JPS61235163A - Manufacture of high-density wiring block - Google Patents

Abstract

PURPOSE:To obtain a high-density wiring block by transmitting a laser beam to a pair of plates coated with a metallic electroconductive layer on an insulative substrate and eliminating the metallic electroconductive layer in the form of strip at a prearranged pitch. CONSTITUTION:A plate 22 is processed by the transmission of a laser beam. A metallic electroconductive layer 21 is removed in the form of strip at a prearranged pitch by transmitting a laser beam 23, leaving plural recording electrode wires 24 formed in an unremoved part. These pairs of plates 22 are arranged opposed to each other at a position where the medium line of one electric wire part 24 meets that of the other strip-formed removed part 25. Further, a low-melting point glass 26 is provided between these two and bonded together under heating conditions. Thus the low-melting point glass 26a is filled between respective electric wire parts, and consequently, a high-density wiring block 31 consisting of two insulative substrates 20 bonded together with the low- melting point glass 26a is made available.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention was developed as a method for manufacturing a recording electrode unit used in an electrostatic multi-needle recording head of an information recording device such as a facsimile. In addition to recording electrode units, the present invention can also be used as a method for manufacturing other high-density wiring bodies that require a large number of electric wires to be arranged at high density.

Prior Art First, the general structure of an electrostatic multi-needle recording head will be explained with reference to FIG. The electrostatic multi-needle recording head using the multi-stylus solid-state scanning method has the circuit configuration shown in FIG. The structure includes electrodes 1). The control electrode group A is connected to an M-bit shift register, and the two recording electrode groups B and C are also respectively connected to an m-bit shift register, and a driver circuit including these shift registers selects the selected electrode 10. 1) Electrostatic latent image recording is performed sequentially between the two.

The recording electrode group includes, for example, 2048 recording electrodes 10.
It is constructed by regularly arranging eight dragons in parallel at a density of eight dragons per dragon. As shown in Japanese Patent Publication No. 54-4263 and Japanese Patent Publication No. 56-25390, the manufacturing method involves aligning a large number of ultra-fine coated copper wires and fixing them to each other with a synthetic resin adhesive. Conventionally, this is then fixed between a pair of upper and lower insulating substrates.

The problem that the invention seeks to solve However, the above conventional method has the following problems.

■ There is a limit to the minimization of the wire diameter of the ultra-fine coated copper wire,
The pitch of the recording electrode group was set to 0.125 m (8 electrodes/1fi
) is the limit. Therefore, in order to make images clearer in facsimiles, etc., the pitch of the recording electrode group is set to 16.
With conventional methods, it was impossible to obtain a higher density recording electrode group, such as 24 wires/1 m.

(2) Since the cross-sectional shape of the recording electrode 10 is circular, it is difficult to obtain a sharp image.

■ Conventional methods require complicated manufacturing processes and increase manufacturing costs.

■ In order to increase the density of the recording electrode group, the recording electrode lines a are arranged in two rows in a staggered manner as shown in Figure 9, but in this case the manufacturing process is even more complicated. Not only is this complicated, but a time difference occurs in electrostatic latent image recording, and a delay circuit or the like is required to correct this, which complicates image processing and poses a problem in terms of accuracy.

Similar problems also apply to methods of manufacturing high-density wiring bodies other than the recording electrode group.

Means for Solving the Problems In order to solve the above problems, the present invention forms a metal conductive layer 21 on an insulating substrate 20 as shown in the principle diagrams of FIGS. 1 to 3. By irradiating each of the pair of plate bodies 22 with a laser beam 23 to remove the metal conductive layer 21 in strips at a predetermined pitch, a wire portion 24 having a narrower width than the strip-shaped removed portion 25 is formed in the unremoved portion. It is characterized in that a large number of wiring boards 22 are formed, and then both plates 22 are placed in a position where the wire portion 24 of one side faces the strip-shaped removed portion 25 of the other side, and then joined together to obtain a high-density wiring body.

Effects Since the present invention has the above configuration, it has the following effects.

■ Since the wires on each plate are formed using a laser beam, the density of the wires can be increased and they can be formed in accurate positions. As a result, it is possible to produce a wiring body with a high density of 16 pinches/l or 24 pinches/1 mm, which was impossible with conventional methods.

(2) Since the electric wire portion is formed using a laser beam, the cross section can be rectangular or any shape close to this.

■ The manufacturing process for high-density wiring bodies is basically as shown in Figures 1 and 2.
It is extremely simple since it consists of what is shown in Fig. 3 and Fig. 3.

(2) The wire group can be arranged in a line as shown in FIG.

Example An embodiment of the present invention will be described below with reference to the drawings.

This embodiment relates to a method of manufacturing a recording electrode unit 31 used in an electrostatic multi-needle recording head 30 shown in FIGS. 6 and 7.

A recording electrode unit 31, which is an example of a high-density wiring body, is made by coating an insulating substrate 20 with a metal conductive layer 21.
It is manufactured using a pair of plate bodies 22.

