JPH0251882A - Connection socket and contact pin used therefor and manufacture thereof - Google Patents

Abstract

PURPOSE:To make densification and mult-arrangement of contact pins possible as their durability, etc., are left as they are by covering a part of the base and the arm of at least one side of a contact pin with insulating film. CONSTITUTION:A contact pin 1 formed of a plate-like conductive material is made up of a base 2 for making it to be fixed at a socket proper, a connection terminal 3 extending from an end of the base 2, an arm 4 coupled to the base 2 through a spring 5 and a contact piece 6 formed at the tip of the arm 4, and non-conductive plastic material with high heat resistance is applied to a part of the base 2 and the arm 4 on one side of the contact pin 1 to form insulating films 7 and 7'. That is, the insulating films 7 and 7' are provided between respective central pins 1, so that adjacent contact pins 1 do not come into electrical contact with each other and also that interval is kept constant and the respective contact pins 1 are rightly positioned. Resultantly, it is possible to densify the contact pins 1 as their durability due to mechanical strength, etc., is kept unchanged.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a connection socket used for connecting various electronic components such as an IC puff cage and a connection circuit, and a contact pin used therein.

[Prior art and problems to be solved by the invention] Figures 8 and 9 show ICs for conventional flat type IC pancakes.
Although an example of a socket is shown in the figure, a plurality of contact pins 22 are arranged in a socket body 21, and each contact pin 22 is partitioned from each other by a partition wall 23. In such an IC socket, when the IC package P is accommodated in the socket body 21, each lead terminal comes into contact with the contact pin 22, and when the IC socket is mounted on a printed wiring board (not shown) or the like, the IC is removed. The package P is electrically connected to an external connection circuit. By the way, the partition wall 23 is provided to position the contact pins 22, prevent them from bending, and prevent them from coming into contact with each other.
Since a large number of contact pins 22 are interposed between each partition wall 23 as described above, a large number of contact pins 22 can be aligned correctly, and thereby the IC
This allows proper electrical connection between the pan cage P and the external connection circuit.

On the other hand, in recent years, as IC puff cages have become smaller, the density of lead terminals has increased, and the number of lead terminals themselves has also tended to increase. This necessitates a high-density arrangement of a large number of contact pins. Therefore, in order to realize an IC socket having such a high-density array of contact pins, it is conceivable to reduce the pitch between the contact pins to about 0.3fi and to reduce the thickness of the contact pins. In that case, there are problems such as not only the strength of the contact pin becomes weak and bending and deformation easily occurs, but also the contact pressure for electrical connection becomes insufficient and the durability is significantly reduced. Further, when the thickness of the partition wall is reduced, it becomes difficult to process the portion corresponding to the partition wall in manufacturing a mold, and the durability of the partition wall itself is reduced.

In view of the above circumstances, it is an object of the present invention to provide a connection socket of this type that can particularly increase the density of contact pins and enable a large number of contact pins to be arranged while maintaining the durability of the contact pins.

(Means and effects for solving problem i1) In the connection socket according to the present invention, the contact pins are arranged in a row in direct contact with each other in a mutually insulated state through an insulating film formed on the side surface of the contact pins. Walls are no longer required, and therefore contact pins can be arranged in high density. Furthermore, since the arranged contact pins are regulated by the regulating portion of the socket body, the contact pins can be correctly positioned and the accuracy of the arrangement can be maintained. On the other hand, the contact pin itself has an insulating film formed on a predetermined part of the plate-shaped side surface, and since the IBI thickness can be easily made thin and uniform, it is possible to ensure a sufficient thickness of the contact pin. and can be arranged at small pitches in the socket body. One of the contact pins! This can be done by punching out a strip-shaped material on which an insulating film has been formed in advance, which is bulky and efficient.

〔Example〕

Hereinafter, a first embodiment of the contact pin according to the present invention will be explained based on FIGS. 1 and 2. In the figures, l is the thickness of a plate-shaped conductive material such as beryllium copper plated with gold.
．． A contact pin 2 formed of a material of about 1 to 0.4 fl is seated on a socket body (not shown) with its lower end surface, and the contact pin 1 is fixed to the socket body.
A base 3 extends from one end of the base 2 and is provided in the socket body through insertion holes (not shown, but formed at regular intervals in accordance with the pitch at which the contact pins 1 are to be arranged in rows). The connecting terminal part 4 is connected to the base part 2 via a spring part 5, and is inserted into the base part 2 through the spring part 5, and is inserted in the direction of the arrow A by the elasticity of the spring part 5. an arm that can be displaced by
A contact piece 7 is formed at the tip of the arm 4 and is to come into contact with, for example, a lead terminal of an IC puff cage (see FIG. 8).
7' is a non-conductive, highly heat-resistant plastic material coated on a portion of the base 2 and arm 4 on one side of the contact pin l, for example, O, 1 to 0.2f.
It is an insulating thin film that is coated to a uniform thickness of approximately 1.

