JPS5810302A - 導電ペ−スト - Google Patents
導電ペ−ストInfo
- Publication number
- JPS5810302A JPS5810302A JP10853481A JP10853481A JPS5810302A JP S5810302 A JPS5810302 A JP S5810302A JP 10853481 A JP10853481 A JP 10853481A JP 10853481 A JP10853481 A JP 10853481A JP S5810302 A JPS5810302 A JP S5810302A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- powder
- conductive paste
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000843 powder Substances 0.000 claims description 34
- 239000011521 glass Substances 0.000 claims description 16
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 12
- 229910000510 noble metal Inorganic materials 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 11
- 238000010304 firing Methods 0.000 description 10
- 238000007747 plating Methods 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910000416 bismuth oxide Inorganic materials 0.000 description 3
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- -1 resistors Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229940116411 terpineol Drugs 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10853481A JPS5810302A (ja) | 1981-07-10 | 1981-07-10 | 導電ペ−スト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10853481A JPS5810302A (ja) | 1981-07-10 | 1981-07-10 | 導電ペ−スト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5810302A true JPS5810302A (ja) | 1983-01-20 |
| JPH0143403B2 JPH0143403B2 (enrdf_load_stackoverflow) | 1989-09-20 |
Family
ID=14487241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10853481A Granted JPS5810302A (ja) | 1981-07-10 | 1981-07-10 | 導電ペ−スト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5810302A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS644150U (enrdf_load_stackoverflow) * | 1987-06-25 | 1989-01-11 | ||
| US4894184A (en) * | 1986-08-27 | 1990-01-16 | The Furukawa Electric Co., Ltd. | Low-temperature burnt conductive paste and method of manufacturing printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49116574A (enrdf_load_stackoverflow) * | 1973-03-14 | 1974-11-07 | ||
| JPS5251413A (en) * | 1975-10-23 | 1977-04-25 | Okuno Chem Ind Co | Composite of enameled glass |
| JPS5585439A (en) * | 1978-09-18 | 1980-06-27 | Toshiba Corp | Glass adhering conductor paste |
-
1981
- 1981-07-10 JP JP10853481A patent/JPS5810302A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49116574A (enrdf_load_stackoverflow) * | 1973-03-14 | 1974-11-07 | ||
| JPS5251413A (en) * | 1975-10-23 | 1977-04-25 | Okuno Chem Ind Co | Composite of enameled glass |
| JPS5585439A (en) * | 1978-09-18 | 1980-06-27 | Toshiba Corp | Glass adhering conductor paste |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4894184A (en) * | 1986-08-27 | 1990-01-16 | The Furukawa Electric Co., Ltd. | Low-temperature burnt conductive paste and method of manufacturing printed circuit board |
| JPS644150U (enrdf_load_stackoverflow) * | 1987-06-25 | 1989-01-11 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0143403B2 (enrdf_load_stackoverflow) | 1989-09-20 |
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