JPS58119622A - Clip for solid state laminated electronic circuit part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides radio receiver I! In the implementation of electronic devices such as computers, solid-state components 1-electronic circuit components (circuit modules)? Attach # to the clip for mechanically connecting each type 1i & component board □ (rC-containing ceramic, ttsuk, etc.) using solder pads.
Conventionally, chip parts (resistors, capacitors, inductors) and their composite parts have been used.

Structurally, it has an internal electrode and an external electrode, and the external electrode is generally coated with a conductive paste such as Muf-P(i) and fired. However, when forming the external electrode with this conductive paste, In solid-state laminated circuit components, since there is a laminated dielectric material, stray capacitance occurs between each electric conductor due to the arrangement of external electric currents, making it difficult to obtain the desired electrical characteristics.
The present invention has been made in view of these conventional problems.

The present invention provides a clip with an ingenious structure that reduces stray capacitance.

Hereinafter, one example of the present invention, 1 MylI, will be explained using one drawing. Figure 1 and Figure 2 show the capacitor formation part of a solid-state multilayer electronic circuit component, and the internal electrodes (2) and (3) in the laminate (1) are connected to the capacitor through the anti-disruption layer (4). (
C1) and is connected to the terminal (6) (6) of the external electrode. Similarly, a capacitor (C2) is formed at the terminal <8)' (97 in the dark. The third stripe shows the electronic path device It formed on the laminate, and the terminal L5)
(6) (7) (9) +tQ is M to the circuit configuration board
I! Serves as a connection terminal. Figure 4J4 is a hidden circuit diagram. Here, terminal (Phrase (IQ) is the input terminal of the amplifier circuit in electronic circuits.

Originally, the desired ri would be set with the capacitor (C1), but the terminal (5) would be formed with conductive paste to connect with the internal TA layer.
(The dielectric is BaTies and the value of t
-400α terminal (5) pitch between 09 and 1.25 m.

Electron (51QO coating surface 1 x 2 m, when the internal electric power abuse dimension adjacent to bomb 4 is Q, 5 u).

One way to reduce these stray sounds is to interpose a low dielectric layer such as glass in the part that contacts one part of the fs frame layer, and form the terminal with conductive paste. However, both methods have poor workability, increase labor costs, and increase costs. In the case of glass, the N electric rate is 7 to 15.
The present invention uses clips as terminals to reduce stray capacitance, and forms terminals with good workability. , son
Examples of these are shown in Figures 5 to 11. Figures 5 and 6
The figure and Fig. 8 show an air layer α81 with a dielectric constant 4 lower than that of the laminate (1) in the a-plane part (6) of the laminate (1) and the clip metering.
t - Ensures that the air is present (dielectric constant of air #
-1). FIG. 7 shows a clip llB in which the abutting portions of the side surfaces 5o3J of the laminate (1) are coated with a low dielectric constant material.

It can be applied all at once while the hoop material is still in the process of being manufactured.@Also, as another method, as shown in Fig.
It is also possible to coat the side surface of the material (5) with a low dielectric constant material (5) ◎Specific method.

There are methods such as a method of completely baking the glass material, a method of applying 1M fat or the like using a solvent, etc. The advantage of the method shown in Fig. 12 is that the connection between the low dielectric layer such as glass and the conductive paste at the upper surface of the laminate and the 91m edge, which is required by the conventional method of forming terminals with conductive paste, is improved. m
Since it does not require mounting, it is easy to work with and reduces the number of steps. Furthermore, the 51st
If shapes such as those shown in Figures 6, 8, and 9 are used, the contact area with the material will be reduced and the stray capacitance will be further reduced.Figure 9 shows the clip (support). Make a hole near the center of the
The contact rki side with the laminate (1) is made smaller.

In addition, Figure 6, @Figure 8, Figure 13, l! In Figure 14, the shape of the protrusion has been drastically changed to suppress the looseness of the clip.
Regarding Figure 4, simultaneous processing is possible during press processing during the clip manufacturing process.

It can be manufactured at extremely low cost.

Figures 101 and 11 show an example of application development in which the clip (2) is not simply U-shaped but can be used for insertion or embedding depending on each circuit board. ! Using a clip (chest) with dimensions like g51N, the stray capacitance can be approximately IP? and / of the conductive paste.

0 By using the clip of the present invention having the structure detailed in the embodiments above, a solid laminated electronic circuit component having a capacitor function can be easily mounted on various circuit component boards with sufficient electrical stability. can.

[Brief explanation of the drawing]

Figure 1 is a plan view of the capacitor forming part of the solid laminate circuit component, Figure 2 is a sectional view of the same, and Figure 3 is a layout diagram of the electronic circuit formed on the laminate. The figure is a circuit diagram of an electronic circuit, and Figures 5 to 11 illustrate the clip of the present invention.
Up to is a clip, and a sum is an air layer.◎ Patent attorney Takashi Yamamoto... Procedural amendment (method) l Indication of the case 1982 Patent application No. 002172 2 Name of invention For solid laminated electronic i-step parts Clip 3 Relationship with the case of the person making the amendment Patent Applicant Address: 1006-4 Kadoma, Kadoma City, Osaka Prefecture Agent April 9, 1982 (Delivery date: April 1982)
April 27th) Page 6 of the specification, lines 11 to 14, it says, ``The matte is also a figure...'' 5 to 14 are side views of the clip, and FIGS. 5 to 14 (b) are plan views of the clip, illustrating such a click. ”
I am corrected. Procedural amendment (voluntary) Haruki Shimada, Commissioner of the Patent Office! Showing 11 items 1982 Patent Application No. 002172 2 Benefits of the invention. Clip for solid-state laminated electronic circuit components 3 Relationship with the amended case Patent Applicant Address 1006 Kadoma, Kadoma City, Osaka Name (582)
Matsushita Chiki Sangyo Co., Ltd. (Name) 4 agents Month, Day, Showa (Delivery date Showa)
Date) Contents of hook correction (1) Specification page 3, lines 1 to 2 r @child (6)
(6) (7) (9) (X J to4 t, r m (
- (6) (8) (7) (8> (9) (j Q J (3) In the first line of page 6 of the specification, the phrase “of conductor paste” has been corrected to read “When paulownia is formed with conductor paste.” (4) Figures 1 and 7-←)(B) of the drawings shall be corrected as shown in the attached sheet.

Claims (1)

[Claims] (1) Internal electric current *1-, dielectric material 1- and 1m long and 4
At least one external TF that is not connected to the internal electrode of the laminate [as a terminal drawer for connection 11 poles] is attached to the side surface of the integrated body, which has at least one capacitor function. A clip O for surface-laminated electronic circuit components in which the abutting part can be interposed with a material having a dielectric constant lower than that of the dielectric of the laminate.