JP2005056977A - Method for manufacturing laminated ceramic substrate and dielectric lamination device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated ceramic substrate that is provided with a cavity for preventing a crack generating on a boundary surface between the cavity and a bottom surface, as well as a dielectric lamination device. <P>SOLUTION: The manufacturing method includes a step to manufacture a green sheet laminated body formed of an adhesive layer that is imprinted from a base film and arranged on at least one main surface of a calcinated ceramic substrate, a plurality of first ceramic green sheet layers wherein cavities 21 are formed and a second ceramic green sheet layer that is not sintered at such a temperature that the first ceramic green sheet layer can be sintered, and a step for recalcination at a temperature that the first ceramic green sheet layer can be sintered and the second ceramic green sheet layer cannot be sintered. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a multilayer ceramic substrate on which chip components, semiconductor devices, and the like are mounted, and particularly to a method for manufacturing a multilayer ceramic substrate with a cavity and a dielectric multilayer device.

  Multilayer ceramic substrates have been put into practical use as important electronic components for mounting semiconductor devices at high density. Particularly recently, a technique for realizing higher density mounting by providing a cavity in this multilayer ceramic substrate and mounting a bare chip semiconductor device in the cavity has begun to be put into practical use.

  In general, a method for manufacturing a multilayer ceramic substrate is often manufactured by a method of stacking ceramic green sheets. In this method, via holes are formed in a plurality of ceramic green sheets, electrode patterns and via hole electrodes are printed by using an electrode paste, and then these ceramic green sheets are laminated by thermocompression bonding and then fired under predetermined firing conditions. Thus, a multilayer ceramic substrate is obtained.

  Next, a method for manufacturing a multilayer ceramic substrate having a cavity will be described. First, as a first method, a method is proposed in which hole-filling printing is performed with a shrinkage-suppressing material that can be removed after a sintering process in a through-hole serving as a cavity layer.

  In this method, in order to increase the productivity while ensuring the dimensional accuracy of a sintered body having a complicated shape, a plurality of green sheets formed of ceramic or glass are finally manufactured at each part of the sintered body. After punching into a shape that matches the cross-sectional shape, a hole filling material such as a thick film paste that can be removed by a blasting process or a wet process after the sintering process is filled in the punched holes of each green sheet by screen printing or the like. Next, each green sheet is laminated and thermocompression bonded, and then the laminated body is sintered while being pressed to produce a sintered body with a hole filling material.

  Thereafter, a method for producing a sintered body of a laminated body having a complex shape while ensuring dimensional accuracy by using the hole filling material by removing the hole filling material from the sintered body by blasting or wet processing has been proposed ( For example, see Patent Document 1).

  Next, the second method is to form a cavity on a fired substrate that has been fired in advance so that the bottom surface of the cavity of the ceramic multilayer substrate with the cavity does not warp convexly and can be manufactured with high dimensional accuracy. One or a plurality of unfired low-temperature fired ceramic green sheets with openings for use are laminated and thermocompression bonded to produce a laminate.

Thereafter, a constraining ceramic green sheet formed of a ceramic material that is not sintered at the sintering temperature of the low-temperature fired ceramic green sheet is laminated and thermocompression bonded to both surfaces of the laminate. Next, in this state, after firing at a sintering temperature of 800 to 1000 ° C., which is the sintering temperature of the low-temperature fired ceramic green sheet, the residual ceramic green sheet (ceramic powder) adhering to both surfaces of the fired substrate is blasted. A method of removing by buffing or the like has been proposed. By this manufacturing method, a method capable of manufacturing a ceramic multilayer substrate with a cavity without delamination or warping has been proposed (see, for example, Patent Document 2).
JP 2002-121078 A JP 2003-158375 A

  However, when the cavity depth is increased in the method disclosed in Patent Document 1, the aspect ratio becomes large. Therefore, it is necessary to strictly manage the grinding conditions such as pressure under the blasting conditions for removing the shrinkage suppression material inside the cavity. However, there is a problem that the substrate layer on the upper surface of the cavity is damaged by grinding.

