JPS5812930U - micro module block - Google Patents
micro module blockInfo
- Publication number
- JPS5812930U JPS5812930U JP10837281U JP10837281U JPS5812930U JP S5812930 U JPS5812930 U JP S5812930U JP 10837281 U JP10837281 U JP 10837281U JP 10837281 U JP10837281 U JP 10837281U JP S5812930 U JPS5812930 U JP S5812930U
- Authority
- JP
- Japan
- Prior art keywords
- module block
- micro module
- wafer
- micromodule
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図および第2図はそれぞれ本考案で使用するマイク
ロモジュールウェハおよびダミーウェハの一例の斜視図
、第3図は本考案のマイクロモジュールブロックを構成
する手順の一例を説明するための治具の斜視図、第4図
は本考案のマイクロモジュールブロックの一例の断面図
である。
1・・・・・・基板、2・・・・・・ノツチ、3・・曲
性部接続端子、5・・・・・・スペーサ、7・・曲リー
ド線、8・・曲半田、10・・・・・・マイクロモジュ
ールウェハ、2o・・・ダミーウェハ。1 and 2 are perspective views of an example of a micromodule wafer and a dummy wafer, respectively, used in the present invention, and FIG. 3 is a perspective view of a jig for explaining an example of the procedure for configuring the micromodule block of the present invention. FIG. 4 is a sectional view of an example of the micro module block of the present invention. DESCRIPTION OF SYMBOLS 1... Board, 2... Notch, 3... Curved part connection terminal, 5... Spacer, 7... Curved lead wire, 8... Curved solder, 10 ...Micro module wafer, 2o...dummy wafer.
Claims (2)
るマイクロモジュールウェハと、そのマイクロモジュー
ルウェハと同様の形状を有するも回路素子および接続端
子は有しないダミーウェハとを、それらの間にスペーサ
を介在して接着剤で一体的に結合したことを特徴とする
マイクロモジュールブロック。(1) A micromodule wafer that has circuit elements on its main surface and connection terminals on the periphery, and a dummy wafer that has a similar shape to the micromodule wafer but does not have circuit elements or connection terminals, are placed between them. A micro module block characterized by being integrally joined with adhesive with a spacer interposed between the two.
て、前記ダミーウェハとして、−金属部材の表面を電気
的に絶縁処理したものを用いたことを特徴とするマイク
ロモジュールブロック。(2) Utility Model Registration The micro module block according to claim (1), characterized in that the dummy wafer is a metal member whose surface has been electrically insulated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10837281U JPS5812930U (en) | 1981-07-20 | 1981-07-20 | micro module block |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10837281U JPS5812930U (en) | 1981-07-20 | 1981-07-20 | micro module block |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5812930U true JPS5812930U (en) | 1983-01-27 |
Family
ID=29902780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10837281U Pending JPS5812930U (en) | 1981-07-20 | 1981-07-20 | micro module block |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5812930U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS445824Y1 (en) * | 1966-12-07 | 1969-03-03 |
-
1981
- 1981-07-20 JP JP10837281U patent/JPS5812930U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS445824Y1 (en) * | 1966-12-07 | 1969-03-03 |
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