JPS58128748A - 半導体素子のリ−ド部材の接続方法 - Google Patents

半導体素子のリ−ド部材の接続方法

Info

Publication number
JPS58128748A
JPS58128748A JP57012123A JP1212382A JPS58128748A JP S58128748 A JPS58128748 A JP S58128748A JP 57012123 A JP57012123 A JP 57012123A JP 1212382 A JP1212382 A JP 1212382A JP S58128748 A JPS58128748 A JP S58128748A
Authority
JP
Japan
Prior art keywords
solder
lead member
piece
lead
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57012123A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0135498B2 (cg-RX-API-DMAC10.html
Inventor
Shigemi Ono
小野　重美
Susumu Akiyama
進 秋山
Shigeo Shimada
島田　繁夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP57012123A priority Critical patent/JPS58128748A/ja
Publication of JPS58128748A publication Critical patent/JPS58128748A/ja
Publication of JPH0135498B2 publication Critical patent/JPH0135498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5449—
    • H10W72/5475—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP57012123A 1982-01-28 1982-01-28 半導体素子のリ−ド部材の接続方法 Granted JPS58128748A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57012123A JPS58128748A (ja) 1982-01-28 1982-01-28 半導体素子のリ−ド部材の接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57012123A JPS58128748A (ja) 1982-01-28 1982-01-28 半導体素子のリ−ド部材の接続方法

Publications (2)

Publication Number Publication Date
JPS58128748A true JPS58128748A (ja) 1983-08-01
JPH0135498B2 JPH0135498B2 (cg-RX-API-DMAC10.html) 1989-07-25

Family

ID=11796757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57012123A Granted JPS58128748A (ja) 1982-01-28 1982-01-28 半導体素子のリ−ド部材の接続方法

Country Status (1)

Country Link
JP (1) JPS58128748A (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPH0135498B2 (cg-RX-API-DMAC10.html) 1989-07-25

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