JPS5950177A - Surface treatment of metal giving superior adhesive property - Google Patents

Surface treatment of metal giving superior adhesive property

Info

Publication number
JPS5950177A
JPS5950177A JP16199982A JP16199982A JPS5950177A JP S5950177 A JPS5950177 A JP S5950177A JP 16199982 A JP16199982 A JP 16199982A JP 16199982 A JP16199982 A JP 16199982A JP S5950177 A JPS5950177 A JP S5950177A
Authority
JP
Japan
Prior art keywords
surface treatment
metal
base material
treatment method
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16199982A
Other languages
Japanese (ja)
Inventor
Masato Moritoki
正人 守時
Takao Fujikawa
隆男 藤川
Junichi Miyanaga
宮永 順一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP16199982A priority Critical patent/JPS5950177A/en
Publication of JPS5950177A publication Critical patent/JPS5950177A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00Coating not provided for in groups C23C2/00 - C23C24/00

Abstract

PURPOSE:To obtain a surface treating film having superior adhesive property and joining force by subjecting an ordinary surface treating film on a base material to hot hydrostatic pressing treatment. CONSTITUTION:An ordinary surface treating film such as a plated layer 2 is formed on a base material 1. The layer 2 is isolated from the open air and subjected to hot hydrostatic pressing treatment in a high temp. and high pressure gaseous atmosphere which is suitable for the joining of the layer 2 to the material 1 by diffusion, does not cause the reaction of them, and exerts no unfavorable influence on the material 1. Gaseous H2 or the like contained in the pores in the layer 2 is discharged, th layer 2 is joined to the material 1 by diffusion, and the layer 2 intrudes deeply into the material 1 and produces strong joining force.

Description

【発明の詳細な説明】 める金属表面処理法に関するものである。[Detailed description of the invention] The present invention relates to metal surface treatment methods.

従来より母材表面の性質や寸法,外観を変え、変色や腐
食への抵抗などを改善する目的でメッキ。
Conventionally, plating is used to change the properties, dimensions, and appearance of the base material surface and improve resistance to discoloration and corrosion.

OVD (化学蒸着)、PyD (物理蒸着)、真空蒸
着.溶射など各種の表面処理が施てれているが、これら
は概して均一な薄層は得られるとしても一般に母材と薄
膜との結合力が非常に小さく、例えば絶えず、剥離など
の問題を伴っていた。
OVD (chemical vapor deposition), PyD (physical vapor deposition), vacuum evaporation. Various surface treatments such as thermal spraying are applied, but even though these treatments generally produce a uniform thin layer, the bonding strength between the base material and the thin film is generally very small, and problems such as constant peeling occur. Ta.

これを、例えば、表面処理の代表的なものであるメッキ
によって説明すると、メッキは主として金属表面の耐蝕
、耐摩、光沢等分目的として行なわれているが、次のよ
うな欠点分有している。
To explain this, for example, using plating, which is a typical surface treatment, plating is mainly used to make metal surfaces corrosion resistant, wear resistant, and glossy, but it has the following drawbacks: .

[1)  第38図に見られるようにメッキ層(2)と
母材(1)との間に多くの間隙(3)が又、メッキ層(
2)内に空孔(4)があり、通常、そこに水素が含寸れ
ていて強度を弱くする。
[1] As seen in Figure 38, there are many gaps (3) between the plating layer (2) and the base material (1).
2) There are pores (4) inside, which usually contain hydrogen, which weakens the strength.

(2)例えば耐摩(化を目的とした場合、薄いメッキで
はメッキ層がすぐに摩滅し、時には剥がれて母材の露出
が、起る。
(2) For example, if the purpose is to improve wear resistance, if the plating layer is thin, the plating layer will wear away quickly and sometimes peel off, exposing the base material.

