JPH0341990B2 - - Google Patents
Info
- Publication number
- JPH0341990B2 JPH0341990B2 JP836782A JP836782A JPH0341990B2 JP H0341990 B2 JPH0341990 B2 JP H0341990B2 JP 836782 A JP836782 A JP 836782A JP 836782 A JP836782 A JP 836782A JP H0341990 B2 JPH0341990 B2 JP H0341990B2
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state
- functional parts
- jig
- functional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003780 insertion Methods 0.000 claims description 12
- 230000037431 insertion Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011295 pitch Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006089 photosensitive glass Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
【発明の詳細な説明】
本発明は固体素子アレイの製造方法に関するも
のであり、固体素子の機能部を、固体素子間にお
いても直線性よく高精度のピツチで配列させるこ
とができるようにすることを目的とする。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a solid-state element array, and it is an object of the present invention to enable functional parts of solid-state elements to be arranged at a highly accurate pitch with good linearity even between the solid-state elements. With the goal.
第１図Ａ，Ｂは、従来の固体発光素子及び固体
発光素子アレイの構成を示す図であつて、第１図
Ａに示すように、従来の固体発光素子１の形状
は、長方形又は正方形を呈しており、複数個の機
能部２は素子１の中心線３上に配列されている。
なお、５は素子１の裏面に形成された共通電極で
ある。このような固体発光素子１の多数個は、第
１図Ｂに示すように、機能部２がすべて同一直線
上に並ぶように、取付基板４上に直線状に配列さ
れ、固体発光素子アレイを形成する。このとき、
固体発光素子１間の間隔ａは、機能部２の間隔b1
が、固体発光素子１上の機能部２の間隔b2に一致
するように、所定の間隔をあけて、固定されなけ
ればいけない。このように、間隔ａをあけること
により、素子１裏面の共通電極５を接触させず
に、配線の少ないマトリツクス駆動が可能とな
る。なお、６は共通電極からのリード線である。
ところが、従来では、固体素子間の機能部の直線
性及び、固体素子間の機能部の間隔を正確に合わ
せるために治具を使用しようとしても、間隔ａが
数10μｍと小さいために機能部間に一定間隔を確
保するための境を有した治具の加工が困難であ
り、治具の使用は事実上不可能であつた。そのた
め、目分量で行なうか、又は顕微鏡により、１素
子ずつ位置合わせを行なう必要があり、正確性と
量産性に欠けるものであつた。 FIGS. 1A and 1B are diagrams showing the configurations of conventional solid-state light emitting devices and solid-state light emitting device arrays. As shown in FIG. 1A, the shape of the conventional solid-state light emitting device 1 is rectangular or square. The plurality of functional parts 2 are arranged on the center line 3 of the element 1.
Note that 5 is a common electrode formed on the back surface of the element 1. As shown in FIG. 1B, a large number of such solid-state light-emitting devices 1 are arranged linearly on a mounting board 4 so that all the functional parts 2 are lined up on the same straight line, thereby forming a solid-state light-emitting device array. Form. At this time,
The distance a between the solid-state light emitting elements 1 is the distance b 1 between the functional parts 2
must be fixed at a predetermined interval so as to correspond to the interval b2 of the functional parts 2 on the solid-state light emitting device 1. In this manner, by providing the interval a, matrix driving with fewer wirings is possible without contacting the common electrode 5 on the back surface of the element 1. Note that 6 is a lead wire from the common electrode.
However, in the past, even when attempting to use a jig to accurately adjust the linearity of the functional parts between solid-state elements and the spacing between the functional parts between solid-state elements, the spacing a was as small as several tens of micrometers, making it difficult to maintain the linearity between the functional parts. It is difficult to process a jig with boundaries to ensure a constant interval between the two, and the use of a jig is virtually impossible. Therefore, it is necessary to align each element one by one either by eye or by using a microscope, which lacks accuracy and mass productivity.
本発明は、以上のような従来の欠点を解決する
ためになされたもので、簡単に隣接する素子間の
寸法精度及び、直線性を確保すると共に、機能部
からの取出し線の短絡を防止しながら多数個の固
体素子を容易に固定できるなどの量産性の向上を
目的としたものである。 The present invention was made in order to solve the above-mentioned conventional drawbacks, and it easily ensures dimensional accuracy and linearity between adjacent elements, and prevents short circuits of lead wires from functional parts. However, the purpose is to improve mass productivity by making it possible to easily fix a large number of solid-state devices.
