JPS58130551A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58130551A
JPS58130551A JP57144629A JP14462982A JPS58130551A JP S58130551 A JPS58130551 A JP S58130551A JP 57144629 A JP57144629 A JP 57144629A JP 14462982 A JP14462982 A JP 14462982A JP S58130551 A JPS58130551 A JP S58130551A
Authority
JP
Japan
Prior art keywords
terminals
lead
circuit
semiconductor device
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57144629A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347352B2 (enrdf_load_stackoverflow
Inventor
Okimitsu Yasuda
安田　興光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP57144629A priority Critical patent/JPS58130551A/ja
Publication of JPS58130551A publication Critical patent/JPS58130551A/ja
Publication of JPS6347352B2 publication Critical patent/JPS6347352B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/10—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
    • H01L2225/1011—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1029—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57144629A 1982-08-23 1982-08-23 半導体装置 Granted JPS58130551A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57144629A JPS58130551A (ja) 1982-08-23 1982-08-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57144629A JPS58130551A (ja) 1982-08-23 1982-08-23 半導体装置

Publications (2)

Publication Number Publication Date
JPS58130551A true JPS58130551A (ja) 1983-08-04
JPS6347352B2 JPS6347352B2 (enrdf_load_stackoverflow) 1988-09-21

Family

ID=15366483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57144629A Granted JPS58130551A (ja) 1982-08-23 1982-08-23 半導体装置

Country Status (1)

Country Link
JP (1) JPS58130551A (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53763U (enrdf_load_stackoverflow) * 1976-06-23 1978-01-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53763U (enrdf_load_stackoverflow) * 1976-06-23 1978-01-06

Also Published As

Publication number Publication date
JPS6347352B2 (enrdf_load_stackoverflow) 1988-09-21

Similar Documents

Publication Publication Date Title
US3627901A (en) Composite electronic device package-connector unit
CN109671693A (zh) 电路引脚结构
JPH04307943A (ja) 半導体装置
EP2081226A1 (en) Multi-channel stackable semiconductor device and method for fabricating the same, and stacking substrate applied to the semiconductor device
US20030218393A1 (en) Stator structure having a printed board
US6788547B2 (en) Method of making electrical contact device
JP3516277B2 (ja) コネクタモジュール
JPH0652914A (ja) 電気的ターミナル
JPS58130551A (ja) 半導体装置
JPS63258050A (ja) 半導体装置
JP2001102712A (ja) コネクタ付きの配線基板、およびその製造方法
JPS5810365Y2 (ja) 半導体装置
US6489572B2 (en) Substrate structure for an integrated circuit package and method for manufacturing the same
JPS6356950A (ja) 複合化集積回路装置
CN215680425U (zh) 一种电容器组接线端集成结构
JPS621748Y2 (enrdf_load_stackoverflow)
CN100372189C (zh) 信号接头及用于该信号接头的嵌合结构
US3772773A (en) Electrical component and method of making the same
JPH0271551A (ja) 半導体装置
KR200211046Y1 (ko) 콘넥터용 암수 동일 타입의 접속단자
JPS6225437A (ja) 多層配線基板
JPH0619151Y2 (ja) 同軸コネクタ
JPH04131880U (ja) 同軸コネクタ
JPH05226414A (ja) Ｔａｂ−集積回路の製造方法およびその製造方法のためのｔａｂテープ
JPH09252083A (ja) 電子装置及びその製造方法