JPS58122444U - 半導体樹脂封止装置の金型 - Google Patents

半導体樹脂封止装置の金型

Info

Publication number
JPS58122444U
JPS58122444U JP2024382U JP2024382U JPS58122444U JP S58122444 U JPS58122444 U JP S58122444U JP 2024382 U JP2024382 U JP 2024382U JP 2024382 U JP2024382 U JP 2024382U JP S58122444 U JPS58122444 U JP S58122444U
Authority
JP
Japan
Prior art keywords
mold
semiconductor resin
resin encapsulation
plate
encapsulation equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024382U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6214688Y2 (enrdf_load_stackoverflow
Inventor
柳谷　孝二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2024382U priority Critical patent/JPS58122444U/ja
Publication of JPS58122444U publication Critical patent/JPS58122444U/ja
Application granted granted Critical
Publication of JPS6214688Y2 publication Critical patent/JPS6214688Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2024382U 1982-02-13 1982-02-13 半導体樹脂封止装置の金型 Granted JPS58122444U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024382U JPS58122444U (ja) 1982-02-13 1982-02-13 半導体樹脂封止装置の金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2024382U JPS58122444U (ja) 1982-02-13 1982-02-13 半導体樹脂封止装置の金型

Publications (2)

Publication Number Publication Date
JPS58122444U true JPS58122444U (ja) 1983-08-20
JPS6214688Y2 JPS6214688Y2 (enrdf_load_stackoverflow) 1987-04-15

Family

ID=30032416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024382U Granted JPS58122444U (ja) 1982-02-13 1982-02-13 半導体樹脂封止装置の金型

Country Status (1)

Country Link
JP (1) JPS58122444U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0559838U (ja) * 1992-01-20 1993-08-06 株式会社三井ハイテック 半導体装置用の樹脂封止金型

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0559838U (ja) * 1992-01-20 1993-08-06 株式会社三井ハイテック 半導体装置用の樹脂封止金型

Also Published As

Publication number Publication date
JPS6214688Y2 (enrdf_load_stackoverflow) 1987-04-15

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