JPS58125879A - Solid element and solid element array - Google Patents
Solid element and solid element arrayInfo
- Publication number
- JPS58125879A JPS58125879A JP57008367A JP836782A JPS58125879A JP S58125879 A JPS58125879 A JP S58125879A JP 57008367 A JP57008367 A JP 57008367A JP 836782 A JP836782 A JP 836782A JP S58125879 A JPS58125879 A JP S58125879A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- elements
- functional parts
- state
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は固体素子及び固体素子アレイに関するものであ
り、固体素子の機能部を、固体素子間においても直線性
よく配列させることができるようにすることを目的とす
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to solid-state devices and solid-state device arrays, and an object of the present invention is to enable functional parts of solid-state devices to be arranged with good linearity even between solid-state devices.
第１図（ハ））、 （Ｂ）は、従来の固体発光素子及び
固体発光素子アレイの構成を示す図であって、第１図（
へ）に示すように、従来の固体発光素子１の形状は、長
方形又は正ノＪ形を呈しており、俵数個の機能部２は素
子１の中心線３上に配列されている。なお、６は素子１
の裏面に形成された共通′電極である。FIGS. 1(c) and 1(B) are diagrams showing the configurations of conventional solid-state light emitting devices and solid-state light emitting device arrays, and FIG.
As shown in FIG. 1), the conventional solid-state light emitting device 1 has a rectangular or regular J-shaped shape, and several functional parts 2 are arranged on the center line 3 of the device 1. Note that 6 is element 1
This is a common electrode formed on the back surface of the
このような固体発光素子１の多数個は、第１図（Ｂ）に
示すように、機能部２がすべて同一直線上に並ぶように
、取付基板４上に直線状に配列され、固体発光素子アレ
イを形成する。このとき、固体発光素子１間の間隔ａは
、機能部２の間隔す、が、固体発光素子１上の機能部２
の間隔ｂ２に一致するように、所定の間隔をあけて、固
定されなければいけない。このように、間隔ａをあける
ことにより、素子１裏面の共通成極６を接触させずに、
配線の少ないマトリックス駆動が可能となる。なお、６
は共通電極からのリート線である。ところが、従来では
、固体素子間の機能部の直線性及び、 ′固体素子間
の機能部の間隔を正確にばわ仕るためには、目分祉で行
なうか、又は顕微鏡により、１素子ずつ位置合わせを行
なう必・及があり、正確性、と量産性に欠けるものであ
」た。As shown in FIG. 1(B), a large number of such solid-state light emitting devices 1 are linearly arranged on the mounting board 4 so that the functional parts 2 are all lined up on the same straight line. form an array. At this time, the interval a between the solid-state light emitting elements 1 is the interval between the functional parts 2, and the interval a between the functional parts 2 on the solid-state light emitting elements 1 is
must be fixed at a predetermined interval so as to match the interval b2. In this way, by creating the interval a, the common polarization 6 on the back surface of the element 1 is not brought into contact with each other.
Matrix drive with less wiring becomes possible. In addition, 6
is the Riet wire from the common electrode. However, in the past, in order to accurately control the linearity of the functional parts between solid-state elements and the spacing between the functional parts between solid-state elements, it was necessary to measure each element one by one by eye or with a microscope. It is necessary to carry out positioning, which results in a lack of accuracy and mass production.
本発明は、以上のような従来の欠点を解決する
・だめになされたもので、簡単に隣接する素子間の寸法
精度及び、直線性を確保しながら、多数個の固体素子を
容易に固定できるようにすることを目的としたものであ
る。The present invention solves the above-mentioned conventional drawbacks.
- It was made in vain, and its purpose was to easily fix a large number of solid-state devices while ensuring dimensional accuracy and linearity between adjacent devices.
この目的を達成するために、本発明では、固体素子の機
能部を中心線からずらして形成し、複数個の固体素子を
千鳥状に配置するようにしたものである。In order to achieve this object, in the present invention, the functional parts of the solid-state elements are formed offset from the center line, and a plurality of solid-state elements are arranged in a staggered manner.
以下に本発明の一実施例を図面を用いて説明する。An embodiment of the present invention will be described below with reference to the drawings.
なお固体素子としては、発光素子（ＬＥＤ）を例として
説明する。第２図は本発明の固体素子の一実施例を示す
斜視図である。素子基板１０上には、複数個の機能部１
１が、素子基板１ｏの中心線１２からずれた位置に直線
状に形成されている。機能部１１０表面側には、アノー
ド電極１３がそれぞれ接続されており、機能部１１の裏
面側には、カソード電極１４がすべての機能部に共通に
接続されている。機能部１１間のピッチは等間隔すに配
置されている。Note that a light emitting device (LED) will be described as an example of the solid state device. FIG. 2 is a perspective view showing an embodiment of the solid-state device of the present invention. On the element substrate 10, a plurality of functional units 1 are provided.
1 is formed in a straight line at a position offset from the center line 12 of the element substrate 1o. Anode electrodes 13 are respectively connected to the front surface of the functional section 110, and a cathode electrode 14 is commonly connected to all the functional sections on the back surface of the functional section 11. The pitches between the functional parts 11 are arranged at equal intervals.