(3)  といって、厚くメンキすると、第2図に図示
するように歪が出て、例えば1回の熱サイクルでrf(
j j!’に亀裂(5)を生じさせ、母材にもひソわれ
(6)を伝播する。
(3) However, if it is thickly peeled, distortion will occur as shown in Figure 2, and for example, one thermal cycle will cause rf (
j j! A crack (5) is generated in the base material, and a crack (6) is also propagated to the base material.

(つ)又、一度、メッキの表面に亀裂が生じると、耐1
’j!4 ’tJとしての能力にr無に等しいばかりか
、メッキをしない場合より悪くなる。
(2) Also, once cracks occur on the surface of the plating,
'j! 4' Not only is the performance as tJ negligible, but it is also worse than when no plating is applied.

(5)  殊に、局部的にメッキが剥がれると、電解腐
m(す生じ、)l)J別の絹合せではメッキのない場合
より狗(端に早りI/1!li′i!1iが生じる。
(5) In particular, if the plating peels off locally, electrolytic corrosion m()l)J different silk combinations will cause corrosion faster than when there is no plating. occurs.

(6)光沢を必要とする装飾部品では一度、メッキを落
すと、表面が欠落して全体の価値が低下する。
(6) Once the plating is removed from decorative parts that require gloss, the surface will be lost and the overall value will decrease.

などである。etc.

ところで、近年、1)1前記メツキを始め、CVD。By the way, in recent years, 1) CVD, including the above-mentioned metallurgy.

PVDの技術や、真空蒸着、俗射など表面処3(I!の
技術が広く先端産業に利用され、夫々jlc要な役Lj
lOを果している。なかでも、例えば現在、広く各方面
で利用されている工Cの薄膜と基材との良好な接合は電
気的特性、熱的特性に重髪な役割3果すものであるし、
工具の薄膜、−股にSi3N4 、 TiNなどセラミ
ックス簿膜が付けられることも多いが、その薄膜と母材
との接合強度は工具の)f含分左右する。しかも最近で
は、更にアモルファス薄膜も電子工業に活用され、その
役割が期待されている。
PVD technology, vacuum evaporation, general irradiation, and other surface treatments 3 (I!) technologies are widely used in cutting-edge industries, and each plays an important role.
It is fulfilling lO. Among them, for example, the good bond between the thin film and the base material of technology C, which is currently widely used in various fields, plays an important role in terms of electrical and thermal properties.
A ceramic film such as Si3N4 or TiN is often attached to the thin film of the tool, and the bonding strength between the thin film and the base material depends on the f content of the tool. Moreover, recently, amorphous thin films have also been utilized in the electronics industry, and are expected to play a role in this field.

このように表面処理被膜は、往年のメッキより未来を与
える有力なイ珂料となっており、その重甥性が益々、高
1って来ているにががわらず、その接合強度はS前述し
た如く相変らず、弱く、これを[8める汎用技術は未だ
殆ど天川化されていない。
In this way, the surface treatment film has become a powerful material that provides a better future than the plating of the past, and although its multilayer properties are becoming more and more superior, its bonding strength is comparable to that mentioned above. As before, it is still weak, and the general-purpose technology that can solve this problem has not yet been developed.

ところが・近時1.烏濡高圧ガス雰11[l気下で等方
向に被処理体を圧縮し、金属粉末、セラミックス粉末な
どから緻密な焼結体を製造したV、金属材料を接合する
方法として熱間静水圧プレス法(以下、HIP法という
)が開発され、注目?浴びて来た。特にHIP法による
金属材料の拡散接合は・その条件(温度、圧力1時間)
さえ、適当に選定すれば同種金属に限らず、異種金属の
組合せも含めて可能であるところから今日の復合材別製
造の見地から関心が持たれている。
However, recently 1. Hot isostatic pressing is a method for joining metal materials by compressing the object to be processed in the same direction under a high-pressure gas atmosphere of 11 [l] to produce a dense sintered body from metal powder, ceramic powder, etc. (hereinafter referred to as the HIP method) has been developed and is attracting attention? I was bathed in it. In particular, the conditions for diffusion bonding of metal materials using the HIP method (temperature, pressure, 1 hour)
However, if appropriate selection is made, it is possible to combine not only the same type of metal but also different types of metals, which is of interest from the standpoint of manufacturing individual composite materials today.