  Moreover, in the construction method of Patent Document 2, when a low-temperature fired ceramic material using a glass having a softening point that is lower by 50 ° C. to 100 ° C. than the firing temperature is used for the low-temperature fired ceramic green sheet layer, the thickness direction suddenly approaches the firing temperature Due to firing shrinkage to the surface, peeling and cracking cannot be suppressed.

  The present invention solves the above-mentioned problems and realizes a method for manufacturing a multilayer ceramic substrate that suppresses peeling between the fired ceramic substrate and the ceramic green sheet layer, and in particular cracks generated at the interface between the cavity and the bottom surface. An object of the present invention is to provide a method for manufacturing a multilayer ceramic substrate having a cavity to be suppressed and a dielectric multilayer device.

  In order to achieve the above object, the present invention has the following configuration.

  The invention according to claim 1 of the present invention is a fired ceramic substrate, an adhesive layer transferred from a base film on at least one main surface of the fired ceramic substrate, and disposed on the adhesive layer. A plurality of first ceramic green sheet layers forming a formed cavity, and a second ceramic green sheet layer disposed on the first ceramic green sheet layer that is not sintered at a temperature at which the first ceramic green sheet layer is sintered At least a step of producing a green sheet laminate comprising a ceramic green sheet layer and a step of re-firing at a temperature at which the first ceramic green sheet layer is sintered and the second ceramic green sheet layer is not sintered. A method of manufacturing a multilayer ceramic substrate that suppresses the separation of the fired ceramic substrate and the ceramic green sheet layer. And it is possible to provide a manufacturing method of a multilayer ceramic substrate which can suppress cracks generated at the interface between the bottom surface when provided with cavities.

  Invention of Claim 2 of this invention is a manufacturing method of the laminated ceramic board | substrate of Claim 1 which made the thickness of the contact bonding layer 0.5-5.0 micrometers, the sintered ceramic board | substrate and the ceramic green sheet layer It is possible to provide a method for manufacturing a multilayer ceramic substrate that can reliably suppress the peeling.

  Invention of Claim 3 of this invention is a manufacturing method of the multilayer ceramic substrate of Claim 1 which uses either a butyral resin or an acrylic resin for an adhesive layer, The multilayer ceramic excellent in transferability and adhesiveness A method for manufacturing a substrate can be provided.

  Invention of Claim 4 of this invention is a manufacturing method of the multilayer ceramic substrate of Claim 1 whose heat deformation temperature of a base film is 100 degrees C or less, and is performed, adding heat at the time of transcription | transfer with a press etc. Therefore, it is possible to easily follow the unevenness of the electrodes on the fired ceramic substrate, so that it is possible to realize a base film with more excellent transferability.

  Invention of Claim 5 of this invention is a manufacturing method of the laminated ceramic substrate of Claim 1 which disperse | distributes the glass powder whose glass softening point is 600 degrees C or less to an contact bonding layer, and is an organic binder component in an adhesive agent. Is a laminate that can suppress delamination from the ceramic green sheet layer by adding glass that softens immediately after burning during firing, thereby acting as an adhesive component until the first ceramic green sheet layer starts firing shrinkage A method for manufacturing a ceramic substrate can be provided.

  Invention of Claim 6 of this invention is a manufacturing method of the multilayer ceramic substrate of Claim 5 whose content of glass powder is 5 to 30 weight%, and is more ceramic green, without impairing transferability. It is possible to provide a method for manufacturing a multilayer ceramic substrate capable of suppressing separation from the sheet layer.

  Invention of Claim 7 of this invention is a manufacturing method of the multilayer ceramic substrate of Claim 1 which forms a cavity in the green sheet laminated body of the 2nd ceramic green sheet layer, It is possible to provide a method for manufacturing a multilayer ceramic substrate having a cavity with excellent productivity that does not occur.