Further, referring to FIG. 2, the method for manufacturing the contact pin 1 will be described. Reference numeral 8 denotes a strip-shaped plate material made of helium copper to form the contact pin 1, and 9.9'
is the longitudinal direction of the plate 8 corresponding to the base 2 and the arm 4 in order to form the insulating thin film 7,7' of the contact pin 1 (indicated by the two-dot chain line) to be formed from the plate 8. This is an insulating coating formed by a method such as the above-mentioned coating. The contact pin 1 shown in FIG. 1 is formed from the plate material 8 on which the insulating coating 9 is formed by punching using a press or the like.

In the contact pin 1 thus constructed, the connection terminal portion 3 is inserted into the insertion hole of the socket body described above and arranged in a row at a constant pitch in the socket body. Since adjacent contact pins 1 are not in electrical contact with each other and the distance between them is maintained constant, correct positioning of each contact pin 1 is performed. In this way, contact pin 1 is
Correct positioning and proper electrical connection can be performed without using the partition wall described in the conventional example, but the pitch between the contact pins 1 arranged in a row can be reduced by the amount of such partition wall removed, and Insulating thin film 7
．． Since the film 7' is relatively thin and its thickness can be easily made uniform, a thickness sufficient for strength can be ensured as the plate thickness of the contact pin 1 itself. Therefore, it is possible to increase the density of the contact pins I while maintaining durability due to mechanical strength and the like.

FIG. 3 shows a second embodiment of the contact pin.

In this example, overhanging portions 2 as regulated portions are provided at both ends of the base 2.
a, 2b are formed, and these overhanging parts 2a,
An insulating thin film 7 is formed on 2b as in the first embodiment. FIG. 4 shows an example of a connection socket in which such contact pins 1' are suitably used, and the case for an IC package shown in the conventional example will be explained. Contact pin (1'
) are arranged every fifth. The above-mentioned overhang part 2a,
Both side surfaces (the regulating part II side sandwiches the insulating thin film 7) are held by the first regulating part 11.11' which is vertically arranged in the socket main body 10 in the form of a column, and the overhanging part 2b is
It fits into a second regulating part 12 formed in a groove shape on the peripheral wall of the socket body 10. Contact pin 1 like this
By engaging with the first and second regulating portions 11, 11' and 12, it is regulated to be correctly positioned on the socket body 10, but this further improves its positioning with respect to the contact pin l. Therefore, sufficient positional accuracy can be ensured for the contact pins 1, 1' arranged in a row as a whole. When an electronic component such as an IC pancake is attached to the socket body 10 during actual use, the contact piece portion 6 of the contact pin l (1') is pushed down by the lead terminal of the 3g IC package. Since the portions 6 are pushed down all at once, the adjacent arm portions 4 on which the insulating thin film 7'' is formed will not be significantly displaced from each other, and therefore, not only will there be no risk of wear due to such displacement, but the electrical However, a short circuit will not occur between the contact pins 1 (1'). Therefore, it is sufficient that the insulating thin film 11'17' (7) has at least insulation and heat resistance. It is also extremely advantageous in terms of selection.In a connection socket using contact pins 1.1 and 71.1' as in this example, the positional accuracy of these contacts and 71.1' is significantly improved. As in the example, since no partition wall is used, it is possible to arrange the contact pins 1.1' at a higher density.In addition, the intervals at which the contact pins l' are arranged can be determined as appropriate in addition to the above cases. Also, in this embodiment, instead of the columnar body of the first regulating part 11.II', a protruding body integral with the socket main body is provided as shown by the dashed line in FIG. 4, and the protruding body A groove similar to the groove-shaped regulating portion 12 may be formed in the portion and the fitting may be restricted by the groove.

FIG. 5 shows a modification of the contact pin 1'. In this example, a protrusion 6a is formed at the base of the contact piece 6, and the first regulating part 11.11 is erected up to the height of the protrusion 6a.

Since the first regulating portion 11.11' is adapted to regulate both the projecting portion 2a and the projecting portion 6a, the positional accuracy with respect to the contact pin ]' can be further improved. In this case as well, the restricting portions 11.11' may have a groove configuration of a protruding body as described above instead of a columnar body.

