JPS6240850B2 - - Google Patents

Info

Publication number
JPS6240850B2
JPS6240850B2 JP57022269A JP2226982A JPS6240850B2 JP S6240850 B2 JPS6240850 B2 JP S6240850B2 JP 57022269 A JP57022269 A JP 57022269A JP 2226982 A JP2226982 A JP 2226982A JP S6240850 B2 JPS6240850 B2 JP S6240850B2
Authority
JP
Japan
Prior art keywords
pot
resin
cavity
resin material
runner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57022269A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58139432A (ja
Inventor
Masashi Tarui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
Original Assignee
NEC Home Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd filed Critical NEC Home Electronics Ltd
Priority to JP2226982A priority Critical patent/JPS58139432A/ja
Publication of JPS58139432A publication Critical patent/JPS58139432A/ja
Publication of JPS6240850B2 publication Critical patent/JPS6240850B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2226982A 1982-02-15 1982-02-15 電子部品の樹脂モ−ルド方法 Granted JPS58139432A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2226982A JPS58139432A (ja) 1982-02-15 1982-02-15 電子部品の樹脂モ−ルド方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2226982A JPS58139432A (ja) 1982-02-15 1982-02-15 電子部品の樹脂モ−ルド方法

Publications (2)

Publication Number Publication Date
JPS58139432A JPS58139432A (ja) 1983-08-18
JPS6240850B2 true JPS6240850B2 (enrdf_load_stackoverflow) 1987-08-31

Family

ID=12078041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2226982A Granted JPS58139432A (ja) 1982-02-15 1982-02-15 電子部品の樹脂モ−ルド方法

Country Status (1)

Country Link
JP (1) JPS58139432A (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1528408A (en) * 1975-11-05 1978-10-11 Massachusetts Inst Technology Method of moulding plastics articles from particles of thermoplastics material
JPS56107559A (en) * 1980-01-30 1981-08-26 Mitsubishi Electric Corp Manufacture of resin-sealed semiconductor device

Also Published As

Publication number Publication date
JPS58139432A (ja) 1983-08-18

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