  The invention according to claim 8 of the present invention is the method for producing a multilayer ceramic substrate according to claim 1, wherein the firing temperature for re-firing is fired at a temperature higher than the firing temperature of the fired ceramic substrate. It is possible to provide a method for manufacturing a multilayer ceramic substrate capable of enhancing the bonding property with the ceramic green sheet layer.

  The invention according to claim 9 of the present invention is the method for producing a multilayer ceramic substrate according to claim 1, wherein the temperature increase rate of refiring is slower than the temperature increase rate during firing of the fired ceramic substrate. Since the rate of firing shrinkage of the combined green sheet laminate can be reduced, it is possible to provide a method for manufacturing a multilayer ceramic substrate that can suppress peeling.

  The invention according to claim 10 of the present invention is a dielectric multilayer device manufactured by the manufacturing method according to claims 1 to 9, and obtains a multilayer ceramic substrate with a cavity excellent in planar accuracy and flatness. Therefore, it is possible to realize a dielectric laminated device in which semiconductor bare chip mounting, chip parts and the like are mounted with high density.

  As described above, according to the present invention, a fired ceramic substrate is prepared in advance, a first ceramic green sheet layer is laminated on the fired ceramic substrate via an adhesive layer, and a second ceramic is further formed thereon. By laminating the green sheet layer and then performing refiring, a multilayer ceramic substrate with a cavity without cracks can be obtained without peeling between the first ceramic green sheet layer and the fired ceramic substrate.

(Embodiment 1)
Hereinafter, claims 1 to 3, 7, 8, and 10 of the present invention will be described using the first embodiment with reference to the drawings.

  FIGS. 1-11 is sectional drawing of the process for demonstrating the manufacturing method of the laminated ceramic substrate in this Embodiment 1. FIGS.

  1 to 4 show a method for producing a fired ceramic substrate. In FIGS. 1 to 4, reference numeral 11 denotes a first ceramic green sheet layer containing a glass component in an inorganic powder such as aluminum oxide. Is a second ceramic green sheet layer containing an inorganic powder such as aluminum oxide, and 13a, 13b, 13c are Ag, Pt, Pd, Cu, W, Mo, Ni, etc., and the first ceramic green sheet layer 11 is an electrode that is sintered at a temperature at which 11 is sintered. Reference numeral 14 denotes an insulator formed by printing using the same material as that constituting the first ceramic green sheet layer 11.

  FIG. 1 is a view for explaining a laminated structure of ceramic green sheets for explaining each layer constituting a fired ceramic substrate.

  First, a glass component is added to an inorganic powder such as aluminum oxide, an organic binder and a plasticizer are mixed to produce a ceramic slurry, and then a first ceramic green having a predetermined thickness using a green sheet molding method. The sheet layer 11 is produced. Since the first ceramic green sheet layer 11 includes a glass component, the first ceramic green sheet layer 11 has a low sintering temperature so that it can be simultaneously sintered with a low-resistance conductor material. Moreover, the thickness can be suitably selected in the range of about 5 to 300 μm.

  Next, via holes are formed in the first ceramic green sheet layer 11 by punching or laser processing, and an electrode paste is embedded in the via holes to form electrodes (vias) 13c. Further, an electrode 13b for forming a wiring, a capacitor, an inductor and the like is formed on the surface of the first ceramic green sheet layer 11 by screen printing or the like.

  Next, an inorganic binder such as aluminum oxide is mixed with an organic binder and a plasticizer to produce the second ceramic green sheet layer 12. The sintering temperature of the second ceramic green sheet layer 12 is higher than the sintering temperature of the first ceramic green sheet layer 11 and hardly shrinks at the sintering temperature of the first ceramic green sheet layer 11.

  Next, an insulator 14 is produced by applying an insulating paste to a required portion with a thickness of 20 to 50 μm on one surface of at least one second ceramic green sheet layer 12 by screen printing or the like.