この目的を達成するために、本発明では、固体
素子の機能部を中心線からずらして形成し、連通
部を介して等ピツチで繰り返えされる千鳥状の挿
入孔を有する独自の治具を用いることにより、各
固体素子の機能部が直線状、且つ、等間隔に配置
される固体素子アレイの製造方法を可能としたも
のである。 To achieve this objective, the present invention uses a unique jig in which the functional part of the solid-state element is formed offset from the center line, and has staggered insertion holes that are repeated at equal pitches through the communication part. By using this method, it is possible to manufacture a solid-state device array in which the functional parts of each solid-state device are arranged linearly and at regular intervals.
以下に本発明の一実施例を図面を用いて説明す
る。 An embodiment of the present invention will be described below with reference to the drawings.
なお固体素子としては、発光素子（LED）を
例として説明する。第２図は本発明の固体素子の
一実施例を示す斜視図である。素子基板１０上に
は、複数個の機能部１１が、素子基板１０の中心
線１２からずれた位置に直線状に形成されてい
る。機能部１１の表面側には、アノード電極１３
がそれぞれ接続されており、機能部１１の裏面側
には、カソード電極１４がすべての機能部に共通
に接続されている。機能部１１の間隔ｂは等間隔
に配置されている。 Note that a light emitting device (LED) will be described as an example of the solid state device. FIG. 2 is a perspective view showing an embodiment of the solid-state device of the present invention. On the element substrate 10, a plurality of functional parts 11 are formed in a straight line at positions offset from the center line 12 of the element substrate 10. An anode electrode 13 is provided on the surface side of the functional section 11.
are connected to each other, and on the back side of the functional section 11, a cathode electrode 14 is commonly connected to all the functional sections. The intervals b of the functional parts 11 are arranged at equal intervals.
第３図は、本発明の製造方法により製造される
固体素子アレイの一実施例を示す斜視図である。
第２図で示した固体発光素子１０の多数個が各機
能部１１が直線状になるように、取付基板１６上
に、カソード電極１４が電極１７に接触するよう
に、千鳥状配置されている。また、各固体発光素
子１０の間隔は、直線上にならんだそれぞれの機
能部１１の間隔がｂに一致するように所定の間隔
ａをあけている。 FIG. 3 is a perspective view showing one embodiment of a solid-state device array manufactured by the manufacturing method of the present invention.
A large number of solid-state light emitting devices 10 shown in FIG. 2 are arranged in a staggered manner on a mounting board 16 so that each functional part 11 is linear and the cathode electrode 14 is in contact with the electrode 17. . Further, the intervals between the solid-state light emitting elements 10 are set at a predetermined interval a such that the interval between the respective functional parts 11 arranged on a straight line corresponds to the interval b.
第４図は、本発明を実施する際に用いられる治
具を示す斜視図である。治具１８は、ステンレス
等の金属もしくは光感光ガラス等の薄板のエツチ
ング等により、アレイの必要とする精度に加工さ
れ、素子の挿入位置を規制するための挿入孔１９
を有する。各挿入口１９の端面２０は、素子を挿
入した際に当接せしめて、各素子間の間隔を所定
の大きさａに設定するためのものであり、隣接す
る挿入孔１９の端面２０の間隔は所定の大きさｄ
を有している。 FIG. 4 is a perspective view showing a jig used in carrying out the present invention. The jig 18 is machined to the precision required for the array by etching a metal such as stainless steel or a thin plate such as photosensitive glass, and has an insertion hole 19 for regulating the insertion position of the element.
has. The end surfaces 20 of each insertion hole 19 are used to abut the elements when inserted and set the distance between each element to a predetermined size a, and the distance between the end surfaces 20 of adjacent insertion holes 19 is is the predetermined size d
have.
端面２０と垂直方向をなす面の連通部間の距離
は、固体素子の素子基板の端面と機能部との位置
関係に応じ正確に定められている。また、２０で
示す一つおきの端面間の距離は、『機能部間のピ
ツチ×１つの固体素子上の機能部の個数』に設定
されていなければならない。 The distance between the communicating parts on the plane perpendicular to the end face 20 is accurately determined according to the positional relationship between the end face of the element substrate of the solid-state element and the functional part. Further, the distance between every other end face indicated by 20 must be set to "pitch between functional parts x number of functional parts on one solid-state element".