しかしながら、このようなHIP法といえども粉末の成
形や、焼結欠陥あるいは鋳造欠陥の除去又はカーボッの
高密度化2合金疲労部品の再生処理など一般的な金属加
工の分野に利用されることはあっても、未だ表面の薄膜
を母材に対し強固に固定しようとする試みはなされてい
ない。
However, even though this HIP method is used, it cannot be used in general metal processing fields such as powder compaction, removal of sintering defects or casting defects, or reprocessing of carbon densification 2 alloy fatigue parts. However, no attempt has been made to firmly fix the thin film on the surface to the base material.

木発明者らは、叙上のような現状に鑑み、金属表面処理
にHIP法の適用を図ることを課題として取組み・これ
によって従来1難点とされていた金属表面被膜の接合強
度2高めることを企図し、その実験を試みるに至った。
In view of the current situation described above, the inventors of wood have taken up the challenge of applying the HIP method to metal surface treatment, and have thereby succeeded in increasing the bonding strength of metal surface coatings, which had been considered one of the difficulties in the past. I decided to try the experiment.

即ち、本発明は、通気孔?有しない薄膜表面処理をした
部材にHIP法を適用して密ス6性、接合力企高めると
共に、処理部材の疲労強度ご向上させることを目的とす
るものであり、母材に曲常の表面処理手段に従って、金
属被膜ご付着形成した後、該被膜付着部材を外気から遮
断した状態におき、母材と表面金属被膜との拡散接合に
Irx好適であるが、両者は反応せず、かつ母料に好甘
しくない影gを生じさせない高温、高圧ガスJ囲気下で
「″JiJ記波膜付着部拐に熱間静水圧プレス処理(1
11P処理)を施すことな%徴とするものである。
That is, the present invention is a ventilation hole? The purpose of this method is to apply the HIP method to parts that have been subjected to a thin film surface treatment that does not have any curved surfaces on the base material, to increase the density and bonding strength of the parts, as well as to improve the fatigue strength of the treated parts. After forming a metal coating according to the treatment method, the member to which the coating is attached is kept isolated from the outside air, and Irx is suitable for diffusion bonding between the base material and the surface metal coating, but the two do not react and A hot isostatic press treatment (1) was applied to the part of the film to which it was attached under a high-temperature, high-pressure gas atmosphere that would not cause any unfavorable effects on the material.
11P processing).

ここで、前記通常の表面処理手段としてはメッキ法、C
VD法、PVD法、真空蒸着法、溶射法など公知のすべ
ての金属表面処理手段が含1れるが、本発明においてH
工P処理にイ1はれる金属被膜としては、通気孔を有し
ない被膜がイ1効であるところから溶射法は余り適切と
は云えず、最も代表的な手段としては電気メツキ法によ
る処理が挙げられる。
Here, the usual surface treatment means include plating method, C
All known metal surface treatment methods such as the VD method, PVD method, vacuum evaporation method, and thermal spraying method are included, but in the present invention, H
Thermal spraying is not very suitable for metal coatings that are deposited in P treatment, as coatings without ventilation holes are most effective, and the most typical method is electroplating. Can be mentioned.

この場合、母材としては、殆どすべての金属。In this case, the base material is almost any metal.

炭化物宿、電導性のあるものが使用可能であり、史にL
′(空蒸着の場合にはプラスチック、カーボン。
Carbide materials, electrically conductive materials can be used, and L
′ (Plastic, carbon in the case of empty deposition.

