JPH03184880A - Electrostatic recording head and production thereof - Google Patents

Abstract

PURPOSE:To lower the cost of materials by a method wherein a large number of insulated conductors arranged in parallel to each other are each connected so as to intersect a parallel conductive pattern formed on a wiring board. CONSTITUTION:After a glass epoxy substrate 5 is fixed on a fixing jig 9, a recording electrode wire 3 is grasped by a chuck 12 and arranged on the glass epoxy substrate 5 with the application of a tension. In a wire arranging part, the wire is temporarily fixed on an adhesive part 13 on a glass epoxy substrate 5a using a heater chip 14. A connection part 7 and thereabouts are pressurized from on the recording electrode wire 3 by the jig 11. With the wire 3 brought into contact with a solder pattern 4, the wire is irradiated with a laser beam 15 from above the connection part 7, whereby a polyurethane covering the recording electrode wire 3 is removed and, simultaneously, the phosphor bronze wire is bonded with the solder pattern 4. After that, the unwanted part of the recording electrode wire 3 is cut at or around the connection part 7, and the connection part 7 is obtained. In this manner, a low-cost electrostatic head capable of coping with a high-speed recording by reducing an electrostatic capacity can be produced.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a recording electrode, such as a recording electrode used in an electrostatic block-1 copying machine, etc., and relates to an electrostatic recording head for plane scanning recording and a method for manufacturing the same. .

Conventional technology As a receiving recording device in a recording device, the one most suitable for the recording method has been adopted, but especially in the case of flat scanning recording in which recording is performed on a flat recording paper by flat scanning, Multi-needle electrode methods are exclusively used. This uses a mechanical scanning method to electrically exchange and transmit image signals, which are distributed by a distributor on the receiving side and applied to multi-needle electrodes.
It reproduces images on recording paper.

FIG. 9 shows an electrostatic recording head with a conventional configuration. In the figure, 2] is a multi-needle recording electrode, and 22 is a control electrode. In the electrostatic recording process, a recording electrode applies a charge to the dielectric layer of electrostatic recording paper to form an electrostatic latent image, and toner is attached to this latent image to obtain a visible image. An electrostatic head is a device that forms this electrostatic latent image, but it is impractical to pinch individual electrodes, and scanning circuits are arranged in a matrix in order to perform electronic scanning with an efficient configuration. Therefore, the applied voltage is divided into two, and a voltage that does not form a latent image even if only one voltage is applied is selected and applied to the recording electrode 21 and the control electrode 22 separately. In order to make the recording electrode 21 circular in shape, the conventional electrostatic head uses a recording electrode wire 23 in which a conducting wire with a round cross section is insulated and connected to each terminal 24 as shown in FIG. A large number of recording electrode wires 23 are connected to the recording electrode.

Problems to be Solved by the Invention However, in the above configuration, a large number of recording electrode wires are connected to each terminal, so a large capacitance is generated between the recording electrodes at the point where each wire intersects. It cannot support high-speed recording because the rise of the signal is delayed when voltage is applied.

In addition, an induced voltage may be generated between adjacent wires, and this induced signal may cause an unnecessary image to be formed on the recording paper.

Moreover, the overall length of the recording electrode wire increases the material cost, which increases the cost.

Further, since the wiring to the terminals is complicated, it is difficult to automate the wiring, and there is a problem in that defects are likely to occur due to incorrect wiring.

SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide an electrostatic recording head that is inexpensive and capable of high-speed recording due to a reduction in capacitance, and a manufacturing method thereof that can be automated.

Means for Solving the Problems In order to solve the above problems, the first invention of the present invention is to wire a large number of insulated conductive wires forming recording electrodes in parallel on a wiring board, and to divide them into blocks of n wires each. This electrostatic recording head is characterized in that it is divided into blocks, and n insulated conductive wires in each block are respectively connected at positions intersecting n parallel conductive patterns on a wiring board.

Further, a second invention of the present invention provides an electrostatic recording head according to the first invention, characterized in that the wiring board on which parallel conductive patterns are formed is a glass epoxy substrate on which a solder plating pattern is formed. It is the head.

A third aspect of the present invention is that in the electrostatic recording head of the second aspect, when connecting the insulated conductive wire and the solder plating pattern, laser energy is used to remove the coating of the insulated conductive wire and simultaneously remove the solder plating. This is a method of manufacturing an electrostatic recording head characterized by joining by melting.