このような治具１８を用いて、第３図に示す固
体素子アレイを得るには、まず第３図に示す、カ
ソードのリード電極１７が所定間隔に表面に形成
された取付基板１６を用意する。その後、第４図
に示す治具１８を、挿入孔１９がリード電極１７
に対応するように、取付基板１６上に設置する。
その後、第２図に示す固体素子１０のカソード電
極１４表面に導電性接着剤を付着し、取付基板１
６上の治具１８の挿入孔１９内に、この固体素子
１０を端面２０に当接せしめて挿入固着する。こ
の時、当接する端面２０は、各挿入孔１９におい
て、同じ側にある端面とする。その後、取付基居
板１６及び固体素子１０を加熱することにより、
両者の固着を完了する。 In order to obtain the solid-state element array shown in FIG. 3 using such a jig 18, first prepare the mounting substrate 16 shown in FIG. 3, on which cathode lead electrodes 17 are formed at predetermined intervals. . After that, insert the jig 18 shown in FIG.
It is installed on the mounting board 16 so as to correspond to the above.
Thereafter, a conductive adhesive is applied to the surface of the cathode electrode 14 of the solid-state element 10 shown in FIG.
The solid element 10 is inserted and fixed into the insertion hole 19 of the jig 18 on the jig 6 by bringing it into contact with the end surface 20. At this time, the end surfaces 20 that come into contact are the end surfaces on the same side of each insertion hole 19 . After that, by heating the mounting base plate 16 and the solid-state element 10,
Complete fixation of both.
治具１８の挿入孔１９の端面２０の間隔ｄは、
固体素子１０の間隔ａに一致させると、挿入孔１
９に固体素子１０を挿入するのが困難になるた
め、ｄ＜ａと設定するのが良い。例えば、機能部
１１の間隔ｂを125μｍとする場合、端面２０の
間隔ｄは30μｍに設定できる。 The distance d between the end faces 20 of the insertion holes 19 of the jig 18 is
When matching the spacing a of the solid-state elements 10, the insertion hole 1
Since it becomes difficult to insert the solid state element 10 into the solid state element 9, it is preferable to set d<a. For example, when the interval b between the functional parts 11 is set to 125 μm, the interval d between the end faces 20 can be set to 30 μm.
一般に、固体素子の大きさや、各固体素子上の
機能部の位置は再現性良く得ることができる。し
たがつて、上記のような治具を用いて、各固体素
子を千鳥状に配列することにより、各固体素子間
における機能部の直線性を確保し、高精度にピツ
チを得ることができる。 Generally, the size of a solid-state element and the position of a functional part on each solid-state element can be obtained with good reproducibility. Therefore, by arranging the solid-state elements in a staggered manner using the jig as described above, it is possible to ensure the linearity of the functional parts between the solid-state elements and to obtain pitch with high precision.
以上説明したように、本発明は、素子の機能部
を固体素子の中心線よりずらせた位置に形成し、
このような固体素子を千鳥状に配列して固体素子
アレイを構成することにより、各素子間の機能部
を直線状に配列するのが容易に行なえ、また各素
子間の機能部の間隔を素子内の機能部の間隔に一
致させることが高精度にかつ容易に行なえると共
に、機能部からの取出し線が短絡することなく行
なえる等の量産性の向上を図ることができる。 As explained above, the present invention forms the functional part of the element at a position offset from the center line of the solid-state element,
By arranging such solid-state elements in a staggered manner to form a solid-state element array, it is easy to arrange the functional parts between each element in a straight line, and the spacing between the functional parts between each element can be adjusted according to the element. It is possible to easily and accurately match the spacing between the functional parts within the structure, and it is also possible to improve mass productivity by making it possible to do this without short-circuiting the lead-out lines from the functional parts.
