JPS58139432A - 電子部品の樹脂モ−ルド方法 - Google Patents
電子部品の樹脂モ−ルド方法Info
- Publication number
- JPS58139432A JPS58139432A JP2226982A JP2226982A JPS58139432A JP S58139432 A JPS58139432 A JP S58139432A JP 2226982 A JP2226982 A JP 2226982A JP 2226982 A JP2226982 A JP 2226982A JP S58139432 A JPS58139432 A JP S58139432A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin material
- runner
- pot
- tablets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 61
- 239000011347 resin Substances 0.000 title claims abstract description 61
- 238000000465 moulding Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 30
- 239000001273 butane Substances 0.000 claims 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 claims 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims 1
- 238000002347 injection Methods 0.000 abstract description 7
- 239000007924 injection Substances 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2226982A JPS58139432A (ja) | 1982-02-15 | 1982-02-15 | 電子部品の樹脂モ−ルド方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2226982A JPS58139432A (ja) | 1982-02-15 | 1982-02-15 | 電子部品の樹脂モ−ルド方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58139432A true JPS58139432A (ja) | 1983-08-18 |
| JPS6240850B2 JPS6240850B2 (enrdf_load_stackoverflow) | 1987-08-31 |
Family
ID=12078041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2226982A Granted JPS58139432A (ja) | 1982-02-15 | 1982-02-15 | 電子部品の樹脂モ−ルド方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58139432A (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5258758A (en) * | 1975-11-05 | 1977-05-14 | Massachusetts Inst Technology | Method of accelerating cooling of polymer particles |
| JPS56107559A (en) * | 1980-01-30 | 1981-08-26 | Mitsubishi Electric Corp | Manufacture of resin-sealed semiconductor device |
-
1982
- 1982-02-15 JP JP2226982A patent/JPS58139432A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5258758A (en) * | 1975-11-05 | 1977-05-14 | Massachusetts Inst Technology | Method of accelerating cooling of polymer particles |
| JPS56107559A (en) * | 1980-01-30 | 1981-08-26 | Mitsubishi Electric Corp | Manufacture of resin-sealed semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6240850B2 (enrdf_load_stackoverflow) | 1987-08-31 |
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