JPS58141112A - Buddhist altar fittings - Google Patents
Buddhist altar fittingsInfo
- Publication number
- JPS58141112A JPS58141112A JP2199282A JP2199282A JPS58141112A JP S58141112 A JPS58141112 A JP S58141112A JP 2199282 A JP2199282 A JP 2199282A JP 2199282 A JP2199282 A JP 2199282A JP S58141112 A JPS58141112 A JP S58141112A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- present
- buddhist altar
- altar fittings
- buddhist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は仏具に関するもので、金被覆に係わるものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to Buddhist altar fittings, and relates to gold coating.
従来から仏具、神事など祭礼に関する器具に於て、その
外表面を金箔で装飾されているものが多い、そして、金
は非常に高価であるので、金箔は１０ミクロン相当、ま
たはそれ以下の極薄の金箔を貼りつけて製作している。Traditionally, the outer surfaces of many Buddhist utensils and ritual equipment such as Shinto rituals have been decorated with gold leaf, and since gold is very expensive, gold leaf is extremely thin, equivalent to 10 microns or less. It is made by pasting gold leaf on it.
しかしながら極薄の金箔を製作することは相当熟練な喪
し、かつ手間のか＼る作業である。However, producing ultra-thin gold leaf requires considerable skill and labor.
またその極めて薄い箔を貼りつける作業が綿密な仕事で
あって、証にでも小米るものでもない。Furthermore, the process of applying the extremely thin foil is a meticulous process, and is neither proof nor something to criticize.
本発明のものは之等の従来のものと異なり、極めて薄い
箔を製作することもなく、又熟練を・要しないでも所期
の目的を達成し得るものである。The present invention differs from such conventional methods in that it does not require the production of extremely thin foils and can achieve the intended purpose without requiring any skill.
本発明の詳細な説明する。第１図及第２図は本発明に係
わる一実施例の形状図である。The present invention will be described in detail. FIGS. 1 and 2 are shape diagrams of one embodiment of the present invention.
１及１１は金または金合金の微粒子であり、１は微細な
粒状であり １１は微細な細毛であり、２はセラミック
粉粒である。この粉粒の大きさは、仏具の表面の状態、
即ち凹凸表面及び面粗度の程度などによって異なるが通
常の場合約０．２ミクロンから１０ミクロン程度である
。その表面に付着する金、会合金粉の大きさはｏ、ｏ１
ミクロンからのものが適当である。いづれにしても本発
明のものはセラミック粉末の表面に極めて薄い膜状の金
、金合金を付着させてなるものであるが故に従来の金箔
よりさらに薄く、しかし粉粒であるため仏具の表面に対
して１ミクロンサイズの表面粗度が得られるため、箔表
面では得らｎなかった梨地楔体などの種々の表向が得ら
肚るなどの優れた加工を施し得るものである。1 and 11 are fine particles of gold or gold alloy, 1 is a fine grain, 11 is a fine hair, and 2 is a ceramic powder. The size of these powder particles depends on the condition of the surface of the Buddhist utensils.
That is, although it varies depending on the uneven surface and the degree of surface roughness, it is usually about 0.2 microns to about 10 microns. The size of gold and associated gold powder attached to the surface is o, o1
A micron size is suitable. In any case, since the product of the present invention is made by adhering an extremely thin film of gold or gold alloy to the surface of ceramic powder, it is thinner than conventional gold leaf, but since it is in the form of powder particles, it does not coat the surface of Buddhist utensils. On the other hand, since a surface roughness of 1 micron size can be obtained, it is possible to perform excellent processing such as obtaining various surface textures such as satin wedges that cannot be obtained with foil surfaces.
また１本発明に云う付着とは、電着、蒸着。Further, the adhesion referred to in the present invention includes electrodeposition and vapor deposition.
爆着、塗付、張り付けなどのことを含み、また仏具の概
念のなかには神事などの祭礼用具などをも包含するもの
である。This includes things such as bombardment, smearing, and pasting, and the concept of Buddhist utensils also includes ritual utensils for Shinto rituals.
本発明のものは芯材にセラミック粉粒を使用しているも
のであるが故に強度も充分あるので、本発明の表面被情
した仏具は外表面を立派に補強さｔ、耐蝕性など（＝も
富む製品とすることができる。同本発明に云う金合金の
金の含有量については金が微細粉になりたるときも酸化
反応が微小ζユ止まる程度の金の含有を必要とするもの
である。Since the present invention uses ceramic powder for the core material, it has sufficient strength, so the surface-loving Buddhist altar fittings of the present invention have excellent reinforcement on the outer surface and corrosion resistance (= Regarding the gold content of the gold alloy referred to in the present invention, it is necessary to contain enough gold to stop the oxidation reaction even when the gold is turned into fine powder. be.
本発明のものは持ち連び、加工作業−ヒの取扱い等も簡
便であり、従来のものよりｇｒ、単価が安価であるので
市場性を広く有するものである。The product of the present invention is easy to carry, easy to process and handle, and is cheaper in terms of weight and unit price than conventional products, so it has wide marketability.
第１図及第２図は本発明に係わる一実施例の形状因であ
る。
１．１′・・・金、金合金微細粒。２・・・セラミック
做粉粒。
／１
−２
第２ス・FIG. 1 and FIG. 2 show the shape factors of an embodiment according to the present invention. 1.1'... Gold, gold alloy fine grains. 2... Ceramic powder grains. /1 -2 2nd S.
Claims (1)
の微粉粒を外表面（二付着してなることを特徴とする部
分を有する仏具。Buddhist altar fittings that have a part characterized by having fine ceramic particles adhered to the outer surface (2), which are surface-cut with an ultra-thin film of gold or gold alloy material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2199282A JPS58141112A (en) | 1982-02-16 | 1982-02-16 | Buddhist altar fittings |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2199282A JPS58141112A (en) | 1982-02-16 | 1982-02-16 | Buddhist altar fittings |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58141112A true JPS58141112A (en) | 1983-08-22 |
Family
ID=12070514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2199282A Pending JPS58141112A (en) | 1982-02-16 | 1982-02-16 | Buddhist altar fittings |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58141112A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0658779U (en) * | 1992-12-18 | 1994-08-16 | 徳一 又▲吉▼ | Gold sand |
-
1982
- 1982-02-16 JP JP2199282A patent/JPS58141112A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0658779U (en) * | 1992-12-18 | 1994-08-16 | 徳一 又▲吉▼ | Gold sand |
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