  Next, an electrode 13 a is formed on the second ceramic green sheet layer 12 so as to cover the end portion of the insulator 14.

  Thereafter, as shown in FIG. 1, these materials are aligned so that the electrode 13a and the electrodes 13b and 13c are securely connected on the second ceramic green sheet layer 12 on which the insulator 14 and the electrode 13a are formed. Then, the first ceramic green sheet layer 11 is laminated, and then thermocompression bonded and integrated. The electrode 13a is printed on the outermost layer.

  Then, the insulator 14 and the second ceramic green sheet layer 12 not formed with the electrode 13a are laminated on the electrode 13a formed on the outermost layer, and then thermocompression bonded and integrated, as shown in FIG. Such a laminated body block is produced.

  Next, the laminated body block is heated at a temperature at which the second ceramic green sheet layer 12 is not sintered and at which the first ceramic green sheet layer 11 and the electrodes 13a, 13b, and 13c are sintered (first ceramic green sheet). The sintered body 15 shown in FIG. 3 is obtained by firing at a temperature 10 to 50 ° C. lower than the temperature at which the sheet layer 11 is sintered. Under this firing condition, the second ceramic green sheet layer 12 hardly undergoes firing shrinkage, and therefore, the first ceramic green sheet layer 11 that is intended to shrink by sintering is restrained from shrinking in the planar direction. Therefore, the shrinkage of the first ceramic green sheet layer 11 in the planar direction is suppressed, so that the dimensional accuracy can be maintained with high accuracy.

  Thereafter, by removing only the unsintered second ceramic green sheet layer 12, it is possible to obtain a fired ceramic substrate 16 having excellent planar dimensional accuracy and flatness as shown in FIG.

  The process so far has been described by using a non-shrinkable firing process as an example, but the fired ceramic substrate 16 is not limited to the non-shrink firing.

  Next, a method for manufacturing a multilayer ceramic substrate having a cavity will be described with reference to FIGS.

  5 to 10, reference numeral 17 denotes an adhesive layer, and reference numeral 18 denotes silicon rubber for uniformly transferring the adhesive layer 17. 19 is a sintered body provided with a cavity, 20 is a laminated ceramic substrate with a cavity, and 21 is a cavity.

  FIG. 5 is a cross-sectional view for explaining a method for transferring the adhesive layer 17. First, a method for producing the adhesive layer 17 will be described.

  As the adhesive used for the adhesive layer 17, polyvinyl butyral resin and acrylic resin are optimal from the viewpoint of adhesiveness and thermal decomposability, and these resin components can be prepared by dissolving them in an organic solvent. A plasticizer such as benzyl butyl acid may be added. The adhesive layer 17 is prepared by coating the component of the adhesive layer 17 on a polyethylene film or polypropylene film having a thickness of about 50 μm while controlling the thickness by a method such as gravure printing using a base film (not shown) as a base film. To do. This adhesive layer 17 serves to enhance the adhesion by being interposed between the fired ceramic substrate 16 and the first ceramic green sheet layer 11 laminated thereon, and is decomposed and disappears after firing. Is.

  The adhesive layer 17 has adhesiveness and is very thin, so that the handling is complicated as it is. Therefore, handling can be facilitated by forming the adhesive layer 17 on a film-like base film having a certain thickness. At this time, by providing the base film with releasability, it can be easily peeled off from the adhesive layer 17 after transfer.

  As a result of examining the optimum thickness of the adhesive layer 17, it was found that the optimum thickness of the adhesive layer 17 is in the range of 0.5 to 5.0 μm. When the thickness is less than 0.5 μm, the followability to the unevenness is lowered, so that the adhesion is insufficient. When the thickness is more than 5.0 μm, the adhesion is sufficient, but the sintered ceramic substrate 16 and the first It was found that a gap was generated at the interface with the ceramic green sheet layer 11 and the bondability was lowered.

