JPS61193304A - Chip-shaped electronic component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a chip-shaped electronic component used as a jumper chip element or the like.

[Conventional technology]

Conventionally, jumper chip elements are made by coating a chip-shaped substrate with silver paste and baking it to form a conductive film, and leaving both ends of the conductive film as electrodes to form a glass protective film. In addition, there are devices in which a second electrode portion is formed from the end surface of the chip substrate to the electrode portion.However, silver paste is expensive, and requires high temperatures for baking, and it is difficult to bake the glass protective film. However, there is a problem in that high temperatures are required and a firing furnace is required, which also increases the production cost.

(Problems to be Solved by the Invention) In view of the above-mentioned problems, the present invention uses inexpensive metals and conductive synthetic resins as a conductive material, and uses a material that does not require high-temperature firing as a protective film. This is an attempt to reduce strikes. .

Means for solving problem C] First, a chip base with copper foil, which is a copper-clad insulating substrate, and a copper foil on this chip U body, with both ends left as first electrode parts. By using a copper-clad insulating substrate as the conductive film material for the formed synthetic resin protective film, there is no need to use expensive silver, and glass, which has a high firing humidity, is not used as a protective film, making high-temperature firing unnecessary. Furthermore, the present invention uses inexpensive materials to reduce the production cost.Furthermore, the present invention forms a second electrode part made of a conductive synthetic resin cured film as an end face electrode on the first electrode part, and This eliminates the need for high-temperature firing to harden the electrode part.

Furthermore, the present invention forms a third N-pole part made of an electroplated layer made of at least one layer of nickel, tin, and solder on the second electrode part made of a cured conductive synthetic resin film, thereby forming a metal electrode without high-temperature baking. It is something that we are trying to form.

Roughly speaking, the present invention forms a second electrode part made of a nickel electroless plating layer over the first electrode part which is not covered with a protective film from the end face of the chip base, and coats copper and nickel on the second electrode part. This method attempts to form a metal electrode without high-temperature firing by forming an electroplated layer consisting of at least one layer of tin, solder, and the like to form the third electrode part.

[Effect]

In the present invention, an electrically insulating synthetic resin retaining film is formed on the copper foil L of the copper foil A-1 base made of a copper-clad insulating substrate, and the first electrode portions made of the copper foil remaining at both ends are used as electrodes. Alternatively, a second electrode section made of a cured conductive synthetic resin film formed on the end surface of the chip base from above the first electrode section is used as an electrode, or on this second electrode section. Either use the formed third electrode part consisting of the electroplated layer as an electrode, or form a nickel electroless plating layer in place of the conductive synthetic resin protective film, and use this nickel electroless plating layer as the second electrode part. A third electrode portion made of an electroplated layer is formed on this, and the third electrode portion made of metal Jζ is formed without requiring a high-temperature deenergization process.

〔Example〕

Next, the structure of an embodiment of the present invention will be explained with reference to manufacturing process diagrams.

Embodiment 1 (Figures 1 to 3) (1) The copper-clad insulating substrate 1 is made of a laminated insulation board 2 made of paper and phenol resin, paper and epoxy resin, glass and epoxy resin, and copper foil. 3 is used. (Fig. 1) (2) Each chip substrate 1 is formed by applying poxy resin coating on the copper foil 3 of the copper-clad insulating substrate 1 and cutting it into pieces in a later process.
Apply the coating leaving the first electrode portions 4 on both ends of a and harden it! A protective film 5 is formed. (The plan view is shown in FIG. 2) (3) Cut the substrate 1 vertically and horizontally to obtain the chip substrate 1a.

(A longitudinal side view is shown in FIG. 3.) As described above, the copper foil 3 as a conductive part is placed on the chip substrate 1a, and the synthetic resin protective film 5 is covered with the first electrode part 4 at both ends of the surface. A coated product A1 is obtained.

Example 2 (FIGS. 4 to 7) (1) In the same manner as in Example 1, the substrate 1 on which the electrically insulating synthetic resin protective film 5 was formed in a large number of strips was divided into elongated strips. A strip 1b is formed as shown in FIG. The second electrode portion 9 is formed as shown in .The conductive synthetic resin paint is an epoxy resin paint containing metals such as N1, Cu, Ag, and AI.

(2) Cut the strip 1b into chips to produce 1q of chip-shaped products A2 shown in FIG. The obtained product A2 is
A second electrode part 9 made of conductive synthetic resin is formed from the end surface of the product A1 to the first electrode part 4. 7th
The figure is a longitudinal sectional front view of the product.

Example 3 (Fig. 8) (1) Electroplating with one of nickel, tin, and solder was applied to the second electrode part 9 of the product Δ2 obtained in Example 2 (not shown in Fig. 8). A third electrode portion 10 made of an electroplated layer is formed to obtain a product A3.

The third electrode portion 10 may be an electroplated layer formed by nickel plating, solder plating 42, or tin plating.

19, the product A3 has a second electrode portion 90 having an electroplated layer of nickel, tin, or solder, or a third electroplating layer further plated with tin or solder. An electrode section 10 is formed therein.

Example 4 (FIGS. 9 to 13) (1) A protective film 5 is formed in the same manner on the same copper-clad insulating substrate 1 as in Example 1, and further a layer is formed on the protective film 5 and the insulating substrate. A plating resist film 6° 6a is formed on the back surface of 1.

