JPS58110096A - Method of producing multilayer ceramic board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a method for manufacturing a multilayer ceramic substrate, and more particularly, to a manufacturing method capable of imparting high smoothness to a surface layer ceramic substrate.

(2) The upper 2ζ wood is mainly composed of the invented gastric acid (AAtOa).
In the field of electronic equipment, it is applied, for example, to insulating substrate materials for mounting electronic components, insulating substrate materials for hybrid integrated circuits, container materials for housing semiconductor elements, etc.

In the field of such electronic equipment, not only are semiconductor integrated circuit elements becoming more highly integrated, but also the conductor layer patterns formed on the surface of the insulating substrate or container are being made finer and more highly integrated. Ceramic substrates constituting substrates or containers are also required to have especially improved surface smoothness.

(3) Prior art and problems The ceramic substrate is produced by forming an unfired ceramic substrate (green sheet) by the so-called doctor blade method, and forming a conductive layer pattern on the surface of the green sheet as necessary. Further, if necessary, a plurality of such green sheets are laminated, and then the green sheets are heated and pressed, and then fired.

The multilayer ceramic substrate formed by laminating such green sheets and applying heat and pressure is required to particularly improve the smoothness of the surface layer in order to achieve finer conductor layer patterns and higher integration as described in 1. .

However, as the green sheet logging and heating/pressing method, conventionally a plurality of green sheets are laminated and the Jl. If necessary, the material is placed on a mold again via an am agent and heated and pressurized by the mold. For this reason, the surface condition of the pressurized contact surface of the mold is reflected in the surface condition of the surface layer green sheet, leading to a decrease in the smoothness of the surface layer of the laminated and integrated multilayer ceramic substrate. Ta. Therefore, it has been difficult to form a conductor layer pattern with high accuracy and high density on the surface layer of such a multilayered ceramic substrate.

(4) Purpose of the Invention The present invention provides a method for laminating a plurality of unfired sets (green sheets) and heating and pressing them to form a multilayer ceramic construction board. The object of the present invention is to provide a manufacturing method capable of imparting high smoothness to the surface layer of an embossed substrate.

(5) Structure of the Invention Therefore, according to the present invention, in the method for manufacturing a multilayer ceramic electric board, which includes a step of laminating a plurality of unfired ceramic substrates and heating and pressing the wrinkled laminate, the unfired ceramic A multi-layer ceramic board comprising a step of disposing and laminating a film body on the exposed surface of an unfired ceramic electric board, which becomes the surface layer of the multi-layer ceramic electric board, and then heating and pressurizing the film body.
A method of manufacturing a Y-type substrate is provided.

(6) Examples of the invention The present invention will be explained in detail below according to examples.

In the present invention F14, the green sheet formed on the carrier film by the doctor blade method, for example, has a smoothness of the main surface that contacts the carrier film and a smoothness of the main surface that does not contact the limb carrier film. When forming a multilayer CERASEC substrate by laminating a plurality of green sheets and heating and pressing them, two green sheets constituting the surface layer of the multilayer CERASEC substrate C)K
In this case, the carrier film is not peeled off, and the intermediate layer film is placed on the different surface side, and is laminated together with the green sheet constituting the intermediate layer and placed in the mold,
Heated and pressurized.

According to this method, the surface layer green sheet does not cause dents, slip scratches, etc. due to the presence of the carrier film.

According to the invention, first, for example, judos
100 parts by weight of a mixture of 99.5 parts by weight of silicon dioxide (Si'0s) and 0.5 parts by weight of a sintering aid such as magnesium oxide (MgO), 10 parts by weight of a mixture of polyvinylbutylene, dibutyl phthalate, etc. The ceramic slurry containing 5 parts by weight was heated to a thickness of 5 by the doctor blade method.
It is spread into a film or layer on a polyester expanded carrier film of 0 to Zoo (am) and dried to a thickness of 0.3 [
■) Form a green sheet.

Next, the green sheet along with the carrier film is cut to a desired size, for example, 200 (■)K, to prepare a predetermined number of green sheets having this size.

Next, a conductive layer pattern is formed on the main surface of the intermediate layer among the plurality of green sheets by a silk screen method or the like, and then the carrier film is removed.

