JPS58133938U - transistor mounting device - Google Patents
transistor mounting deviceInfo
- Publication number
- JPS58133938U JPS58133938U JP3020982U JP3020982U JPS58133938U JP S58133938 U JPS58133938 U JP S58133938U JP 3020982 U JP3020982 U JP 3020982U JP 3020982 U JP3020982 U JP 3020982U JP S58133938 U JPS58133938 U JP S58133938U
- Authority
- JP
- Japan
- Prior art keywords
- board
- heat sink
- recesses
- transistor
- heatsink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、トランジスタの放熱板への取付図、第2図は
基板の見取図、第3図は放熱板の見取図である。
1・・・基板、2−・・リード線、3・・・トランジス
タ、4・・・放熱板、5・・・ネジ。FIG. 1 is a diagram showing how a transistor is attached to a heat sink, FIG. 2 is a sketch of the substrate, and FIG. 3 is a sketch of the heat sink. 1... Board, 2... Lead wire, 3... Transistor, 4... Heat sink, 5... Screw.
Claims (1)
タおよび配線用リードを半田付し基板とトランジスタ用
放熱板を基板の2ケ所の凹部が放熱板の一辺の線上に並
ぶように直角に置き、その放熱板の一辺には1ケ所の凹
部を設け、その放熱板の凹部の幅は、基板を放熱板の方
向に平行に移動したときに、放熱板の凹部の向い合う2
辺に基板の凹部がはまり込み、基板が水平方向には、放
熱板からはすれない大きさとし、トランジスタを放熱板
に固定する際に、基板の2ケ所の凹部を同時に放熱板の
凹部の向い合う2辺にはめ込むようにし、トランジスタ
とともに基板を放熱板に固定することを特徴としたトラ
ンジスタ取り付は装置。Solder the transistor and wiring leads to a board with recesses on two opposite sides of the outer periphery, and place the board and transistor heat sink at right angles so that the two recesses on the board line up on one side of the heat sink. , one recess is provided on one side of the heat sink, and the width of the recess of the heat sink is equal to the width of the two opposite recesses of the heat sink when the board is moved parallel to the direction of the heat sink.
Make sure that the recesses of the board fit into the sides, and that the board does not slip horizontally from the heatsink, and when fixing the transistor to the heatsink, simultaneously fit the two recesses of the board so that the recesses of the heatsink face each other. The transistor mounting device is characterized by fitting it into two sides and fixing the board together with the transistor to the heat sink.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3020982U JPS58133938U (en) | 1982-03-05 | 1982-03-05 | transistor mounting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3020982U JPS58133938U (en) | 1982-03-05 | 1982-03-05 | transistor mounting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58133938U true JPS58133938U (en) | 1983-09-09 |
Family
ID=30041956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3020982U Pending JPS58133938U (en) | 1982-03-05 | 1982-03-05 | transistor mounting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58133938U (en) |
-
1982
- 1982-03-05 JP JP3020982U patent/JPS58133938U/en active Pending
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