セラミック、ガラスなども使用可能である。更に気相メ
ッキではこれに適した種々の金属が期用σれる。
Ceramic, glass, etc. can also be used. Furthermore, various metals suitable for vapor phase plating are used.

一刀、表面処理イ2料としてはメッキ、真空蒸着などで
は殆どすべての金属が使用可能であるが・代表的なもの
としてはC!u、 N]、 Or、 Zm、 Sn、 
Pb、 Pf;、 A 、l、。
Almost all metals can be used for surface treatment, such as plating and vacuum deposition, but C! u, N], Or, Zm, Sn,
Pb, Pf;, A, l,.

Sb、 Ccl、 Co、 Au、■Y1.Ag、7j
ど、又、気相メッキの場合には、Zr、 Tj、 W、
 Nb、 Taも充分使用することができる。
Sb, Ccl, Co, Au, ■Y1. Ag, 7j
Also, in the case of vapor phase plating, Zr, Tj, W,
Nb and Ta can also be used sufficiently.

そして上記の如き各1母拐1表面処理材によって金属表
面処理が行なわれ、I母材表面に金属被膜が1・1着形
成されるが、この金属被膜を付着せしめた部イ3では前
述の如くその接合力に欠如するところから0(に該部側
に本発明の重要な工程とするH工P処理ご施ず。
Then, metal surface treatment is performed using each of the above-mentioned 1 base material and 1 surface treatment material, and a metal coating is formed on the surface of the base material. Due to the lack of bonding force, the H process, which is an important process of the present invention, was not applied to this part.

HI P処理は通常、カプセルと称する軟鋼あるいはガ
ラス製の答2;;を用い、前記金属被膜付着部イAk該
カブ士ル11りに装入し、蓋を溶接等により取り角け、
内部の空気な真空吸引脱気し、I、かる後、脱気管?閉
塞して密封し、高温高圧炉内に収納して所要の1z濡高
圧下に保持したAr  カース等不活性ガス雰囲気下で
静水印プレス処理を行なうことによってなされるが、こ
の処理によって金属被膜空孔内に含1れている例えば水
素カス汀追い出プれ・金属被膜と母イレはその接合面で
拡散接合し金属被膜、例えばメッキが母相の凹凸中にも
深く侵入し強固な接合力を得る。
HIP treatment usually uses a capsule made of mild steel or glass, which is charged into the metal coating attachment part A and the capsule 11, and the lid is removed by welding or the like.
The internal air is degassed by vacuum suction, and then the degassing tube is used. This is done by sealing the metal coating, placing it in a high-temperature, high-pressure furnace, and holding it under the required 1z wet high pressure. For example, the hydrogen scum contained in the hole is expelled, and the metal coating and the matrix are diffusion-bonded at their joint surfaces, and the metal coating, such as plating, penetrates deeply into the irregularities of the matrix, creating a strong bonding force. get.

第3図は、第1図、第2図に対比しメッキにより1号;
1ンに表面処理した後、11工P処理3行つグこ場合を
示し、第1図、第2図においてメッキ層(2)に見られ
た空孔(4)やメッキ層(2)と母相(1)との間に存
在した間隙(3)が消失し、しかもメッキ層がfiJ拐
(11内へ侵入(7)シて両者が良好な接合状態?有し
ていることを明らかにしている。
Figure 3 is No. 1 by plating in contrast to Figures 1 and 2;
After surface treatment in 1 layer, 3 rows of 11 P treatment is applied. It was revealed that the gap (3) that existed between the matrix and the matrix (1) disappeared, and that the plating layer penetrated into the fiJ layer (7) and had a good bonding state between the two. ing.

