JPS58118175A - Photocoupler - Google Patents

Abstract

PURPOSE:To obtain a coupler appropriate for mounting on a hybrid IC substrate by a method wherein, on the same plane of the flat plate insulation substrate, a light emitting element and a light receiving element both having the electrode wiring pattern are provided, then these are coupled by a light reflection plane which is spatially positioned, or elements are respectively provided on individual substrates resulting in opposed manner to each other. CONSTITUTION:On the flat plate insulation small substrate 1 constituted of ceramic, etc., the semiconductor light emitting element chip 3 and the semiconductor light receiving element chip 3' are fixed respectively with light emitting and receiving planes upward, and electrode wirings 10 and 11 are connected respectively to the anode and the cathode of the chip 3. Besides, electrode 12, 13, and 14 are connected respectively to the base, the collector, and the emitter of a photo transistor the chip 3'. Thereafter, the light reflection space 5 generated above the chips 3 and 3' is covered with a semi-spherical light reflection plane 4 and surrounded by a sealing material 12, and accordingly these chips are photocoupled. Or, it is also available that these chips are provided on individual substrates, and then the light emitting and receiving planes of these elements are made opposed to each other at a fixed interval.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a photocoupler, and more particularly to a photocoupler having a structure suitable for being mounted on a hybrid integrated circuit board.

FIGS. 1(a) and 1(b) are external views of typical conventional photocouplers, respectively. The photocoupler shown in Figure 1(a) has a can-sealed structure, is large in size, and has a protruding leg-like terminal structure (five legs in the figure).
Therefore, there is a problem in mounting it on a hybrid integrated circuit board. Further, the photocoupler shown in FIG. 1(b) is of a dual in-line type, but it was difficult to mount it on a hybrid integrated circuit board due to exactly the same circumstances.

This invention was made in order to solve the problems of the prior art as described above, and therefore, the purpose of this invention is to:
An object of the present invention is to provide a photocoupler having a structure suitable for being mounted on a hybrid integrated circuit board.

The main points of the structure of this invention are that, in a photocoupler, the terminal structure is made up of an electrode wiring pattern formed on an insulating substrate, and furthermore, the arrangement of the light emitting element and the light receiving element is devised to reduce the size of the photocoupler. Make a point.

The present invention will now be described in detail with reference to the drawings.

FIG. 2 is a perspective external perspective view showing one embodiment of the present invention. In the figure, l is a small flat insulating substrate made of ceramic or the like, 2 is a sealing material having an internal space that is in close contact with the flat surface of the flat insulating substrate 1, and 5 is a sealing material above the flat surface of the flat insulating substrate 1. A light reflecting space is formed inside the stopper 2, and a reflecting material is formed on the surface thereof. Reference numerals 10 to 14 denote II-pole wiring buttons arbitrarily formed on the flat insulating substrate l using printed wiring technology or the like. The wiring lines 10 to 14 exposed on the side surface of the substrate 1 serve as external electrodes as they are. These 10 to 14 external electrodes serve as connection terminals when mounted on the hybrid integrated circuit board 200.

3 is a front perspective view of the flat insulating substrate 1 in FIG. 2. FIG. In the figure, 3 is a semiconductor light emitting device chip;
3' is a semiconductor light receiving element chip.

These semiconductor chips are mounted at predetermined positions on the electrode wiring pattern on the plane of the flat insulating substrate, with the light emitting surface and the light receiving surface facing upward. In this case, the wiring electrode 10 is connected to the anode of the light emitting cable 3, 11 is connected to the cathode, 12 is connected to the paste of the phototransistor which is the light receiving element 3', 13 is connected to the collector, and 14 is connected to the emitter.

In FIG. 4, (a) is a plan view of the flat insulating substrate 1 in FIG. 2, and (b) is #! FIG. 2 is a front sectional view of the photocoupler shown in FIG. 2, and FIG. 2(e) is a side sectional view.

In these figures, reference numeral 4 denotes a light reflecting surface of a metallized layer formed on the inner wall of the light reflecting space formed by the sealing material 2 by, for example, vapor deposition using a metal vapor deposition technique. Reference numeral 20 indicates the boundary between the contact surface of the sealing material 2 and the light reflecting space on the plane of the flat insulating substrate 1. In this case, the light reflection space 5 is located between the center of the light emitting surface of the light emitting element 3 and the light receiving element 3.
It consists of a semi-ellipsoidal space whose focal points are two points at the center of the light-receiving surface of '.