  Further, it has been found that it is effective to add a glass component into the adhesive layer 17 in order to further improve the bondability in the firing process between the fired ceramic substrate 16 and the first ceramic green sheet layer 11. . Furthermore, the addition amount of the glass component is preferably 5 to 30% by weight, more preferably 10 to 20% by weight with respect to the resin component, having an average particle size of about 1 to 2 μm.

  Next, a method for transferring the adhesive layer 17 onto the fired ceramic substrate 16 will be described with reference to FIG. As shown in FIG. 5, elastic silicon rubber 18 is disposed on both sides. This is to prevent the adhesive layer 17 from being damaged in the fired ceramic substrate 16 or to form the adhesive layer 17 with high accuracy without unevenness.

After arranging the adhesive layer 17 to face one side of the ceramic substrate 16 where the cavities 21 are formed, silicon rubber 18 is arranged on both sides, and transfer conditions: pressure; 10-50 kg / cm ² , temperature; Transfer press at 70-150 ° C. Thereafter, the base film is peeled off from the adhesive layer 17 so that the adhesive layer 17 can be transferred onto the fired ceramic substrate 16 without unevenness.

  Next, as shown in FIG. 6, an unfired green sheet laminate for forming the cavity 21 is produced.

  First, a hole for providing a cavity 21 is formed in each layer of the first ceramic green sheet layer 11 by mechanical punching or laser processing, and the via paste is printed by embedding only the via hole through a metal mask or the like. What formed the electrode 13c is made. Further, if necessary, an electrode 13b for forming a wiring, a capacitor element 23, an inductor element 24 and the like is formed on the surface of the first ceramic green sheet layer 11 at a predetermined location by screen printing or the like.

  Next, the second ceramic green sheet layer 12 is laminated while being aligned with the outermost layer of the first ceramic green sheet layer 11, and is integrated by heating and pressurizing to produce a green sheet laminate. can do. At this time, depending on the shape of the cavity 21, the second ceramic green sheet layer 12 may be laminated to completely close the cavity 21, which may cause blistering in the subsequent process. As a countermeasure, the second ceramic green sheet layer 12 is formed with a cavity 22 having the same shape as the hole for the cavity 21 or smaller than the shape of the cavity 21 after firing by mechanical punching or laser processing, etc. A green sheet stack that does not cause blistering as shown in FIG. 7 is formed by stacking while aligning with the outermost surface layer of the first ceramic green sheet layer 11 on which the body 14 is formed, and by heating and pressurizing and integrating. The body can be made.

  Next, as shown in FIG. 8, the green sheet laminate formed in FIG. 7 is laminated on the fired ceramic substrate 16 on which an adhesive layer 17 (not shown) is formed on the surface while being aligned. Create a body block.

  Next, the laminate block shown in FIG. 8 is heated to a temperature at which the second ceramic green sheet layer 12 does not sinter, a temperature higher than the fired ceramic substrate 16, and the first ceramic green sheet layer 11 and the electrodes 13a, Sintered body 19 shown in FIG. 9 is obtained by firing at a temperature at which 13b and 13c are sintered.

  Thereafter, the unsintered second ceramic green sheet layer 12 is removed by sandblasting or the like, whereby the multilayer ceramic substrate 20 with a cavity in which the cavity 21 shown in FIG. 10 is formed can be produced. Here, reference numeral 23 denotes a capacitor element, and reference numeral 24 denotes a coil element, whereby the multilayer ceramic substrate 20 with a cavity incorporating a passive component can be manufactured.

  Further, by forming the first ceramic green sheet layer 11 of the multilayer ceramic substrate 20 with cavities shown in FIG. 10 using a dielectric ceramic material, an excellent dielectric that is an application example of the multilayer ceramic substrate 20 with cavities is provided. It can be a laminated device.