なお・上記H工P処理における処理部flは1け材なら
びに金属被膜の種類あるいは膜厚により、又表面処理の
月り勺によって適切な条件が選ばれるが、一般的に母材
と金属被膜が拡散接合するに秘すな温度でなければなら
ない。しかし、母相と金属被膜が反ルぷ[5たり、母材
に好寸しくない変態など・影響を及ぼさない温度以下で
あることが肝要である0具体的にはSn、 Z?1など
をメソキイオとして鋼に表Uo処理しである場合には圧
力、温度ともに低く、圧力50々、200’C以上でも
充分可能であるがその他の金属表面処理の場合には殆ど
100η。
Appropriate conditions for the treatment part fl in the above H/P treatment are selected depending on the material and the type or thickness of the metal coating, as well as the specifications of the surface treatment, but in general, when the base material and metal coating are The temperature must be suitable for diffusion bonding. However, it is important that the temperature is lower than the temperature at which the parent phase and the metal coating do not cause any adverse effects such as anti-lubrication [5] or unfavorable transformation to the parent material.Specifically, Sn, Z? When surface Uo treatment is applied to steel using mesokiio, such as No. 1, both the pressure and temperature are low, and it is possible to use pressures of 50° C. and 200° C. or more, but in the case of other metal surface treatments, it is almost 100 η.

300°C以上が好適である。A temperature of 300°C or higher is preferable.

勿論、H工p処理の態様として金属表面処理を施した部
、(2によっては必らずしもカプセル等の容器を使用す
ることは必要でなく、又、ガスもArガスに限らず、N
2  ガスなど他の不活性ガスを使用することも充分、
可能である。
Of course, as an aspect of the H-p treatment, it is not always necessary to use a container such as a capsule, and the gas is not limited to Ar gas, but may also be N.
2 It is also sufficient to use other inert gases such as gas.
It is possible.

なお、母材の表面は平滑でなく・通常、凹凸を有してい
るこ吉が多いが、このような凹凸面は表面の金属被膜?
その四部に侵入させ、より強固な接合をq4)ることが
できるので、表面処理に先立ち、(:J 4号面に15
1面加工を施しておくことも有効である。
In addition, the surface of the base material is not smooth and is usually uneven, but is this uneven surface the result of a metal coating on the surface?
Since it is possible to penetrate into the four parts and create a stronger bond q4), before surface treatment,
It is also effective to process one side.

更に本発明方法が適用される表面処理された金属被膜令
1着:31S (’Jの(Iz属被膜厚は、通常の表面
処理によって得られる0、05μ〜50μあるい汀、そ
れ以上という広範囲にわたっており、それら(こズ・J
して実質的に殆ど適用することができる。
Furthermore, the surface-treated metal coating to which the method of the present invention is applied has a coating thickness of 31S ('J), which has a wide range of thickness from 0.05μ to 50μ or more than that obtained by ordinary surface treatment. These (Kozu J
It can be practically applied in most cases.

かくして、以上のようにして得られたメッキ等、金属表
面処理による金属被膜は母材と強固に結合し、同時に金
属被膜同の空孔あるいは母イ2と該被膜との間の間隙は
圧潰消失し、同部分に含1れていた水素ガスは逃散して
密着性、接合力を1烏め、かつ水素ガスを放出して処理
部材の疲労強度を天面上σせ、更に母材の露出、ひソ割
れ等を充分に阻止する。
In this way, the metal coating obtained by metal surface treatment such as plating as described above is firmly bonded to the base material, and at the same time, the pores in the metal coating or the gaps between the matrix 2 and the coating are crushed and disappear. However, the hydrogen gas contained in the same part escapes and reduces the adhesion and bonding strength by 10%, and also releases the hydrogen gas, which increases the fatigue strength of the treated part to the top and further exposes the base material. , sufficiently prevents cracking, etc.

以下、更に本発明の具体的な実施例を掲げる。Further specific examples of the present invention are listed below.

実施例 下記表に示す母、(才に対し電解メッキ法を利用して夫
々下記拐質のメッキ層を形成し、以下の処理条件に従っ
てH工P処理を行なった。
EXAMPLES Plated layers of the following particles were formed on the materials shown in the table below using an electrolytic plating method, and subjected to H-P treatment according to the following treatment conditions.