A fourth aspect of the present invention is that in the electrostatic recording head of the second aspect, when connecting the insulated conductive wire and the solder plating pattern, the insulated conductive wire is heated and pressurized with a heating jig. This is a method of manufacturing an electrostatic recording head characterized by performing pressure bonding.

Further, a fifth aspect of the present invention is that in the electrostatic recording head of the second aspect, when connecting the insulated conductive wire and the solder plating pattern, the insulating coating of n pieces of insulating coating is removed by laser energy at the connecting portion. This method of manufacturing an electrostatic recording head is characterized in that thermocompression bonding is performed from above the wire with a resin containing a conductive filler placed between the conductor portion of the conductor and the solder plating pattern.

According to the first aspect of the present invention, the entire length of the insulated conductive wires is reduced by connecting a large number of insulated conductive wires that are wired in parallel to each other at positions that intersect parallel conductive patterns on the wiring board. In addition to reducing material costs because the length can be minimized, it is also possible to eliminate the overlap between the insulated conductors, which suppresses the generation of large capacitance between the electrodes. This prevents a delay in the rise and fall of the signal when voltage is applied and the generation of induced voltage between adjacent conductors.

Further, according to the second invention and the third invention of the present invention,
By using laser light, stripping and joining can be performed in one step, making it possible to achieve non-contact and high-tact joining.

Further, according to the fourth aspect of the present invention, by applying pressure while heating the insulated conductive wire with a heating jig, the solder of the solder plating pattern is melted by Joule heat, and at the same time, the insulated coating is destroyed by the pressurizing force, and the conductor is heated. Since the portion is pressed against the pattern, highly reliable joining is possible.

Furthermore, according to the fifth aspect of the present invention, by wiring the conductive wire portions of the n insulated conductive wires whose connecting portions are stripped of their insulating coatings by laser energy in a sheet form, it is possible to join each block at once, High productivity is achieved. In addition, when pressurizing a resin containing a minute conductive filler, the conductive particles are squeezed between the conductor wire and the solder pattern, contributing to conduction, but between adjacent conductor wires, the resin Insulation is maintained due to the components. Further, when pressurized, the conductive particles destroy the oxide film existing at the interface of the connection part, thereby reducing the connection resistance value. In addition, the heating during thermocompression bonding causes a curing reaction of the resin, which improves the strength of the connection and improves the reliability of the connection.

The above manufacturing method makes it possible to automate the connection between the insulated conductive wire and the printed circuit board, which theoretically eliminates the occurrence of defects due to incorrect wiring, making it possible to achieve high-speed recording at low cost and by reducing capacitance. Electrostatic heads can be manufactured.

Example Embodiments of the present invention will be described below with reference to the drawings.

Embodiment 1 FIG. 1 is a perspective view of an electrostatic head in a first embodiment of the present invention. In FIG. 1, 1 is a recording electrode, 2 is a control electrode, and the electrode alignment portion is fixed by a resin mold 6. For the recording electrode 1, a polyurethane-coated phosphor bronze wire (diameter 80 μm) was used. The recording electrode wire 3 is divided into the same number of flocks and electrically connected to the solder plating pattern 4 on the glass epoxy substrate 5. An enlarged perspective view of the connection part is shown in FIG. The recording electrode wire 3 is wired in a direction perpendicular to the solder plating pattern 4 at the pinch of the electrode alignment part, and is connected to each solder plating pattern 4 at the shedding connection part 7.

Next, FIG. 3 shows the above connection method. In FIG. 3, 9 is a board fixing jig, 10 is a wire fixing jig,
11 is a wire pressing jig, 12 is a wire chuck jig, 13 is an adhesive tape for fixing the wire, and 14 is a heater chip. First, after fixing the glass epoxy substrate 5 to the fixing jig 9, the recording electrode wire 3 is gripped by the chuck 12 and wired onto the glass epoxy substrate 5 under tension. After wiring, the recording electrode wire 3 is fixed to the jig 10 on both sides 2 of the glass Epoquin substrate 5 while maintaining tension. Further, in the wire alignment section, the heater chip 14 is temporarily fixed to the adhesive tape 13 on the glass Epoquin substrate 5a.

Here, by pressurizing the connection part 7 and its vicinity with the jig 11 from above the recording electrode wire 3, the wire 3 and the solder pattern 4 are brought into contact at the connection part 7, and as shown in FIG. Laser light 15 is irradiated from above the connection part 7.

