JPS58106848A - 低寄生容量半導体装置およびその製造方法 - Google Patents
低寄生容量半導体装置およびその製造方法Info
- Publication number
- JPS58106848A JPS58106848A JP57213440A JP21344082A JPS58106848A JP S58106848 A JPS58106848 A JP S58106848A JP 57213440 A JP57213440 A JP 57213440A JP 21344082 A JP21344082 A JP 21344082A JP S58106848 A JPS58106848 A JP S58106848A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- substrate
- chip
- wafer
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/50—PIN diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/60—Schottky-barrier diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
Landscapes
- Electrodes Of Semiconductors (AREA)
- Element Separation (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8123027A FR2517884A1 (fr) | 1981-12-09 | 1981-12-09 | Dispositif semi-conducteur a faible capacite parasite muni de connexions externes prises au moyen de poutres et procede de fabrication d'un tel dispositif |
| FR8123027 | 1981-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58106848A true JPS58106848A (ja) | 1983-06-25 |
Family
ID=9264839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57213440A Pending JPS58106848A (ja) | 1981-12-09 | 1982-12-07 | 低寄生容量半導体装置およびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0081423B1 (enExample) |
| JP (1) | JPS58106848A (enExample) |
| DE (1) | DE3267184D1 (enExample) |
| FR (1) | FR2517884A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2536211B1 (fr) * | 1982-11-16 | 1986-02-07 | Thomson Csf | Structure de diode hyperfrequences dont les connexions exterieures sont prises par deux poutres metalliques |
| GB2137412B (en) * | 1983-03-15 | 1987-03-04 | Standard Telephones Cables Ltd | Semiconductor device |
| FR2561444B1 (fr) * | 1984-03-16 | 1986-09-19 | Thomson Csf | Dispositif semi-conducteur hyperfrequence a connexions externes prises au moyen de poutres |
| US4809052A (en) * | 1985-05-10 | 1989-02-28 | Hitachi, Ltd. | Semiconductor memory device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4180422A (en) * | 1969-02-03 | 1979-12-25 | Raytheon Company | Method of making semiconductor diodes |
| GB2067354B (en) * | 1980-01-09 | 1984-04-18 | Aei Semiconductors Ltd | Mounting for a sc device |
-
1981
- 1981-12-09 FR FR8123027A patent/FR2517884A1/fr active Granted
-
1982
- 1982-11-30 EP EP82402182A patent/EP0081423B1/fr not_active Expired
- 1982-11-30 DE DE8282402182T patent/DE3267184D1/de not_active Expired
- 1982-12-07 JP JP57213440A patent/JPS58106848A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| FR2517884A1 (fr) | 1983-06-10 |
| EP0081423B1 (fr) | 1985-10-30 |
| DE3267184D1 (en) | 1985-12-05 |
| EP0081423A1 (fr) | 1983-06-15 |
| FR2517884B1 (enExample) | 1985-05-17 |
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