第３図は、本発明の固体素子アレイの一実施例を示す斜
視図である。第２図で示した固体発光素子１０の多数個
が各機能部１１が直線状ＶＣなるように、取付基板１６
上に、カソード電極１４が電極１７に接触するように、
千鳥状配置されている。FIG. 3 is a perspective view showing an embodiment of the solid state device array of the present invention. A large number of solid-state light emitting devices 10 shown in FIG.
At the top, so that the cathode electrode 14 contacts the electrode 17,
They are arranged in a staggered manner.
また、各固体発光素子１ｏの間隔は、直線上にならんだ
それぞれの機能部１１の間隔がｂに一致するように所定
の間隔ａをあけている。Further, the intervals between the solid-state light emitting elements 1o are set at a predetermined interval a such that the interval between the respective functional parts 11 arranged on a straight line corresponds to the interval b.
第４図は、本発明を実施する際に用いられる治具を示す
斜視図である。治具１８は、ステンレス等の金属もしく
は光感光ガラス等の薄板のエツチノグ等により、アレイ
の必要とする精度に加工され、素子の挿入位置を規制す
るだめの挿入孔１９を有する。各挿入孔１９の端面２０
は、素子を挿入した際に当接せしめて、各素子間の間隔
を所蛾の大きさａに設定するだめのものであり、隣接す
る挿入孔１９の端面２ｏの間隔は所定の大きさｄを有し
ている。FIG. 4 is a perspective view showing a jig used in carrying out the present invention. The jig 18 is made of metal such as stainless steel or a thin plate of photosensitive glass or the like and is machined to the precision required for the array, and has an insertion hole 19 for regulating the insertion position of the element. End face 20 of each insertion hole 19
are used to set the distance between each element to a predetermined size a by bringing the elements into contact when inserted, and the distance between the end surfaces 2o of adjacent insertion holes 19 to be a predetermined size d. have.
このような治具１８を用いて、第３図に示す固体素子ア
レイを得るには、まず第３図に示す、カソードのリード
電極１７が所定間隔に表面に形成された取付基板１６を
用意する。その後、第４図に示す治具１８を、挿入孔１
９がリード電極１７に対応するように、取付基板１６上
に設置する。In order to obtain the solid-state element array shown in FIG. 3 using such a jig 18, first prepare the mounting substrate 16 shown in FIG. 3, on which cathode lead electrodes 17 are formed at predetermined intervals. . Thereafter, the jig 18 shown in FIG. 4 is inserted into the insertion hole 1.
It is installed on the mounting board 16 so that 9 corresponds to the lead electrode 17.
その後、第２図に示す固体素子１ｏのカソード電極１４
表面に導電性接着剤を付着し、取付基板１６上の治具１
８の挿入孔１９内に、この固体素子１゜を端面２ｏに当
接せしめて挿入固着する。この時、当接する端面２０は
、各挿入孔１９において、同じ側にある端面とする。そ
の後、取付基板１６及び固体素子１ｏを加熱することに
より、両者の固着を完了する。After that, the cathode electrode 14 of the solid state element 1o shown in FIG.
A conductive adhesive is attached to the surface of the jig 1 on the mounting board 16.
This solid element 1° is inserted and fixed into the insertion hole 19 of 8 by bringing it into contact with the end surface 2o. At this time, the end surfaces 20 that come into contact are the end surfaces on the same side of each insertion hole 19 . Thereafter, by heating the mounting substrate 16 and the solid-state element 1o, the fixation of both is completed.
治具１８の挿入孔１９の端面２０の間隔ｄは、固体素子
１０間の間隔ａに一致させると、挿入孔１９に固体素子
１０を挿入するのが困難になるため、ｄくａと設定する
のが良い０例えば、機能部１１の間隔すを１２６μｍと
する場合、端面２０の間隔ｄは３０μｍに設定できる。The distance d between the end surfaces 20 of the insertion holes 19 of the jig 18 is set to d × a because if it matches the distance a between the solid elements 10, it will be difficult to insert the solid elements 10 into the insertion holes 19. For example, when the distance between the functional parts 11 is set to 126 μm, the distance d between the end faces 20 can be set to 30 μm.
一般に、固体素子の大きさや、各固体素子上の機能部の
位置は再現性良く得ることができる。したがって、上記
のような冶具を用いて、各固体素子を千鳥状に配列する
ことにより、各固体素子間における機能部の直線性を確
保し、高精度にピッチを得ることができる。Generally, the size of a solid-state element and the position of a functional part on each solid-state element can be obtained with good reproducibility. Therefore, by arranging the solid elements in a staggered manner using the jig as described above, the linearity of the functional parts between the solid elements can be ensured and the pitch can be obtained with high precision.
