JPS59145580A - Array of solid-state element - Google Patents

Abstract

PURPOSE:To ensure the dimensional accuracy of a function section even when a large number of solid-state element arrays are arranged by projecting sections by disposing and fixing a plurality of solid-state elements on a mounting substrate with predetermined dimensional accuracy while projecting the end sections of the solid-state elements at least one ends from the end surface of the mounting substrate. CONSTITUTION:A plurality of function sections 2 are formed rectilinearly on the surface of a solid-state element 1. Anode electrodes 6 are connected to the surface sections of the function sections 2, and a cathode electrode 3 is connected in common with all the function sections on the back side. A plurality of the solid-state elements 1 are fixed on a mounting substrate 4 so that all the function sections 2 are arranged rectilinearly. The solid-state elements are disposed at regular intervals (a) so that pitches among the function sections 2 are brought to regular intervals b1=b2. The solid-state elements 1 positioned at both ends are formed so that the end surfaces of the elements 1 are brought to the state in which the end surfaces are projected only by a distance (c) from the end surfaces of the mounting substrate 4, and an arbitrary long-sized solid-state element array is obtained by arbitrarily arranging and assembling a plurality of solid- state element arrays 7 as the reference.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an elongated solid-state element array made up of a large number of solid-state elements such as LEDs arranged in crystalline form.

Structure and Problems of Conventional Example FIG. 1 is a diagram showing the structure of a conventional solid-state element array. The functional part 2 is the solid state element 1
are arranged linearly on the surface. Note that 3 is a common electrode formed on the back surface of the solid-state element 1. A large number of such solid-state devices 1 are linearly arranged on the receiving substrate 4 so that the functional parts 2 are all lined up on the same straight line to form a solid-state device array. At this time, the interval a between the solid elements 1 must be fixed at a predetermined interval so that the interval b1 between the functional parts 2 matches the interval b2 between the functional parts 2 of the solid element 1. By providing the interval a in this manner, matrix driving with fewer wirings is possible without bringing the common electrodes 3 on the back surfaces of adjacent solid-state elements 1 into contact with each other. Note that 5 is a wire 1 from the common electrode 3.

However, in the past, when creating a solid-state element array of a predetermined length (d), the required number of solid-state elements 1 was directly arrayed and fixed on a mounting board 4 of a predetermined length. However, in order to ensure the accuracy described above and to assemble with all functional parts operating normally, the jigs and tools were long, and accuracy and mass production were lacking. Due to variations in characteristics, even if some of the elements were to be repaired or replaced, all of them had to be replaced, making handling difficult.

Purpose of the Invention The present invention has been made to solve the above-mentioned conventional drawbacks, and it is possible to easily form a solid-state element array of any length while ensuring dimensional accuracy and linearity between adjacent elements. The objective is to provide a solid-state device array that can be fabricated.

Structure of the Invention In order to achieve this object, in the present invention, a plurality of solid elements are arranged and fixed on a machining board with predetermined dimensional accuracy, and at least one end of the solid element is placed closer to the end of the mounting board. This protrusion ensures the dimensional accuracy of the functional section even if a large number of solid state element arrays are arranged.

Description of examples An embodiment of the present invention will be described below with reference to the drawings.

Note that a light emitting element (LELI') will be described as an example of the solid-state element. FIG. 2 is a perspective view showing an embodiment of the solid state device array of the present invention. A plurality of functional parts 2 are formed in a linear shape on the surface of the solid-state element 1. Anode electrodes 6 are respectively connected to the front side of the functional section 2, and cathode electrodes 3 are connected to all the functional sections in common to the back side.

A plurality of solid-state elements 1 are fixed on a mounting substrate 4 so that all functional parts 2 are linear.

The pitch between the functional parts 2 is a predetermined interval a such that the pitch is equal between b1 and b2. The ends of the solid-state elements 1 located at both ends are formed to protrude by a dimension C from the ends of the substrate 4 in some cases, and by arbitrarily arranging and assembling a plurality of solid-state element arrays 7 that serve as a reference, , an arbitrary elongated solid-state device array can be obtained.

FIG. 3 is a perspective view showing an embodiment of a long solid-state device array using the solid-state device array of the present invention. A large number of reference solid-state element arrays 7 shown in FIG.
It is fixed on the assembly board 8 with screws 9, adhesive, etc. so that it is on a straight line. The distance between the solid-state light emitting elements 10 is such that the distance between the functional parts 20 arranged in a straight line corresponds to b.V? -r'A A fixed interval a is left.

Therefore, by assembling the necessary number of standard solid-state device arrays 7 whose characteristics have been measured in advance, a long solid-state device array of any length can be efficiently produced.

That is, by making the end portions of the solid-state devices 1 located at both ends protrude from the end surface of the mounting substrate 4, when fixing a large number of solid-state device arrays 7, which serve as references, to the assembly substrate 8'',
Even if the end face is slightly uneven or sloped, the pitch between the functional parts 2 can be accurately adjusted based only on the actual dimensions of the ends of the solid-state element 1 without being affected by the end face V of the mounting board 4. It can be well secured. Since the functional part 2 on the solid-state element 1 is measured in units of several hundred μm, the smoothness of the end face of the mounting board 4 or the level difference seen from the end face of the bonded part between the mounting board 4 and the solid-state element 1, etc. When the arrays 7 are lined up and fixed, the pitch of the functional parts 2 between the solid-state element arrays 7 is affected1, but in this embodiment, these do not pose any problems and an efficient solid-state element array can be realized. Can be placed.

In reality, if the length of the standard solid-state array γ is 8 elements and 32M, a long solid-state array of 256 mnb in 84 size can be assembled by assembling 8 units of the standard solid-state array 7. Good 0 Furthermore, according to this embodiment, since it is only necessary to make a solid-state element array as a reference, there is no need to use large jigs and tools for assembling everything, and it is easy to mass-produce. Even if there are irregularities in the characteristics, it is sufficient to simply replace the corresponding solid-state element array γ, and handling is easy.

In addition, in the above embodiment, the solid elements 1 located at both ends are made to protrude beyond the mounting substrate 4, but the present invention is not limited to this, and the same effect can be obtained by simply making the solid elements 1 located at at least one end protrude. As described in detail, according to the present invention, a plurality of solid elements are arranged and fixed on a mounting board with predetermined dimensional accuracy, and at least one end of the solid element is made to protrude from the end surface of the mounting board. Therefore, it is possible to obtain a long solid-state element array with high linear accuracy and spacing accuracy between the functional parts between a large number of solid-state elements. Furthermore, since a single solid-state element array is not long, it does not require large jigs and tools during manufacturing, making it highly suitable for mass production, and it is easy to repair even if the characteristics of the solid-state elements vary. be.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a conventional solid-state device array, FIG. 2 is a perspective view showing an embodiment of the solid-state device array of the present invention, and FIG.
The figure is a perspective view showing a long solid-state device array using the same embodiment. 1. Solid-state device, 2-. Functional part, 3. Cando electrode, 4. Some examples of substrate, 5. Reed electrode, 6. Anode electrode, 7. Solid-state device array, 8. Assembly board, 9.
assembly screws. Name of agent: Patent attorney Toshio Nakao and 1 other person
1 figure

Claims (1)

[Claims] A large number of solid-state elements each having a plurality of functional parts linearly formed on the surface thereof are installed on a mounting board so that the functional parts are linear, and at least an end of the solid-state element of i'1fii is installed. The solid-state element array 0 is characterized in that it projects from the end surface of the mounting substrate.