The laser beam 15 is absorbed by the solder plating pattern 4,
Melt the solder. As a result, the polyurethane coating on the recording electrode wire 3 is removed, and at the same time, the phosphor bronze wire and the solder pattern 4 are bonded. Thereafter, the unnecessary portion of the recording electrode wire 3 is cut off near the connection part 7, thereby obtaining the connection part 7 shown in FIG. 2. The reason why the wires 3 are cut here is to prevent an increase in capacitance between adjacent wires 33.

In this example, a pattern 4 with a pattern width of 250 μm and a butter density of 2 Lines/mm is used.
A glass epoxy substrate 5 was used.

In addition, as the laser beam 15, a light with a wavelength of 1.06 μm from a continuously pumped NdYAG laser oscillator was used, and as a result of converging the beam into a spot diameter of about 1 mmφ and bonding, it took about 0.5 seconds per bonding point. It was possible to join.

FIG. 5 shows a cross-sectional perspective view of essential parts of the electrostatic head.

In FIG. 5, 8 is a signal input connector. The recording electrode alignment section usually has a structure in which two parallel recording units of recording electrodes shown in FIG. 2 are combined in order to improve the recording density by arranging them in a staggered manner. Solder pattern 4
are each electrically connected to a connector 8, and are energized by a signal from an externally provided driver circuit (not shown), so that an electrostatic latent image is formed from the recording electrode portion to the recording paper.

In the electrostatic recording head of this embodiment, the recording electrode wires 3 do not cross each other, and the recording electrode wires 3
A structure with the shortest overall length can be realized. Furthermore, bonding using laser light 15 realizes automatable non-contact and high-tact bonding.

Embodiment 2 FIG. 6 shows a bonding process in a second embodiment of the present invention. In FIG. 6, 3 is a recording electrode wire, 4 is a solder plating pattern, 5 is a glass epoxy substrate, and 16 is a heat-pressing jig. This embodiment differs from the first embodiment in that a thermocompression bonding method is used instead of a laser beam bonding process. As shown in FIG. 6, by pressurizing the recording electrode wire 1'' with the hot pressure bonding jig 16, the Joule heat generated by heating melts the /% solder of the solder plating pattern 4, and at the same time, the recording electrode wire The polyurethane coating of 3 is broken and the wire 3 is pressed against the solder plating pattern 4.

In this example, a glass epoxy substrate 5 was used, on which a solder pattern 4 having a pattern width of 250 μm was formed at a pattern density of I Lines/mm. In addition, heat crimping jig 1
In No. 6, a molybdenum heater tip with a tip width of 0.4 mm was used, and the heater tip was heated to about 200° C. by passing a pulse current for about 22 seconds, and then pressurized at a pressure of about 400 kglcr&.

The electrostatic recording head of this embodiment can improve the reliability of the connecting portion 7 in addition to the effects of the configuration of the first embodiment.

Furthermore, by lengthening the pressure section of the heat-pressing jig 16, it becomes possible to bond a large number of recording electrode wires 3 at the same time. It can be manufactured using equipment that is cheaper than laser equipment.

Embodiment 3 FIG. 7 is an enlarged cross-sectional view of a joint immediately before joining in a third embodiment of the present invention, and FIGS. 8A to 8C are diagrams showing the joining process in this embodiment. In FIG. 7 and FIG. 8 a-C, 3 is a recording electrode wire (polyurethane-coated phosphor bronze wire), 4 is a l\\damesoki pattern, 5 is a glass epoxy substrate, and 17 is a thermosetting resin containing Ni fine particles. ,
Reference numeral 18 is a heat-pressing jig, and reference numeral 19 is a conductive wire portion (phosphor bronze).

This embodiment differs from the first embodiment in that a thermocompression bonding method using a resin 17 containing a conductive filler 3 is used instead of a laser beam bonding process. Next, the bonding process in this example will be explained. First, as shown in FIG. 7, the insulating coating (polyurethane) of the connection portion on the recording electrode wire 3 is removed using laser light or the like to expose the conductor portion 19 only at the connection portion. In this case, as shown in FIG. 8a, it is also possible to strip a large number (for one block) of recording electrode wires 1 wired in parallel at once. Next, a thermosetting resin 17 containing Ni fine particles is applied to the connecting portion of the solder plating pattern 4 and heated to semi-cure. After positioning the conductive wire part 19 at the connection part on the board 5 in this state, the heat-pressing jig 18
Then, the conductive wire portion 19 is bonded by thermocompression bonding from above. In the bonded state, the Ni fine particles are interposed between the conductive wire portion 19 and the solder plating pattern 4 and act to promote electrical conduction between the two, but on the other hand, due to the resin component present around the N1 fine particles, the No conduction occurs between the conductive wire portions 19,19. Furthermore, since Ni particles have high hardness, they also have the effect of destroying the oxide film present on the conductive wire portion 19 and the surface of the solder plating pattern 4 when pressurized, thereby reducing the connection resistance value. Further, since the thermosetting resin 17 hardens and shrinks during thermocompression bonding, the bonding strength at the connection portion of the recording electrode wire 3 is improved.

