JPS5811244U - 加圧接触形半導体装置 - Google Patents

加圧接触形半導体装置

Info

Publication number
JPS5811244U
JPS5811244U JP10451081U JP10451081U JPS5811244U JP S5811244 U JPS5811244 U JP S5811244U JP 10451081 U JP10451081 U JP 10451081U JP 10451081 U JP10451081 U JP 10451081U JP S5811244 U JPS5811244 U JP S5811244U
Authority
JP
Japan
Prior art keywords
metal ring
semiconductor wafer
main electrode
fixed
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10451081U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6320116Y2 (enrdf_load_stackoverflow
Inventor
大館　光雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10451081U priority Critical patent/JPS5811244U/ja
Publication of JPS5811244U publication Critical patent/JPS5811244U/ja
Application granted granted Critical
Publication of JPS6320116Y2 publication Critical patent/JPS6320116Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP10451081U 1981-07-13 1981-07-13 加圧接触形半導体装置 Granted JPS5811244U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10451081U JPS5811244U (ja) 1981-07-13 1981-07-13 加圧接触形半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10451081U JPS5811244U (ja) 1981-07-13 1981-07-13 加圧接触形半導体装置

Publications (2)

Publication Number Publication Date
JPS5811244U true JPS5811244U (ja) 1983-01-25
JPS6320116Y2 JPS6320116Y2 (enrdf_load_stackoverflow) 1988-06-03

Family

ID=29899096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10451081U Granted JPS5811244U (ja) 1981-07-13 1981-07-13 加圧接触形半導体装置

Country Status (1)

Country Link
JP (1) JPS5811244U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6320116Y2 (enrdf_load_stackoverflow) 1988-06-03

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