Optical coupling in a reflective photocoupler with such a structure is achieved by either light emitted from the surface of the light emitting element 3, passing through the light reflecting space 5, being reflected by the light reflecting surface 4, passing through the light reflecting space 5 again, and then passing through the light receiving element 3. This is done by reaching ′. In this case, the light reflecting surface and the light reflecting space are a semi-ellipsoidal surface and a semi-ellipsoid space, respectively, with the two points where the light emitting element and the light receiving element are located as focal points, so the light emitted from the light emitting element is The light can be transmitted to the light receiving element more effectively than any other combination of a light reflecting surface and a light reflecting space.

In addition, although the light reflection space was described as a semi-ellipsoidal space in the above embodiment, this part may be formed of a light-transmitting material that also serves as a seal for the element. Further, its shape may be arbitrary.

Figure 5 (aJ, (b) is the same as (b) in Figure 4, respectively)
, CG), which shows that the light reflection space can have any shape as long as it tolerates low efficiency.

Figure A6 is a perspective view showing still another embodiment of the present invention. This figure shows a structure that allows light from a light-emitting element to reach a light-receiving element directly without passing through a reflector, so to speak, a direct coupling type 7-oto coupler, which is suitable for mounting on a hybrid integrated circuit board. An example is shown.

In this embodiment, the light emitting element 3 and the light receiving element 3 are placed on separate insulating small substrates 110 and 120, respectively.

In the sixth ffl(a), the light emitting element 3 is mounted on the L-shaped insulator substrate 110, and the anode of the light emitting element 3,
A wiring pattern 22 connected to the cathode is formed up to the left side of the substrate 110. The wiring pattern 21 formed on the right side of the substrate 110 is used when mounting on the hybrid integrated circuit board 200 (FIG. 6C) after being integrated with the light-receiving side insulator substrate 120 shown in FIG. This is a connection terminal.

FIG. 6) is a perspective view showing the structure of an insulating substrate 120 on which a light-receiving element 3' is mounted. In the figure, an insulating substrate 120 has an inverted-shaped cross section, and wirings 23 connected to the emitter, base, and collector of a phototransistor, which is a light receiving element in the present example, are connected to the substrate 120.
It is formed so that it conforms to the right side of the

FIG. 6(C) shows the substrate 110 shown in FIG. 611a(a) and the substrate 120 shown in FIG. FIG. 2 is a perspective view showing, as an example, a photocoupler which is formed by overlapping and integrating the photocouplers so that they face each other. In the figure, 300 indicates a solder weld. In other words, the photocoupler is mounted on the hybrid integrated circuit board 200 using solder connection technology.However, it is necessary to design the wiring pattern so that the opposing positions of the light emitting element and the light receiving element are aligned. It goes without saying that the wiring patterns 21 and 23 are connected to each other by solder connection.

Note that the open surfaces on both sides of the photocoupler configured as described above are coated or sealed with resin, and are protected from the outside to prevent interference with optical coupling between the light-emitting element and the light-receiving element inside. Block out the light.

As explained above, according to the present invention, the 7-otocouplers are formed in a small size on an insulating substrate, so there is an advantage that they can be easily mounted on a so-called hybrid integrated circuit' substrate made of a ceramic substrate.

[Brief explanation of the drawing]

Figures 1(a) and Φ) are external views of typical conventional photocouplers, Figure 2 is a perspective view of an embodiment of the present invention, and Figure 3 is a flat plate insulator in Figure 2. 4 is a perspective view of the surface of the substrate; (a) is a plan view of the flat insulating substrate in FIG. 2; (b) is a front sectional view of the photocoupler shown in FIG. 2; (C) is a side sectional view; Figure 5 (a), (b
) shows other embodiments of the present invention.Front numeral description 1...Flat insulating substrate, 2...Encapsulation material, 3...Light emitting element, 3' ...... Light receiving element, 4... Light reflecting surface, 5... Light reflecting space, 10 to 14 and 21 to 23... Electrode wiring button, 20. ... Boundary between the sealing material and the light reflection space on the plane of the flat insulating substrate, 110, 120 ...
Insulator substrate, 200... Hybrid integrated circuit board, 3
00・・・Solder welding part

Claims (1)

[Scope of Claims] 1) A light-reflecting surface that is provided with a light-emitting element and a light-receiving element on the same plane of a flat insulating substrate, and also forms an electrode wiring pattern, and is spatially located between the light-emitting element and the light-receiving element. What is claimed is: 1. A photocoupler characterized in that the photocoupler is optically coupled by a light emitting element and a light receiving element, and further connects a light emitting element and a light receiving element to the electrode wiring pattern. 2) a first insulating substrate on which a light emitting element is mounted and the element is connected to an electrode wiring pattern formed on the board surface;
A second insulating substrate on which a light-receiving element is mounted and a # element connected to an electrode wiring pattern formed on the board surface is stacked and integrated so that the light-emitting element and the light-receiving element directly face each other. A photocoupler characterized by: