JPS6240850B2 - - Google Patents
Info
- Publication number
- JPS6240850B2 JPS6240850B2 JP57022269A JP2226982A JPS6240850B2 JP S6240850 B2 JPS6240850 B2 JP S6240850B2 JP 57022269 A JP57022269 A JP 57022269A JP 2226982 A JP2226982 A JP 2226982A JP S6240850 B2 JPS6240850 B2 JP S6240850B2
- Authority
- JP
- Japan
- Prior art keywords
- pot
- resin
- cavity
- resin material
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2226982A JPS58139432A (ja) | 1982-02-15 | 1982-02-15 | 電子部品の樹脂モ−ルド方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2226982A JPS58139432A (ja) | 1982-02-15 | 1982-02-15 | 電子部品の樹脂モ−ルド方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58139432A JPS58139432A (ja) | 1983-08-18 |
JPS6240850B2 true JPS6240850B2 (enrdf_load_stackoverflow) | 1987-08-31 |
Family
ID=12078041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2226982A Granted JPS58139432A (ja) | 1982-02-15 | 1982-02-15 | 電子部品の樹脂モ−ルド方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58139432A (enrdf_load_stackoverflow) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1528408A (en) * | 1975-11-05 | 1978-10-11 | Massachusetts Inst Technology | Method of moulding plastics articles from particles of thermoplastics material |
JPS56107559A (en) * | 1980-01-30 | 1981-08-26 | Mitsubishi Electric Corp | Manufacture of resin-sealed semiconductor device |
-
1982
- 1982-02-15 JP JP2226982A patent/JPS58139432A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58139432A (ja) | 1983-08-18 |
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