In this example, a glass Epoquin substrate 5 on which a solder pattern 4 with a batten density of 2 Lines/mm and a pattern width of 250/im was formed was used. In addition, an Epoquin-based thermosetting resin is used as the resin component, and the average particle size is 5 μm in the resin.
A mixture of approximately 20% Ni fine particles was used. Instead of Ni particles, it is also possible to use Au, Ag, solder particles, etc. In addition, a heater head with a tip shape of 2 x 100 mrd is used as the hot pressure bonding jig 18, and it is heated to about 160°C by passing a pulse current.
Pressure was applied for about 20 seconds at a pressure of about kg/cnr.

In addition to the effects of the configuration of the first embodiment, the electrostatic recording head of this embodiment can further improve the reliability of the connecting portion and reduce defects due to short circuits. Furthermore, since it becomes possible to join each block at once, a significant reduction in manufacturing takt time can be expected.

Effects of the Invention As described above, according to the first aspect of the present invention, the overall length of the recording electrode wire can be minimized, which reduces material costs, and also reduces the overlap between the wires. This suppresses the generation of large capacitance between the recording electrodes, and reduces the delay in the rise of the signal when voltage is applied.
This also prevents the generation of induced voltage between adjacent wires.

Further, according to the second to fifth aspects of the present invention, it is possible to connect the recording electrode wire and the printed circuit board with improved reliability of the connection part, so that defects due to incorrect wiring can be avoided. In principle, this does not occur, and it is possible to realize automation of an electrostatic head that is inexpensive and capable of high-speed recording due to a reduction in capacitance.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an electrostatic head according to a first embodiment of the present invention, FIG. 2 is an enlarged perspective view of the connection portion shown in FIG. 1, and FIG. 3 is a connection method and alignment portion of the joint portion shown in FIG. 2. Figure 4 showing
The figure shows the bonding process, FIG. 5 is a cross-sectional perspective view of the main part of an electrostatic head, FIG. 6 is a diagram showing the bonding method in the second embodiment of the present invention, and FIG. 7 is a diagram immediately before the bonding. FIGS. 8a-8c are enlarged cross-sectional views of the bonding portion, showing a bonding method in a third embodiment of the present invention, and FIG. 9 is a perspective view of an electrostatic recording head having a conventional configuration. 1... Recording electrode, 3... Recording electrode wire, 4... Solder plating pattern, 5...
・Glass Epokin board, 7...Connection part, 15・
... Laser light, 16 ... Heat pressure bonding jig, 17 ... Thermoplastic resin containing conductive filler,
18...Heat pressure bonding jig, 19...Conducting wire portion.

Claims (5)

[Claims] (1) A large number of insulated conductive wires forming recording electrodes are wired in parallel on the wiring board, and divided into n blocks each, and the n insulated conductive wires in each block are connected to the n insulated conductive wires on the wiring board. An electrostatic recording head characterized by being connected to the parallel conductive patterns of a book at positions that intersect with each other. (2) The electrostatic recording head according to claim 1, wherein the wiring board on which parallel conductive patterns are formed is a glass epoxy substrate on which a solder plating pattern is formed. (3) In the electrostatic recording head according to claim 2, when connecting the insulated conductive wire and the solder plating pattern, laser energy is used to remove the coating of the insulated conductive wire and simultaneously melt the solder plating and join them. A method for manufacturing a featured electrostatic recording head. (4) In the electrostatic recording head according to claim 2, when connecting the insulated conductive wire and the solder plating pattern, thermocompression bonding is performed by applying pressure while heating the insulated conductive wire with a heating jig. A method for manufacturing an electrostatic recording head. (5) In the electrostatic recording head according to claim 2, when connecting the insulated conductive wires and the solder plating pattern, the conductor portions of the n insulated conductive wires whose insulation coatings at the connecting portions are removed by laser energy are soldered. A method of manufacturing an electrostatic recording head, characterized in that the conductive wire portion is thermocompression bonded to the solder plating pattern while a resin containing a conductive filler is disposed between the conductive wire portion and the pattern.