以上説明したように、本発明は、素子の機能部を固体素
子の中心線よりずらせた位置に形成し、このような固体
素子を千鳥状に配列して固体素子アレイを構成すること
により、各素子間の機能部を直線状に配列するのが容易
に行なえ、壕だ各素子間の機能部の間隔を素子内の機能
部の間隔に一致させることが容易に行なえる０As explained above, in the present invention, the functional parts of the elements are formed at positions shifted from the center line of the solid-state elements, and such solid-state elements are arranged in a staggered manner to form a solid-state element array. The functional parts between the elements can be easily arranged in a straight line, and the interval between the functional parts between each element can be easily matched with the interval between the functional parts within the element.
【図面の簡単な説明】
第１図（Ａ）、Φ）は従来の発光素子及び発光素子アレ
イをそれぞれ示す斜視図、第２図、および第３図は本発
明の固体素子及び固体素子アレイの一実施例をそれぞれ
示す斜視図、第４図は固体素子アレイ作成の為の治具の
斜視図である。
１．１０・・・・・固体素ｆ、１１・・・・・機能部、
１３・・・・・・アノード電極、１４・・・・・・カソ
ード電事、１６−−−・−・取付基板、１７・・・・・
・リード電極、１８・・−・・−治具、１９・・・・・
・挿入孔。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
（，４）
（Ｂ）？
１Ｎ２図[BRIEF DESCRIPTION OF THE DRAWINGS] FIGS. 1(A) and Φ) are perspective views showing a conventional light emitting device and a conventional light emitting device array, respectively, and FIGS. 2 and 3 are perspective views of a solid state device and a solid state device array of the present invention. FIG. 4 is a perspective view showing one embodiment, and FIG. 4 is a perspective view of a jig for producing a solid-state element array. 1.10... solid element f, 11... functional part,
13...Anode electrode, 14...Cathode electrical equipment, 16----...Mounting board, 17...
・Lead electrode, 18...-Jig, 19...
・Insertion hole. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure (,4)
(B)? 1N2 diagram
Claims (1)
中心線から離間した位置に直線上に形成したことを特徴
とする固体素子。 （２）素子基板上に複数個の機能部が、前記素子基板の
中心線から離間した位置に直線上に形成されてなる多数
個の固体素子を、前記各固体素子間で前記機能部が直線
上になるように千鳥状に配置したことを特徴とする固体
素子アレイ０[Scope of Claims] (2) A solid-state element characterized in that a plurality of functional parts are formed on an element substrate in a straight line at positions spaced apart from the center line of the element substrate. A large number of solid-state elements each having a plurality of functional parts formed on a straight line at positions spaced apart from the center line of the element substrate are arranged in a staggered manner so that the functional parts are on a straight line between the solid-state elements. A solid-state element array 0 characterized in that it is arranged in
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57008367A JPS58125879A (en) | 1982-01-21 | 1982-01-21 | Solid element and solid element array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57008367A JPS58125879A (en) | 1982-01-21 | 1982-01-21 | Solid element and solid element array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58125879A true JPS58125879A (en) | 1983-07-27 |
| JPH0341990B2 JPH0341990B2 (en) | 1991-06-25 |
Family
ID=11691263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57008367A Granted JPS58125879A (en) | 1982-01-21 | 1982-01-21 | Solid element and solid element array |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58125879A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS615710A (en) * | 1984-06-19 | 1986-01-11 | ヤンマー農機株式会社 | Seedling planting device of rice planter |
| US4605944A (en) * | 1984-09-11 | 1986-08-12 | Sanyo Electric Co., Ltd. | LED array device for printer |
| EP0872892A2 (en) * | 1997-04-14 | 1998-10-21 | Oki Electric Industry Co., Ltd. | LED array and printer for an electrophotographic printer with said LED array |
| EP0908953A1 (en) * | 1996-04-19 | 1999-04-14 | Oki Electric Industry Co., Ltd. | Light emitting element module and chip |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101288693B1 (en) * | 2012-05-23 | 2013-07-22 | 전북대학교산학협력단 | Simulator |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57178386A (en) * | 1981-04-27 | 1982-11-02 | Stanley Electric Co Ltd | Light emitting diode |
-
1982
- 1982-01-21 JP JP57008367A patent/JPS58125879A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57178386A (en) * | 1981-04-27 | 1982-11-02 | Stanley Electric Co Ltd | Light emitting diode |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS615710A (en) * | 1984-06-19 | 1986-01-11 | ヤンマー農機株式会社 | Seedling planting device of rice planter |
| JPH0620369B2 (en) * | 1984-06-19 | 1994-03-23 | ヤンマー農機株式会社 | Rice planting equipment for rice transplanters |
| US4605944A (en) * | 1984-09-11 | 1986-08-12 | Sanyo Electric Co., Ltd. | LED array device for printer |
| EP0908953A1 (en) * | 1996-04-19 | 1999-04-14 | Oki Electric Industry Co., Ltd. | Light emitting element module and chip |
| EP0872892A2 (en) * | 1997-04-14 | 1998-10-21 | Oki Electric Industry Co., Ltd. | LED array and printer for an electrophotographic printer with said LED array |
| EP0872892A3 (en) * | 1997-04-14 | 2000-07-05 | Oki Data Corporation | LED array and printer for an electrophotographic printer with said LED array |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0341990B2 (en) | 1991-06-25 |
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