以下余白 次いで上記・得られた処理部材について夫々、そのに見
られる如く何れもメッキ層における空孔は消失し、しか
もメッキ層が母村内へ侵入し一層強固な接合を果してい
ることが看取された。
As can be seen in the margins below, the pores in the plating layer have disappeared in each of the above-obtained treated members, and moreover, the plating layer has penetrated into the matrix and has achieved an even stronger bond. Ta.

しかも上記処理部拐は、その後において試料2ニ若干の
難は見られたが、総じてメッキ層に亀裂を起すこともな
く、又、#!J蝕を生じることも認められなかった。
Moreover, although some difficulties were observed in Sample 2 after the above-mentioned processing section was removed, overall there was no cracking in the plating layer, and #! No J erosion was observed.

以上の如く、本発明方法は従来のメッキなど金属表面処
理においては得られなかった接合力、密特開昭59− 
511177(4) 着性ご発揮し、その改善をもたらすと共に処理部材の疲
労強度の向上を果し、今後、益々、その利用が重要視さ
れる切削工具3電子部品企始め、ロールあるいは軸、軸
受等の摺動部拐、装飾部品に対する金属表面処理法とし
てその効果は大いに期待される。
As described above, the method of the present invention has a bonding strength that cannot be obtained with conventional metal surface treatments such as plating.
511177 (4) A cutting tool that exhibits and improves adhesion and improves the fatigue strength of processed parts, and whose use will become increasingly important in the future. It is highly expected to be effective as a metal surface treatment method for sliding parts and decorative parts.

【図面の簡単な説明】[Brief explanation of the drawing]

m1図は従来におけるメッキ層と母材との接合部分の状
態を示す部分断面説明図、第2図は同じ〈従来の厚肉メ
ッキにおけるメッキ層の亀裂伏態?示す部分断面説明図
、第3図は本発明方法により処理したメッキ層と母材と
の接合状態を示す部分断面説明図である。
Figure m1 is a partial cross-sectional explanatory diagram showing the state of the joint between the plated layer and the base metal in the conventional method, and Figure 2 is the same (Crack development in the plated layer in conventional thick-walled plating? FIG. 3 is a partial cross-sectional explanatory view showing the state of bonding between the plated layer and the base material treated by the method of the present invention.

Claims (1)

