JPS58144836U - Donut-shaped solder fusion connection pedestal - Google Patents
Donut-shaped solder fusion connection pedestalInfo
- Publication number
- JPS58144836U JPS58144836U JP1982041683U JP4168382U JPS58144836U JP S58144836 U JPS58144836 U JP S58144836U JP 1982041683 U JP1982041683 U JP 1982041683U JP 4168382 U JP4168382 U JP 4168382U JP S58144836 U JPS58144836 U JP S58144836U
- Authority
- JP
- Japan
- Prior art keywords
- donut
- solder
- fusion connection
- connection pedestal
- shaped solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の部品塔載の斜視図、第２図および第３図
は本考案の一実施例のペデスタルの構成図、第４図は本
考案の一実施例の部品塔載の斜視図である。
Ｓｉ・・・チップ、４・・・配線基板（Ｉ）、５・・・
ペデスタル、７・・・ペデスタル（Ｉ）、１２・・・ペ
デスタル（ＩＩ）、１４・・・配線基板（ＩＩ）。FIG. 1 is a perspective view of a conventional component mounting system, FIGS. 2 and 3 are configuration diagrams of a pedestal according to an embodiment of the present invention, and FIG. 4 is a perspective view of a component mounting system according to an embodiment of the present invention. It is. Si...chip, 4...wiring board (I), 5...
Pedestal, 7... Pedestal (I), 12... Pedestal (II), 14... Wiring board (II).
Claims (1)
のそのはんだボールと接続するペデスタルにおいて、そ
の導体部分の中央にはんだがぬれない部分を有し、迎え
はんだした時に中央を除く周辺の導体部分にはんだがぬ
れて、迎えはんだがドーナツ状となることを特徴とする
ドーナツ形半田溶融接続用ペデスタル。The pedestal of a chip that has a solder ball for solder fusion connection and is connected to the solder ball has a part in the center of the conductor part that cannot be wetted by solder, and when soldering is carried out, the surrounding conductor part except the center is not wetted with solder. A donut-shaped solder fusion connection pedestal characterized in that when wet, the receiving solder becomes donut-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982041683U JPS58144836U (en) | 1982-03-26 | 1982-03-26 | Donut-shaped solder fusion connection pedestal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982041683U JPS58144836U (en) | 1982-03-26 | 1982-03-26 | Donut-shaped solder fusion connection pedestal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58144836U true JPS58144836U (en) | 1983-09-29 |
Family
ID=30052859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982041683U Pending JPS58144836U (en) | 1982-03-26 | 1982-03-26 | Donut-shaped solder fusion connection pedestal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58144836U (en) |
-
1982
- 1982-03-26 JP JP1982041683U patent/JPS58144836U/en active Pending
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