JPS5812452Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5812452Y2
JPS5812452Y2 JP1977013434U JP1343477U JPS5812452Y2 JP S5812452 Y2 JPS5812452 Y2 JP S5812452Y2 JP 1977013434 U JP1977013434 U JP 1977013434U JP 1343477 U JP1343477 U JP 1343477U JP S5812452 Y2 JPS5812452 Y2 JP S5812452Y2
Authority
JP
Japan
Prior art keywords
lead
heat sink
pieces
heat dissipation
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977013434U
Other languages
English (en)
Japanese (ja)
Other versions
JPS53108868U (enExample
Inventor
英機 宮永
耕二 山口
裕三郎 小川
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1977013434U priority Critical patent/JPS5812452Y2/ja
Publication of JPS53108868U publication Critical patent/JPS53108868U/ja
Application granted granted Critical
Publication of JPS5812452Y2 publication Critical patent/JPS5812452Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1977013434U 1977-02-07 1977-02-07 半導体装置 Expired JPS5812452Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977013434U JPS5812452Y2 (ja) 1977-02-07 1977-02-07 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977013434U JPS5812452Y2 (ja) 1977-02-07 1977-02-07 半導体装置

Publications (2)

Publication Number Publication Date
JPS53108868U JPS53108868U (enExample) 1978-08-31
JPS5812452Y2 true JPS5812452Y2 (ja) 1983-03-09

Family

ID=28831514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977013434U Expired JPS5812452Y2 (ja) 1977-02-07 1977-02-07 半導体装置

Country Status (1)

Country Link
JP (1) JPS5812452Y2 (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5188178U (enExample) * 1975-01-09 1976-07-14
JPS5625247Y2 (enExample) * 1975-03-20 1981-06-15

Also Published As

Publication number Publication date
JPS53108868U (enExample) 1978-08-31

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