【特許請求の範囲】 l 母材に通常の表面処理手段に従って金属被膜を付着
形成した後、該被膜付着部材を外気から遮断した状態に
おき、母材と表面金属被膜との拡散接合には好適である
が、両者が反応せず、かつ母材に好ましくない影響を生
じさせない高温高圧の不活性ガス雰囲気下で前記被膜付
着部材に熱間静水圧プレス処理2施すことご特徴とする
密着性に優れた金属表面処理法。 !、 通常の表面処理手段がメッキ処理である特許請求
の範囲第1項記載の密着性に優れた金属表面処理法。 3 母材に付着形成する金属被膜がOu、 Ni、 O
r、 Zn。 Sn、 pb、 Pt、 At、 Sb、 Cd、 (
!o、 An、工n、 、Agからなる金属群−より選
ばれた1種以上の金属又は合金である特許請求の範囲第
1項又は第2項記載の密着性に優れた金属表面処理法。 父 母材が金属、プラスチック、カーボン、セラミンク
、ガラスからなる群より選ばれた材料である特許請求の
範囲第1項、第2項又は第3項記載の密着性に優れた金
属表面処理法。 5 ガス雰囲気が圧力50獅以上、200°C以上であ
る特許請求の範囲第1項記載の密着性に優れた金属表面
処理法。 6 ガス雰囲気が圧力10 oy2.以上、300°C
以上である特許請求の範囲第1項又は第5項記載の密着
性に優れた金属表面処理法。
[Scope of Claims] l After a metal coating is deposited on a base material according to a normal surface treatment method, the member to which the coating is attached is placed in a state shielded from the outside air, which is suitable for diffusion bonding between the base material and the surface metal coating. However, the adhesion is improved by subjecting the coating member to a hot isostatic press treatment 2 under a high-temperature, high-pressure inert gas atmosphere in which the two do not react and do not cause any unfavorable effects on the base material. Excellent metal surface treatment method. ! A metal surface treatment method with excellent adhesion according to claim 1, wherein the ordinary surface treatment means is plating treatment. 3 The metal coating formed on the base material is Ou, Ni, O
r, Zn. Sn, pb, Pt, At, Sb, Cd, (
! 3. The metal surface treatment method with excellent adhesion according to claim 1 or 2, wherein the metal surface treatment method is one or more metals or alloys selected from the metal group consisting of O, An, Ag, and Ag. The metal surface treatment method with excellent adhesion according to claim 1, 2, or 3, wherein the parent material is a material selected from the group consisting of metal, plastic, carbon, ceramic, and glass. 5. The metal surface treatment method with excellent adhesion according to claim 1, wherein the gas atmosphere is at a pressure of 50 psi or higher and 200° C. or higher. 6 The gas atmosphere has a pressure of 10 oy2. Above 300°C
A metal surface treatment method with excellent adhesion according to claim 1 or 5, which is as described above.
JP16199982A 1982-09-16 1982-09-16 Surface treatment of metal giving superior adhesive property Pending JPS5950177A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16199982A JPS5950177A (en) 1982-09-16 1982-09-16 Surface treatment of metal giving superior adhesive property

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16199982A JPS5950177A (en) 1982-09-16 1982-09-16 Surface treatment of metal giving superior adhesive property

Publications (1)

Publication Number Publication Date
JPS5950177A true JPS5950177A (en) 1984-03-23

Family

ID=15746105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16199982A Pending JPS5950177A (en) 1982-09-16 1982-09-16 Surface treatment of metal giving superior adhesive property

Country Status (1)

Country Link
JP (1) JPS5950177A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61117287A (en) * 1984-10-23 1986-06-04 エヌ・ヴイ・ベカルト・エス・エイ Iron base material having rubber adhesible metal film formedthereto and its production
JPS61201786A (en) * 1985-03-04 1986-09-06 Nippon Telegr & Teleph Corp <Ntt> Surface treatment of material
JPH03126687A (en) * 1989-10-11 1991-05-29 Eagle Ind Co Ltd Method for metallizing ceramics
JPH03158478A (en) * 1984-05-25 1991-07-08 Vapor Technol Inc Method and device for coating substrate
WO2000031312A1 (en) * 1998-11-19 2000-06-02 Forschungszentrum Karlsruhe Gmbh Method for producing of a protective layer on a martensitic steel and utilisation of said steel coated with said protective layer
US7043819B1 (en) * 1996-12-23 2006-05-16 Recast Airfoil Group Methods for forming metal parts having superior surface characteristics

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03158478A (en) * 1984-05-25 1991-07-08 Vapor Technol Inc Method and device for coating substrate
JPS61117287A (en) * 1984-10-23 1986-06-04 エヌ・ヴイ・ベカルト・エス・エイ Iron base material having rubber adhesible metal film formedthereto and its production
JPS61201786A (en) * 1985-03-04 1986-09-06 Nippon Telegr & Teleph Corp <Ntt> Surface treatment of material
JPH03126687A (en) * 1989-10-11 1991-05-29 Eagle Ind Co Ltd Method for metallizing ceramics
US7043819B1 (en) * 1996-12-23 2006-05-16 Recast Airfoil Group Methods for forming metal parts having superior surface characteristics
WO2000031312A1 (en) * 1998-11-19 2000-06-02 Forschungszentrum Karlsruhe Gmbh Method for producing of a protective layer on a martensitic steel and utilisation of said steel coated with said protective layer

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