(A vertical cross-sectional side view of the substrate 1 is not shown in FIG. 9.) (2) The substrate 1 is divided into strips 1b for each length of the chip substrate 1a, and both sides of the strip 1b (both end surfaces of the chip substrate 1b) are divided into strips 1b. ), the electrode portion 4.4, and a part of the back surface are activated with palladium chloride to form an activated surface 7. (A vertical cross-sectional view of the strip i11 in the 1] direction is shown in FIG. 10.) (3) The activated surface 7 of the strip 1b is electrolessly plated with nickel to form a nickel electroless plating layer for the second electrode. Form part 8. (A vertical cross-sectional view of the middle direction of the strip 1b is shown in FIG. 11) (4) The strip 1b on which the second electrode portion 8 is formed is divided into each chip substrate 1a. and the second one of each chip substrate 1a.
Electroplating any one of copper, nickel, tin, and solder on the electrode part 8, or electroplating nickel or solder on copper electroplating, or electroplating nickel on copper electroplating. Then, solder electroplating or tin electroplating is performed to form the third electrode portion 11 made of an electroplated layer.

(5) Dissolve and remove the plating resist film 6.6a on the upper and lower surfaces to obtain product A4. (The 13th vertical cross-sectional front view of product A4 is
In the product Δ4 (shown in the figure), a second electrode part 8 made of an electroless plating layer is formed from the end surface of the copper-clad chip base 1a to the first electrode part 4, and an electroplated layer is formed on the second electrode part 8. A third electrode portion 11 is formed therein.

All of the products A1 to A4 obtained in the above examples are used as chip elements for jumper wires.

[Efficacy of invention Song Dynasty]

According to the present invention, a synthetic resin cured film is applied to a copper foil 1- of a copper-clad chip base comprising a copper-clad insulating substrate on which a copper foil is laminated on the top surface, with both ends left as the first electrode parts. Because of this, there is no need to separately form a conductive film on the insulating substrate, and the number of culms can be reduced, and a metal glaze containing silver is used as the conductive film! There is no need for expensive materials or the need for a metal glaze firing furnace. Furthermore, since the conductive film is made of copper n5, a synthetic resin can be used as the protective film and curing can be avoided at a relatively low temperature, so a high temperature firing furnace is not required for forming and forming the protective film.

Further, since a second electrode portion made of a conductive synthetic resin cured film is formed from the end surface of the chip base to the first center portion,
Since a high-temperature firing furnace is not required for curing the second electrode portion, shortening of time and improvement of productivity can be expected.

Furthermore, by forming a metal electrode as a third electrode part by electroplating on the second electrode part made of a conductive synthetic resin film, an inexpensive metal electrode can be formed without high-temperature firing.

In addition, a second electrode part made of a nickel electroless plating layer is formed from the end surface of the chip base to the first electrode part through the activated active 1 (F live blood), and a second electrode part made of an electroplated layer is formed on the second electrode part. Since three electrode parts are formed, the nickel plating layer can be electrolessly bonded to the chip substrate by the activated surface.
The electrode part can easily form a third electrode part made of an electroplated layer, and the thickness and strength of the second electrode part made of a nickel electroless plating layer can be easily formed by the third electrode part made of a single electroplated layer. can compensate for the lack of.

[Brief explanation of drawings]

1 through 3, FIGS. 4 through 7, FIG. 8, and FIG. 9 through FIG. 13, which do not show different embodiments of the present invention, are process diagrams for manufacturing a dip-shaped electronic component. DESCRIPTION OF SYMBOLS 1...Copper-clad insulating substrate, 1a...Depth base, 3...Copper foil, 4...First electrode part, 5...Protective film, 7...Activation surface, 8.9...Second electrode part , 10.11...Third electrode section.

Claims (4)

[Claims] (1) A chip base with copper foil made of a copper-clad insulating substrate with copper foil laminated on the top surface, and a synthetic resin protective film formed on the copper foil of this chip base with both ends left as first electrode parts. A chip-shaped electronic component characterized by: (2) A chip base with copper foil made of a copper-clad insulating substrate with copper foil laminated on the top surface, and a synthetic resin protective film formed on the copper foil of this chip base with both ends left as first electrode parts. A chip-shaped electronic component comprising: a second electrode portion made of a conductive synthetic resin cured film formed from both end surfaces of the base body to the first electrode portion. (3) A chip base with copper foil made of a copper-clad insulating substrate with copper foil laminated on the top surface, and a synthetic resin protective film formed on the copper foil of this chip base with both ends left as first electrode parts. , a second electrode portion made of a conductive synthetic resin cured film formed from both end surfaces of the base body to the first electrode portion;
A chip-shaped electronic component comprising: a third electrode portion made of at least one electroplated layer of nickel, tin, and solder formed on the electrode portion. (4) A chip base with copper foil made of a copper-clad insulating substrate with copper foil laminated on the top surface, and a synthetic resin protective film formed on the copper foil of this chip base with both ends left as first electrode parts. a second electrode part made of a nickel electroless plating layer formed from the end surface of the chip base to the first electrode part at both ends via the activated surface; copper, nickel, formed on the second electrode part; A chip-shaped electronic component comprising a third electrode portion made of at least one electroplated layer of tin or solder.