第１図Ａ，Ｂは従来の発光素子及び発光素子ア
レイをそれぞれ示す斜視図、第２図、および第３
図は本発明の固体素子及び固体素子アレイの一実
施例をそれぞれ示す斜視図、第４図は固体素子ア
レイ作成の為の治具の斜視図である。
１，１０……固体素子、１１……機能部、１３
……アノード電極、１４……カソード電極、１６
……取付基板、１７……リード電極、１８……治
具、１９……挿入孔。
FIGS. 1A and 1B are perspective views showing a conventional light emitting device and a conventional light emitting device array, FIGS.
The figures are perspective views showing an embodiment of the solid-state device and solid-state device array of the present invention, respectively, and FIG. 4 is a perspective view of a jig for producing the solid-state device array. 1, 10...Solid element, 11...Functional part, 13
... Anode electrode, 14 ... Cathode electrode, 16
... Mounting board, 17 ... Lead electrode, 18 ... Jig, 19 ... Insertion hole.
Claims (1)
数の機能部を有し、前記複数の機能部が、前記素
子基板の中心線から離間した位置に、等ピツチで
前記素子基板の第１の端面と平行に直線状に配置
され、且つ、前記第１の端面と直行する第２の端
面から最も近い機能部との距離が、各機能部間の
距離の半分以下に設定された固体素子複数個と、
リード電極が所定間隔に表面に形成された取り付
け基板とを準備し、連通部を介して等ピツチで繰
り返えされる千鳥状の挿入孔を有する治具を用い
て前記固体素子の各共通電極が前記リード電極に
接触し、各固体素子の機能部が直線状、且つ、等
間隔になるように前記固体素子を前記治具の挿入
孔に挿入し固着する固体素子アレイの製造方法。1. A common electrode is provided on the back surface of the element substrate, and a plurality of functional parts are provided on the front surface, and the plurality of functional parts are arranged on the first surface of the element substrate at equal pitches at positions spaced apart from the center line of the element substrate. A plurality of solid elements arranged in a straight line parallel to the end face, and the distance between the functional part closest to the second end face perpendicular to the first end face is set to be less than half the distance between each functional part. individual and
A mounting board on which lead electrodes are formed at predetermined intervals is prepared, and each common electrode of the solid-state element is inserted through a communication portion using a jig having staggered insertion holes that are repeated at equal pitches. A method of manufacturing a solid-state element array, comprising inserting and fixing the solid-state elements into the insertion holes of the jig so that the solid-state elements are in contact with the lead electrodes and the functional parts of each solid-state element are linear and equally spaced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57008367A JPS58125879A (en) | 1982-01-21 | 1982-01-21 | Solid element and solid element array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57008367A JPS58125879A (en) | 1982-01-21 | 1982-01-21 | Solid element and solid element array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58125879A JPS58125879A (en) | 1983-07-27 |
| JPH0341990B2 true JPH0341990B2 (en) | 1991-06-25 |
Family
ID=11691263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57008367A Granted JPS58125879A (en) | 1982-01-21 | 1982-01-21 | Solid element and solid element array |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58125879A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013176338A1 (en) * | 2012-05-23 | 2013-11-28 | 전북대학교산학협력단 | Winter-sports simulator using vibration |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0620369B2 (en) * | 1984-06-19 | 1994-03-23 | ヤンマー農機株式会社 | Rice planting equipment for rice transplanters |
| US4605944A (en) * | 1984-09-11 | 1986-08-12 | Sanyo Electric Co., Ltd. | LED array device for printer |
| JPH09283808A (en) * | 1996-04-19 | 1997-10-31 | Oki Electric Ind Co Ltd | Light detecting and radiating element module and chip |
| JPH111027A (en) * | 1997-04-14 | 1999-01-06 | Oki Electric Ind Co Ltd | Led array, print head, and electrophotographic printer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57178386A (en) * | 1981-04-27 | 1982-11-02 | Stanley Electric Co Ltd | Light emitting diode |
-
1982
- 1982-01-21 JP JP57008367A patent/JPS58125879A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57178386A (en) * | 1981-04-27 | 1982-11-02 | Stanley Electric Co Ltd | Light emitting diode |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013176338A1 (en) * | 2012-05-23 | 2013-11-28 | 전북대학교산학협력단 | Winter-sports simulator using vibration |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58125879A (en) | 1983-07-27 |
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| JPS623682A (en) | Positioning device for electrode plate array in ion chamber type x-ray detector |