 U JPS58144841 U JP S58144841U
Authority
JP
Japan
Prior art keywords
manufacturing equipment
semiconductor manufacturing
semiconductor wafer
tray
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4297182U
Other languages
Japanese (ja)
Other versions
JPS6223087Y2 (en
Inventor
毛利 幹生
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP4297182U priority Critical patent/JPS58144841U/en
Publication of JPS58144841U publication Critical patent/JPS58144841U/en
Application granted granted Critical
Publication of JPS6223087Y2 publication Critical patent/JPS6223087Y2/ja
Granted legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図と第3図及び第4図は従来の半導体製
造装置(CVD装置)の二側を示す概略側面図及び部分
平面図、第5図及び第6図は本考案の一実施例を示す概
略部分側面図及び部分平面図、第7図はトレー断面図、
第8図は第6図のウェーハ供給機構とトレーの配管図、
第9図及び第10図は本考案実施例の異なる要部での概
略部分側面図及び部分平面図、第11図及び第12図は
一トレーの変形例を示す平面図及びT−T線断面図、第
13図は第11図トレー内部の配管図である。 4・・・・・・半導体ウェーハ、15・・・・・・トレ
ー、18゜18a、  18b−−−−−−f−7−吹
出口、19,19a。 19b・・・・・・エアー吸引口、34・・・トレー、
35゜36.37.38・・・・・・エアー吹出口、3
9.40・・・・・・エアー吸引口。
1, 2, 3 and 4 are schematic side views and partial plan views showing two sides of a conventional semiconductor manufacturing device (CVD device), and FIGS. A schematic partial side view and a partial plan view showing the embodiment, FIG. 7 is a sectional view of the tray,
Figure 8 is a piping diagram of the wafer supply mechanism and tray in Figure 6;
9 and 10 are schematic partial side views and partial plan views of different essential parts of the embodiment of the present invention, and FIGS. 11 and 12 are plan views and cross sections taken along the line T-T of a modified example of one tray. 13 is a piping diagram inside the tray shown in FIG. 11. 4...Semiconductor wafer, 15...Tray, 18° 18a, 18b---F-7-Blowout port, 19, 19a. 19b... Air suction port, 34... Tray,
35゜36.37.38... Air outlet, 3
9.40...Air suction port.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一トレー上に半導体ウェーハを載置して半導体ウェーハ
表面を熱処理する装置において、前記トレー上に半導体
ウェーハの供給及び取出し用のエアー吹出口と、半導体
ウェーハ位置決め用のエアー吸引口を設けたことを特徴
とする半導体製造装置。
In an apparatus for heat-treating the surface of a semiconductor wafer by placing a semiconductor wafer on a tray, an air outlet for supplying and taking out the semiconductor wafer and an air suction port for positioning the semiconductor wafer are provided on the tray. Features of semiconductor manufacturing equipment.
JP4297182U 1982-03-25 1982-03-25 semiconductor manufacturing equipment Granted JPS58144841U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4297182U JPS58144841U (en) 1982-03-25 1982-03-25 semiconductor manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4297182U JPS58144841U (en) 1982-03-25 1982-03-25 semiconductor manufacturing equipment

Publications (2)

Publication Number Publication Date
JPS58144841U true JPS58144841U (en) 1983-09-29
JPS6223087Y2 JPS6223087Y2 (en) 1987-06-12

Family

ID=30054069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4297182U Granted JPS58144841U (en) 1982-03-25 1982-03-25 semiconductor manufacturing equipment

Country Status (1)

Country Link
JP (1) JPS58144841U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009194376A (en) * 2008-01-16 2009-08-27 Semiconductor Energy Lab Co Ltd Semiconductor substrate manufacturing apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5121474A (en) * 1974-08-15 1976-02-20 Mitsubishi Electric Corp HANDOTAIUE HATORIATSUKAISOCHI

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5121474A (en) * 1974-08-15 1976-02-20 Mitsubishi Electric Corp HANDOTAIUE HATORIATSUKAISOCHI

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009194376A (en) * 2008-01-16 2009-08-27 Semiconductor Energy Lab Co Ltd Semiconductor substrate manufacturing apparatus

Also Published As

Publication number Publication date
JPS6223087Y2 (en) 1987-06-12

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