JPS62108413A - Manufacture of jumper chip - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION -1~ This invention relates to a method of manufacturing a jumper chip used for electrical connection between conductive wires on a wiring board.

Jorai (9) Technique 5 A conventional jumper chip has the configuration shown in FIG.

A first conductor layer 2 and a second conductor layer 5 made of silver-palladium are printed on the front and back edges of the substrate 1. Furthermore, a third conductor N6 of silver palladium is printed on the side surface of the substrate. These conductor layers are covered with a solder layer 8 via a metal plating layer 7, except for the portion covered with a protective film 3 such as glass.

Next, the manufacturing process of the jumper chip with the above configuration is shown in Figure 3 (
This will be explained using al~(f).

(1) First, a thick film of silver palladium is printed on the surface of the base Fi,1, and then fired at 600 to 800°C to form the first conductor layer 2. Next, a protective film 3 is formed by printing a plurality of strips of glass or epoxy resin, arranging them in parallel, and firing them (see FIG. 2(a)). Subsequently, a band-shaped resist 4 is printed on the substrate surface facing the protective film 3 (see FIG. 2(b)).

(2) After printing and forming a thick film of silver-palladium on the substrate surface on which the resist 4 has been printed, it is fired to form the second conductor eyebrows 5.

Subsequently, the resist is peeled off and then divided into strips along the breaking line C (see FIG. 2(C)). A thick film of silver-palladium is also printed on the side surface 1a of each strip and fired to form the third conductor layer 6 (see FIG. 2(d)).

■Next, after dividing the chips into individual chips along the breaking line D of the chip width (see Figure 2 (e)), each chip is plated to form a metal plating layer 7 and a solder layer 8. (See Figure 2(f)).

As mentioned above, in the conventional method, it is necessary to repeat the process of thick film printing and firing, which causes problems such as high manufacturing costs and no improvement in yield. was.

SUMMARY OF THE INVENTION In view of these problems, it is an object of the present invention to provide a method for manufacturing a jumper chip that can simplify the manufacturing process and provide a jumper chip at low cost.

. In order to achieve the above-mentioned object, this invention includes a plurality of band-shaped mask materials for plating arranged side by side on one side of a sheet-shaped insulating substrate, and then a longitudinal direction between the mask materials. Divide into strips along the vertical line, and for the strips obtained by this division,
Forming a base metal by plating, further plating tin or solder over the base metal layer, and then removing the mask material and dividing the strip into a plurality of pieces along the lateral direction to form clear jumper chips. It is characterized by

1. A jumper chip is formed by simply forming a base metal by plating except for the parts that do not require a conductor, and then coating the base metal layer with tin or solder. The base metal layer contributes to enhancing tin or solder adhesion.

1. Figure 2 shows a jumper chip manufactured by the manufacturing method according to the present invention.

In the figure, reference numeral 10 is a rectangular substrate made of an insulating material such as alumina. Reference numeral 30 denotes a base metal layer formed by electroless plating from the front surface to both ends of the back surface of the substrate. The surface of the base metal layer 30 is covered with a plating layer 40 made of tin or solder plating. Base metal layer 30
The material is intended to improve adhesion to tin or solder plating, and nickel or the like is used, which has excellent adhesion strength to the plating. Nickel has excellent adhesion to the substrate 10 and is preferable as the base metal. The base metal layer 30 and the plating layer 40 have a thickness of 5 to 10 μm. As described above, it is composed of a plating layer of tin, solder, or nickel, and the material cost is lower than that of a layer formed by forming a thick film of silver-palladium.

In FIG. 2, 51 to 53 are conductive wires that intersect on the circuit board 5o. In order to mount the jumper knob on this, the conductive wires 51 to 53 that are opposite to each other must be connected so as to straddle the intermediate conductive wire 51.
When a jumper chip is placed on and 53 and then the side surfaces of the plating layer 30 are fixed with solder 60, the conductive wires 52 and 53 are electrically connected through the base metal layer 20 and the plating layer 30 without shorting with the conductive wire 51. .

The manufacturing process of the jumper assembly having the above structure will be explained with reference to FIG.

(2) Reference numeral 10 is an alumina substrate in the shape of a sheet 1. first,
On the back surface of this substrate 10, a plurality of resists 20 made of epoxy resin are formed as a mask material in parallel strips at regular intervals (see FIG. 1 (al)).Subsequently, each resist strip is formed along the breaking line A. This division is performed by breaking with slits previously formed on the substrate or by cutting with a disk scribe (see Fig. 1 (bl)).

(2) After subjecting the strip obtained by the above division to surface treatment with hydrofluoric acid or the like, electroless plating is performed to form a base metal layer 30 of nickel or the like (see FIG. 1(C)). Similarly, the strip is plated with tin or solder by electrolytic plating (barrel plating) to form a plating layer 40 (see FIG. 1(d)). In these steps, plating is also applied to the end faces of the strip, so both end portions are removed by end treatment.

(2) Next, after the resist 20 is removed, the chips are clearly divided along the breaking line B of the chip width (see tel in FIG. 1).

As described above, a jumper chip having a two-layer structure consisting of a base metal layer and a tin or solder plating layer can be easily manufactured by only applying the resist 20 and performing electroless plating and electrolytic plating.

According to the present invention, a jumper chip with a simple structure can be manufactured at low cost by only using the main steps of printing a mask material and plating two layers without repeating the steps of thick film printing and baking. I can do it.

[Brief explanation of drawings]

1(a) to tel are process explanatory diagrams showing an example in which the manufacturing method of the present invention is applied, FIG. 2 is a sectional view showing the use state of the jumper chip manufactured through the manufacturing process of FIG. 1,
FIG. 3 (al~([1 is a process explanatory diagram showing a conventional manufacturing method, and FIG. 4 is a cross-sectional view of a conventional jumper chip. 10... Insulating substrate, 20... Resist (mask material) ), 30... base metal layer, 40... plating layer.

Claims (1)

[Claims] (1) A plurality of strip-shaped mask materials for plating are arranged side by side on one side of a sheet-shaped insulating substrate, and then divided into strips along the vertical lines in the longitudinal direction between the mask materials, and the strips obtained by this division are A base metal is formed on the body by plating, and tin or solder is plated over this base metal layer,
A method for manufacturing a jumper chip, in which the mask material is removed and the strip is laterally divided into a plurality of pieces to form individual jumper chips.