FIG. 6 shows another modification of the contact pin 1''. In this example, a protruding part 4a is formed on the side of the arm part 4, and the groove of the second regulating part 12 fits into both the protruding part 2b and this protruding part 4a, and the first Ml, the split parts 11, 11 and the second regulating part 12 regulate the overhanging part 2a, the protruding part 6a, the overhanging part 2b, and the protruding part 4a, respectively, so that the positional accuracy of the contact pins 1, 1' is further ensured. It is maintained. In this case, the conductive structure on the columnar body 11.11 side is also possible. FIG. 7 shows a plate material 8° and an insulating liquid 1119 for manufacturing the contact pin 1'.
9' is shown, except that an insulating coating 9' is formed on the portions corresponding to the arm portion 4 and the protruding portions 4a, 6a. Since this is the same as that shown in FIG. 2, a description thereof will be omitted.

The contact pins 1 (1') in each of the above embodiments are individually punched out in advance, or punched out from the plate material 8 leaving only a portion separated, and then the insulating film M7.
Alternatively, an insulating thin film 7.7 may be formed.
′ may be formed by applying a non-conductive heat-resistant paint using the ion-blating method, or may be formed by pasting an insulating tape, but in either case, contact pins formed on both sides of the Such an insulating film M! Even if contact pins having no contact pins 1 and 1' are arranged alternately, the same effects as in the above embodiment can be obtained. When the number of contact pins 1 is small and the pitch when arranged in a row is relatively coarse, the thickness of the insulating thin film 7,7' may be set to 1 fi or more.

〔Effect of the invention〕

As described above, according to the present invention, since the contact pins can be arranged in a row at a small pitch, it is possible to effectively cope with increasing the density and miniaturizing the lead terminals of an IC package. Since positional accuracy can be easily maintained, reliable electrical connections can be made as this type of connection socket. Since contact pins can be manufactured by simply forming an insulating coating at a predetermined position on a plate material and then punching the pin, mass production can be easily realized. Since an insulating film having a uniform thickness can be easily formed on the contact pins, the positional accuracy of the contact pins arranged in the connection socket can be further improved. A connection socket using such a contact pin can completely eliminate the need for a partition wall, and as a result, the structure of its molding die is significantly simplified, which is extremely advantageous in terms of manufacturing costs. In the above explanation, the case of a socket for an IC package has been described as an example, but the connection socket and contact pin according to the present invention can be used, for example, to connect with a connection terminal of a liquid crystal display device or with a connection terminal on another electric circuit board. It goes without saying that the above-mentioned effects can be achieved by applying the present invention to connections such as the above.

[Brief explanation of the drawing]

FIG. 1 is a front view of a first embodiment of a contact pin of the present invention, FIG. 2 is a diagram illustrating the manufacturing process of forming the contact pin from a plate material, and FIG. 3 is a front view of a contact pin according to a second embodiment. 4 is a partial plan view of a connection socket comprising contact pins of the present invention arranged in rows, FIGS. 5 and 6 are front views showing modified examples of contact pins, and FIG. 8 and 9 are a perspective view and a vertical sectional view of a conventional connection socket for an IC pancase. ■・・・Contact pin, 2...Base, 3...
・Connection terminal part, 4...Arm part, 5...Spring part, 6
... Contact piece part, 7.7゛ ... Insulating yI film, 8.
... Plate material, 9 ... Insulating coating, 10 ... Socket body, 11, 11', 12 ... Regulation part. 1F5 figure fang 6 figure off figure f3 figure f4 figure

Claims (4)

[Claims] (1) A connecting terminal portion extending from the base, an arm portion extending to the side opposite to the terminal portion and connecting to the base portion via a spring portion, and a connecting piece portion formed at the tip of the arm portion. In a contact pin formed of a plate-shaped conductive material,
A contact pin characterized in that a portion of the base portion and the arm portion on at least one side surface are covered with an insulating film. (2) In a connection socket that is configured to electrically connect an electronic component mounted on the socket body with a connection circuit through multiple rows of contact pins, the contact pins are connected to an insulating film formed on the side surface of the socket. A connection socket using contact pins according to claim 1, wherein the contact pins are arranged in a row in contact with each other in an insulated state through the contact pins. (3) Positioning of each of the contact pins is performed by forming a regulated part at every predetermined number of contact pins arranged in a row on the socket body, and regulating the regulated part by a regulating part provided on the socket body. The connection socket according to claim 2, characterized in that the connection socket is configured to: (4) After forming an insulating film on the band-shaped conductive material or by pre-punching the material and coating the parts corresponding to the base and arm parts of the contact pin to be formed, the band-shaped material or the preliminary punching is performed. A contact pin manufacturing method that involves punching or cutting a punched material into the shape of a contact pin.