  In addition, the first ceramic green sheet layer 11 is bonded to only one side of the fired ceramic substrate 16, but the first ceramic green sheet layer 11 is bonded to both sides, whereby a cavity is formed on both sides of the fired ceramic substrate 16. 21 may be formed. Furthermore, although the cavity 21 is composed of one stage, it is also possible to form a multistage cavity by laminating the laminated body of the first ceramic green sheet layers 11 and repeating refiring.

  The front and back electrodes 13a are generally subjected to Ni—Au plating or the like to ensure solder wettability.

  Next, as shown in FIG. 11, a semiconductor chip 25 is bare-chip mounted in a cavity 21 of a multilayer ceramic substrate 20 with a cavity manufactured by the above-described manufacturing method, and in some cases, a SAW filter, chip component, diode is mounted on the surface. A dielectric multilayer device having a small size and excellent characteristics, which is an application example of a multilayer ceramic substrate 20 with a cavity, is obtained by mounting a semiconductor such as dicing into pieces by dicing or the like and mounting on a circuit board or the like. Can do.

(Embodiment 2)
Hereinafter, claims 4, 5 and 6 of the present invention will be described using the second embodiment.

  A ceramic laminated substrate having a thickness of 0.6 mm is prepared as the fired ceramic substrate 16, and the transfer property to the fired ceramic substrate 16 when the base film on which the adhesive layer 17 is applied and formed under various conditions is refired. The results of investigating the bondability and the like are shown in Table 1.

  In addition, only the butyral resin component as a component of the adhesive layer 17 was found to be a material that peels off without being bonded in the first ceramic green sheet layer 11 bonded after re-firing. As a countermeasure, the effect of adding glass having various glass softening points to the butyral resin, which is the main component of the adhesive layer 17, in order to enhance the bonding property during firing to the adhesive layer 17 was confirmed. The examination results are shown in (Table 1).

  From the results of (Table 1), with the base film using PET, the transfer temperature does not transfer well at 100 ° C. (Comparative Example 1). It was not possible to reliably transfer the entire substrate 16 (Comparative Example 2). In addition, the transfer was performed in the same manner for the sample in which the electrode was formed on the surface of the fired ceramic substrate 16, but the transfer was insufficient because the base film could not follow the unevenness of the electrode well. (Comparative Example 1 and Comparative Example 2).

  On the other hand, when polyethylene is used for the base film, the polyethylene easily undergoes thermal deformation at about 100 ° C., so the followability to the flatness of the fired ceramic substrate 16 is improved, and the transferability is very good. (Example 1). As a base film capable of obtaining the same effect, polypropylene was able to obtain the same transferability.

  In addition, it is considered that glass is added to the adhesive layer 17, and when glass having a glass softening point of 600 ° C. or higher is peeled off (Comparative Example 3), glass having a temperature of 600 ° C. or lower is added. As a result, a great improvement effect was obtained with respect to the bondability between the fired ceramic substrate 16 and the first ceramic green sheet layer 11 (Example 2 and Example 3).

  Next, as a result of examining the amount of glass powder having a glass softening point of 600 ° C. or less, good transferability and bondability were obtained when the glass powder content was in the range of 5 to 30% by weight. When the content of the glass powder is less than 5%, the effect of improving the bondability cannot be expected, and when the content exceeds 30%, the transferability and the adhesiveness are deteriorated.

(Embodiment 3)
The ninth aspect of the present invention will be described below using the third embodiment.

  A multilayer ceramic substrate having a thickness of 0.6 mm is prepared as the fired ceramic substrate 16, and a plurality of first ceramic green sheet layers 11 are bonded to each other through the adhesive layer 17 so as to have a thickness of 1.0 mm. The firing temperature increase rate was examined to confirm the bondability and the presence of cracks. The fired ceramic substrate 16 is fired at a rate of 3, 5 and 7 ° C./min, respectively, and is refired at a firing rate of 3, 5 and 7 ° C./min. went. However, when refired under these conditions, a large crack was generated in the bonded first ceramic green sheet layer 11 and peeling occurred.

