JPS58119656A - 樹脂封止型半導体装置 - Google Patents
樹脂封止型半導体装置Info
- Publication number
- JPS58119656A JPS58119656A JP57000861A JP86182A JPS58119656A JP S58119656 A JPS58119656 A JP S58119656A JP 57000861 A JP57000861 A JP 57000861A JP 86182 A JP86182 A JP 86182A JP S58119656 A JPS58119656 A JP S58119656A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- semiconductor device
- sealed
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W74/47—
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57000861A JPS58119656A (ja) | 1982-01-08 | 1982-01-08 | 樹脂封止型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57000861A JPS58119656A (ja) | 1982-01-08 | 1982-01-08 | 樹脂封止型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58119656A true JPS58119656A (ja) | 1983-07-16 |
| JPH0319706B2 JPH0319706B2 (cg-RX-API-DMAC10.html) | 1991-03-15 |
Family
ID=11485442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57000861A Granted JPS58119656A (ja) | 1982-01-08 | 1982-01-08 | 樹脂封止型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58119656A (cg-RX-API-DMAC10.html) |
-
1982
- 1982-01-08 JP JP57000861A patent/JPS58119656A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0319706B2 (cg-RX-API-DMAC10.html) | 1991-03-15 |
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