JPS58112327A - レ−ザアニ−ル装置 - Google Patents

レ−ザアニ−ル装置

Info

Publication number
JPS58112327A
JPS58112327A JP21052481A JP21052481A JPS58112327A JP S58112327 A JPS58112327 A JP S58112327A JP 21052481 A JP21052481 A JP 21052481A JP 21052481 A JP21052481 A JP 21052481A JP S58112327 A JPS58112327 A JP S58112327A
Authority
JP
Japan
Prior art keywords
output
laser
sample
light
photo detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21052481A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0330292B2 (https=
Inventor
Akio Yamaguchi
昭夫 山口
Ryuichi Hayashi
隆一 林
Takashi Sato
孝 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP21052481A priority Critical patent/JPS58112327A/ja
Publication of JPS58112327A publication Critical patent/JPS58112327A/ja
Publication of JPH0330292B2 publication Critical patent/JPH0330292B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Electrodes Of Semiconductors (AREA)
JP21052481A 1981-12-26 1981-12-26 レ−ザアニ−ル装置 Granted JPS58112327A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21052481A JPS58112327A (ja) 1981-12-26 1981-12-26 レ−ザアニ−ル装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21052481A JPS58112327A (ja) 1981-12-26 1981-12-26 レ−ザアニ−ル装置

Publications (2)

Publication Number Publication Date
JPS58112327A true JPS58112327A (ja) 1983-07-04
JPH0330292B2 JPH0330292B2 (https=) 1991-04-26

Family

ID=16590787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21052481A Granted JPS58112327A (ja) 1981-12-26 1981-12-26 レ−ザアニ−ル装置

Country Status (1)

Country Link
JP (1) JPS58112327A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155337A (en) * 1989-12-21 1992-10-13 North Carolina State University Method and apparatus for controlling rapid thermal processing systems
EP0642846A1 (fr) * 1993-08-12 1995-03-15 ONET Société Anonyme Procédé et dispositif de décontamination autocontrôlé de surfaces par laser
JP2016127157A (ja) * 2015-01-05 2016-07-11 住友重機械工業株式会社 レーザアニール装置及び半導体素子の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102411866B1 (ko) * 2017-03-13 2022-06-22 스미도모쥬기가이고교 가부시키가이샤 레이저가공장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56137642A (en) * 1980-03-31 1981-10-27 Takashi Katoda Control method for semiconductor annealing process

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56137642A (en) * 1980-03-31 1981-10-27 Takashi Katoda Control method for semiconductor annealing process

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155337A (en) * 1989-12-21 1992-10-13 North Carolina State University Method and apparatus for controlling rapid thermal processing systems
EP0642846A1 (fr) * 1993-08-12 1995-03-15 ONET Société Anonyme Procédé et dispositif de décontamination autocontrôlé de surfaces par laser
JP2016127157A (ja) * 2015-01-05 2016-07-11 住友重機械工業株式会社 レーザアニール装置及び半導体素子の製造方法

Also Published As

Publication number Publication date
JPH0330292B2 (https=) 1991-04-26

Similar Documents

Publication Publication Date Title
US4556875A (en) Irradiated power monitoring system for optical fiber
EP0331891B1 (en) Device for laser bonding process control
FR2708143A1 (fr) Dispositif et procédé pour la fixation d'une puce d'un élément semiconducteur.
JPH02165436A (ja) レーザダイオードユニットの取り付け方法
JPS58112327A (ja) レ−ザアニ−ル装置
JP2892820B2 (ja) 半導体レーザ装置
JPH106064A (ja) レーザはんだ付け方法およびその装置
JPH04275007A (ja) レーザ加工装置
JP3776073B2 (ja) 半導体キャリアの寿命測定方法及びその装置
JP3083120B2 (ja) はんだ濡れ性評価方法とその装置
JPH07105425B2 (ja) 半絶縁材料よりなる基体を製造する方法
JPH11274654A (ja) 半導体レーザ装置
JP2548960B2 (ja) レーザ光の焦点検出方法及びレーザ光の焦点検出装置
JP2588965B2 (ja) 電界測定用プローブ
JP3221743B2 (ja) 電界型全反射測定装置
JPS56150888A (en) Semiconductor laser device
JPH0736263Y2 (ja) 焦電検出器およびこれを用いたパワーモニタ装置
JP2812157B2 (ja) レーザ加工装置
JPH0516182B2 (https=)
JP2663865B2 (ja) レーザ装置
JPS5889831A (ja) ワイヤボンデイング方法および装置
JPH01217273A (ja) 集積回路の回路試験方法
JPS6257791A (ja) レ−ザ加工機
JPH10303513A (ja) 半導体レーザ素子
JPS6388742A (ja) 試料表面観察装置