JPH0330292B2 - - Google Patents

Info

Publication number
JPH0330292B2
JPH0330292B2 JP56210524A JP21052481A JPH0330292B2 JP H0330292 B2 JPH0330292 B2 JP H0330292B2 JP 56210524 A JP56210524 A JP 56210524A JP 21052481 A JP21052481 A JP 21052481A JP H0330292 B2 JPH0330292 B2 JP H0330292B2
Authority
JP
Japan
Prior art keywords
sample
intensity
laser
laser beam
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56210524A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58112327A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP21052481A priority Critical patent/JPS58112327A/ja
Publication of JPS58112327A publication Critical patent/JPS58112327A/ja
Publication of JPH0330292B2 publication Critical patent/JPH0330292B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Electrodes Of Semiconductors (AREA)
JP21052481A 1981-12-26 1981-12-26 レ−ザアニ−ル装置 Granted JPS58112327A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21052481A JPS58112327A (ja) 1981-12-26 1981-12-26 レ−ザアニ−ル装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21052481A JPS58112327A (ja) 1981-12-26 1981-12-26 レ−ザアニ−ル装置

Publications (2)

Publication Number Publication Date
JPS58112327A JPS58112327A (ja) 1983-07-04
JPH0330292B2 true JPH0330292B2 (https=) 1991-04-26

Family

ID=16590787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21052481A Granted JPS58112327A (ja) 1981-12-26 1981-12-26 レ−ザアニ−ル装置

Country Status (1)

Country Link
JP (1) JPS58112327A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190126770A (ko) * 2017-03-13 2019-11-12 스미도모쥬기가이고교 가부시키가이샤 레이저가공장치

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155337A (en) * 1989-12-21 1992-10-13 North Carolina State University Method and apparatus for controlling rapid thermal processing systems
FR2708877B1 (fr) * 1993-08-12 1995-11-03 Onet Procédé et dispositif de décontamination autocontrôlé de surfaces par laser.
JP2016127157A (ja) * 2015-01-05 2016-07-11 住友重機械工業株式会社 レーザアニール装置及び半導体素子の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840332B2 (ja) * 1980-03-31 1983-09-05 隆 河東田 半導体のアニ−リング処理における制御方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190126770A (ko) * 2017-03-13 2019-11-12 스미도모쥬기가이고교 가부시키가이샤 레이저가공장치

Also Published As

Publication number Publication date
JPS58112327A (ja) 1983-07-04

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