The plate body 22 is an insulating substrate 20 made of an alumina ceramic plate, and a metal conductive layer 2 of copper or copper alloy is placed on top of the insulating substrate 20.
1 to a thickness H of 40 μm by plating, vacuum deposition, etc.
It is preferable to use a material coated so as to have the following properties.

Each plate 22 is subjected to laser processing by irradiation with a laser beam 23, as shown in FIG. It is preferable to use a neodymium YAG laser as the laser device, and use its second harmonic (wavelength: 0.532 μm).

The metal conductive r521 is removed in a band shape at a predetermined pitch by irradiation with a laser beam 23, and a large number of recording electrode lines (wire portions) 24 are formed in the non-removed portion. Each electric wire part 2
4 are separated from each other by the strip-shaped removed portion 25 and are in an insulating relationship, and have a rectangular cross section. Further, the strip-shaped removed portion 25 is formed deeply so as to cover the surface layer of the insulating substrate 20 to ensure insulation between each wire portion 24.

The width M of the electric wire portion 24 is 32 μm, and the width M of the wire portion 24 is 32 μm.
5 is formed to have a width N of 52 μm (to be exact, the width N of the 5th
As shown in the figure, P=M+ (N-M)/2 is 1000/
It will be 24pm. ).

Next, as shown in FIG. 4, the pair of plates 22 formed as described above face each other at a position where the center line of one electric wire section 24 coincides with the center line of the other strip-shaped removed section 25. After a low melting point glass sheet 26 is further placed between them, they are bonded together under heating conditions. The low melting point glass sheet 26 preferably has a melting point of about 450°C.

In this way, as shown in FIG.
A high-density wiring body (recording electrode unit) 31 in which both insulating substrates 20 are combined by 6a is obtained. The pinch P of the wire portion 24 of this high-density wiring body 31 is 24 pieces/1 tm.
Therefore, the gap between each wire portion 24 is 108 m.

A plurality of recording electrode units 31 obtained as described above are arranged in a straight line and assembled into an electrostatic multi-needle recording head 30, as shown in FIGS. 6 and 7. 1) is a control electrode, 32 is a low melting point glass exterior body, 33 is a case body with a printed circuit board inside, and 34 is a cover plate.

The present invention can be configured in various ways other than those shown in the above embodiments. For example, the materials of the insulating substrate 20 and the metal conductive layer 21 are not limited to those shown in the above embodiments, and the electric wire portion 24, The shape and dimensions of the strip-shaped removed portion 25 are not limited to those shown in the above embodiments, and the method of joining the two plate bodies 22 is also not limited to that shown in the above embodiments.

Effects of the Invention As a result of the present invention having the above-mentioned configuration, it is possible to arrange the electric wire portions in a row at an extremely high density, and the cross-sectional shape of the electric wire portions can be made into a rectangular shape or any shape close to this. This has the effect that the wiring body can be manufactured by a simple and easy manufacturing process.

In particular, when the present invention is applied to a method for manufacturing a recording electrode unit of an electrostatic multi-needle recording head, it is possible to arrange recording electrodes at an extremely high density of 16 electrodes/lfi or 24 electrodes/lfi, which was previously impossible. Furthermore, it is possible to obtain a recording electrode unit in which the recording electrodes can be arranged in one row and have a rectangular cross-sectional shape. Therefore, images produced by a facsimile machine equipped with such a recording electrode unit become extremely clear.

[Brief Description of the Drawings] Figures 1, 2, and 3 are vertical sectional side views showing the principle of the method of the present invention, Figure 4 is a perspective view showing an embodiment of the present invention, and Figure 5 is a perspective view showing an embodiment of the present invention. 6 is a longitudinal side view of an electrostatic multi-needle recording head incorporating a high-density wiring body (recording electrode unit) obtained by the present invention, and FIG. 7 is a perspective view thereof.
FIG. 8 is a circuit diagram of an electrostatic multi-needle recording head, and FIG. 9 is a longitudinal sectional side view showing an example of a conventional recording electrode unit. 20-・-・・・・・・・・・・・・・・・
・-・・・・・・Insulating substrate 21-m-・
−・−・−・・−m−−−・−・−・−・−・−・−・
・・・・・・Metal conductivity 22----------------------
−・−・・・・・・・−・−・・・・・・−・・
・・−Plate 23−・−−−−1−−−・−・−・−−−
1−・−・−−1−−・−・Laser beam 24・−・−・
・−−−−−11−−−−−−−−−−−−−−−−−
−−1−−・Electric wire part 25−・・−・−−−1−・−1−
−−−−−−−−−・−・−・・・・ Band-shaped removed part. Applicant Matsushita Electric Industrial Co., Ltd. Agent Patent Attorney Toshio Nakao
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Claims (1)

[Claims] (1) By irradiating each of a pair of plates consisting of a metal conductive layer formed on an insulating substrate with a laser beam and removing the metal conductive layer in a band shape at a predetermined pitch, the unremoved portion is removed. A large number of electric wire sections having a width narrower than the strip-shaped removed section are formed on the substrate, and then both plates are placed in a position where one of the electric wire sections faces the other strip-shaped removed section, and then joined together to form a high-density wiring body. A method of manufacturing a high-density wiring body, characterized in that: