JPS5810369Y2 - 多層配線基板 - Google Patents

多層配線基板

Info

Publication number
JPS5810369Y2
JPS5810369Y2 JP1977115025U JP11502577U JPS5810369Y2 JP S5810369 Y2 JPS5810369 Y2 JP S5810369Y2 JP 1977115025 U JP1977115025 U JP 1977115025U JP 11502577 U JP11502577 U JP 11502577U JP S5810369 Y2 JPS5810369 Y2 JP S5810369Y2
Authority
JP
Japan
Prior art keywords
multilayer wiring
wiring board
power supply
chip
supply pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977115025U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5442971U (enrdf_load_stackoverflow
Inventor
俊 中原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1977115025U priority Critical patent/JPS5810369Y2/ja
Publication of JPS5442971U publication Critical patent/JPS5442971U/ja
Application granted granted Critical
Publication of JPS5810369Y2 publication Critical patent/JPS5810369Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Structure Of Printed Boards (AREA)
JP1977115025U 1977-08-26 1977-08-26 多層配線基板 Expired JPS5810369Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977115025U JPS5810369Y2 (ja) 1977-08-26 1977-08-26 多層配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977115025U JPS5810369Y2 (ja) 1977-08-26 1977-08-26 多層配線基板

Publications (2)

Publication Number Publication Date
JPS5442971U JPS5442971U (enrdf_load_stackoverflow) 1979-03-23
JPS5810369Y2 true JPS5810369Y2 (ja) 1983-02-25

Family

ID=29066296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977115025U Expired JPS5810369Y2 (ja) 1977-08-26 1977-08-26 多層配線基板

Country Status (1)

Country Link
JP (1) JPS5810369Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5715106U (enrdf_load_stackoverflow) * 1980-02-28 1982-01-26

Also Published As

Publication number Publication date
JPS5442971U (enrdf_load_stackoverflow) 1979-03-23

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