Next, a predetermined number of green sheets that will become the intermediate layer and green sheets that will become the surface layer are laminated. At this time, according to the present invention, as shown in FIG. 1, green sea) 11A constituting the surface layer.

11B is laminated with carrier films 12m and 12b each on the exposed main surface. In the figure, 13A and 13B are green sheets constituting the intermediate layer, but the conductor layer pattern formed on the outer layer is omitted from illustration.

Next, the stacked green sheets are pressed using a hydraulic press or the like at a temperature of 50 (t) and a pressure of 200 (ky/k).
d) A heat and pressure treatment is performed to form an integrated green sheet laminate having a multilayer structure. Such a state is shown in FIG.

Next, the carrier films 12m and 12b on the surfaces of the surface layers Green Sea) 11A and 118 are peeled off, and then interlayer connection holes (through holes) are bored with a drill or the like, and a conductive material is filled in the interlayer connection holes. . Furthermore, if necessary, a conductive layer pattern is formed on the surface layer of the green sheet by a silk screen method or the like.

Next, the green sheet laminate is heated and fired to 1550 (C) oak in a nitrogen atmosphere to form a multilayer ceramic substrate.

The average surface roughness of the surface layer of the multilayer ceramic building board formed by such a method is 0.05 (11 m) or less. In addition, the number of dents with a depth of 5 (#+11) or more occurring on the surface layer was 1 [-] or less.

Therefore, on the surface layer of such a ceramic substrate, a thin film conductor path pattern or the like can be formed with high density and an ellipse of 111Ii.

On the other hand, when formed by the conventional method, that is, t+
The average surface roughness of the surface layer of a seven-layer substrate that is multilayered without leaving an m-layer green sheet carrier film is o, o s (*”) is a dent with a depth of 5 (#-) or more. The number of O was 3 (111/j) or more. From this amount of surface roughness, the advantages of the present invention are obvious.

In the above embodiment of the present invention, the thickness of the green sheets was the same and the number of intermediate layers was t-2, but the present invention is of course not limited to this. The film thickness and number of layers of the green sheet can be selected as appropriate.

Furthermore, prior to the lamination, a four-layer pattern may be formed on the main surface of the surface layer green sheet, which will be the exposed surface layer, if necessary. In such a case, the carrier film will be peeled off. In this case, a film body having a different surface state equivalent to that of the mosquito carrier film is placed on the exposed surface of the surface layer green sheet, laminated, heated and pressurized, and the mosquito carrier film can be used in a manner similar to the use of the carrier film. degree can be obtained.

In addition, when forming a green sheet laminate having a cavity part on the surface, an elastic body made of silicone rubber or the like is inserted into the cavity part in order to prevent the cavity part from deforming due to force pressure during lamination. Heat and pressurize and remove with laminating machine.

INK, according to the present invention, since the carrier film serves as a mold release agent after lamination, the mold release of the green sheet laminate is extremely good.
Even in processing steps such as cutting of such a green sheet laminate, in order to carry out the processing step with the carrier 7) shim attached, it is necessary to prevent dust from adhering to the surface of the green sheet laminate, hot water, etc. (6) Effects of the Invention As described above, according to the present invention, the surface layer of the laminated green sheets can maintain an extremely high level of smoothness,
The conductive layer pattern formed on the surface of such a green sheet laminate or the surface of a multilayer ceramic substrate formed by firing the green sheet laminate can be easily miniaturized and highly integrated.

[Brief explanation of drawings]

FIGS. 1 and 2 are cross-sectional views showing a part of the manufacturing process of a multilayer ceramic board according to the present invention.
IIA, IIB...Unfired ceramic substrate constituting the surface layer, 12m, 12b...Carrier film, 13A, 13B...Unfired ceramic two-piece substrate constituting the intermediate layer. 0

Claims (1)

[Claims] In a method for manufacturing a multilayer ceramic substrate, which includes a step of laminating a plurality of unfired ceramic substrates and heating and pressing the laminate, the unfired ceramic substrate, which becomes the IIWJ layer of the multilayer ceramic substrate, is provided. 1. A method for manufacturing a multi-layered thermostatic substrate, comprising the steps of: arranging and laminating an exposed mK film body on an upper humic substrate, and then heating and pressing them.