  Therefore, cracks and delamination occur when the firing temperature rise rate during refiring is 1.5, 2.5, and 3.5 ° C./min, which is lower than the firing temperature of the fired ceramic substrate 16. No significant effect was obtained on the bondability. As a result of the examination, it is possible to produce a multilayer ceramic substrate in which cracking and peeling do not occur by making the temperature increase rate of refiring slower than the temperature rising rate at the time of firing the fired ceramic substrate 16, more preferably refired. It is preferable that the rate of temperature rise is set to 1/2 or less of the rate of temperature rise during firing of the fired ceramic substrate 16.

  A method for manufacturing a multilayer ceramic substrate and a dielectric multilayer device according to the present invention are prepared by firing a fired multilayer ceramic substrate, laminating a green sheet on a multilayer ceramic substrate through an adhesive added with glass, and refiring. By doing so, there is an effect that it is possible to provide a manufacturing method of a multilayer ceramic substrate and a dielectric multilayer device without cracks without peeling between a green sheet and a fired ceramic substrate, and mounting a semiconductor or the like This is useful for high-density mounting module substrates.

Sectional drawing of the process for demonstrating the manufacturing method of the laminated ceramic substrate in Embodiment 1 of this invention Cross section Cross section Cross section Cross section Cross section Cross section Cross section Cross section Sectional drawing of the multilayer ceramic substrate with a cavity in Embodiment 1 of this invention Cross section of the same dielectric laminated device

Explanation of symbols

11 First ceramic green sheet layer 12 Second ceramic green sheet layer 13a Electrode 13b Electrode 13c Electrode (via)
DESCRIPTION OF SYMBOLS 14 Insulator 15 Sintered body 16 Sintered ceramic substrate 17 Adhesive layer 18 Silicon rubber 19 Sintered body 20 Multilayer ceramic substrate with cavity 21 Cavity 22 Cavity 23 Capacitor element 24 Coil element 25 Semiconductor chip

Claims (10)

A fired ceramic substrate, an adhesive layer transferred from a base film and disposed on at least one main surface of the fired ceramic substrate, and a plurality of first ceramics forming a cavity disposed on the adhesive layer A green sheet laminate comprising a green sheet layer and a second ceramic green sheet layer that is not sintered at a temperature at which the first ceramic green sheet layer disposed on the first ceramic green sheet layer is sintered. A method for producing a multilayer ceramic substrate, comprising at least a step of producing, and a step of refiring at a temperature at which the first ceramic green sheet layer is sintered and the second ceramic green sheet layer is not sintered. The method for producing a multilayer ceramic substrate according to claim 1, wherein the thickness of the adhesive layer is 0.5 to 5.0 μm. The method for producing a multilayer ceramic substrate according to claim 1, wherein either a butyral resin or an acrylic resin is used for the adhesive layer. The method for producing a multilayer ceramic substrate according to claim 1, wherein the base film has a heat deformation temperature of 100 ° C. or lower. The method for producing a multilayer ceramic substrate according to claim 1, wherein glass powder having a glass softening point of 600 ° C. or less is dispersed in the adhesive layer. The method for producing a multilayer ceramic substrate according to claim 5, wherein the content of the glass powder is 5 to 30% by weight. The method for manufacturing a multilayer ceramic substrate according to claim 1, wherein a cavity is formed in the green sheet laminate of the second ceramic green sheet layer. The method for producing a multilayer ceramic substrate according to claim 1, wherein the firing temperature for refiring is fired at a temperature higher than the firing temperature of the fired ceramic substrate. The method for producing a multilayer ceramic substrate according to claim 1, wherein the temperature increase rate of refiring is slower than the temperature increase rate during firing of the fired ceramic substrate. A dielectric laminated device manufactured by the manufacturing method according to claim 1.

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