JPS58114047U - 半導体装置の実装構造 - Google Patents

半導体装置の実装構造

Info

Publication number
JPS58114047U
JPS58114047U JP1036582U JP1036582U JPS58114047U JP S58114047 U JPS58114047 U JP S58114047U JP 1036582 U JP1036582 U JP 1036582U JP 1036582 U JP1036582 U JP 1036582U JP S58114047 U JPS58114047 U JP S58114047U
Authority
JP
Japan
Prior art keywords
semiconductor device
mounting structure
heat dissipation
device mounting
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1036582U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0227566Y2 (en:Method
Inventor
尚 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1036582U priority Critical patent/JPS58114047U/ja
Publication of JPS58114047U publication Critical patent/JPS58114047U/ja
Application granted granted Critical
Publication of JPH0227566Y2 publication Critical patent/JPH0227566Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1036582U 1982-01-27 1982-01-27 半導体装置の実装構造 Granted JPS58114047U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1036582U JPS58114047U (ja) 1982-01-27 1982-01-27 半導体装置の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1036582U JPS58114047U (ja) 1982-01-27 1982-01-27 半導体装置の実装構造

Publications (2)

Publication Number Publication Date
JPS58114047U true JPS58114047U (ja) 1983-08-04
JPH0227566Y2 JPH0227566Y2 (en:Method) 1990-07-25

Family

ID=30023018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1036582U Granted JPS58114047U (ja) 1982-01-27 1982-01-27 半導体装置の実装構造

Country Status (1)

Country Link
JP (1) JPS58114047U (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03241795A (ja) * 1990-02-19 1991-10-28 Nec Corp 電力増幅モジュール構造

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6436349B1 (en) 1991-03-04 2002-08-20 Bayer Corporation Fluid handling apparatus for an automated analyzer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5397967U (en:Method) * 1977-01-12 1978-08-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5397967U (en:Method) * 1977-01-12 1978-08-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03241795A (ja) * 1990-02-19 1991-10-28 Nec Corp 電力増幅モジュール構造

Also Published As

Publication number Publication date
JPH0227566Y2 (en:Method) 1990-07-25

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