JPS58100995A - 低融点ろう材とその使用方法 - Google Patents

低融点ろう材とその使用方法

Info

Publication number
JPS58100995A
JPS58100995A JP19775081A JP19775081A JPS58100995A JP S58100995 A JPS58100995 A JP S58100995A JP 19775081 A JP19775081 A JP 19775081A JP 19775081 A JP19775081 A JP 19775081A JP S58100995 A JPS58100995 A JP S58100995A
Authority
JP
Japan
Prior art keywords
brazing filler
filler metal
copper
weight
joining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19775081A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6340639B2 (ru
Inventor
Akira Kumagai
昭 熊谷
Kunio Miyazaki
邦夫 宮崎
Tateo Tamamura
玉村　建雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP19775081A priority Critical patent/JPS58100995A/ja
Publication of JPS58100995A publication Critical patent/JPS58100995A/ja
Publication of JPS6340639B2 publication Critical patent/JPS6340639B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
JP19775081A 1981-12-10 1981-12-10 低融点ろう材とその使用方法 Granted JPS58100995A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19775081A JPS58100995A (ja) 1981-12-10 1981-12-10 低融点ろう材とその使用方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19775081A JPS58100995A (ja) 1981-12-10 1981-12-10 低融点ろう材とその使用方法

Publications (2)

Publication Number Publication Date
JPS58100995A true JPS58100995A (ja) 1983-06-15
JPS6340639B2 JPS6340639B2 (ru) 1988-08-11

Family

ID=16379716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19775081A Granted JPS58100995A (ja) 1981-12-10 1981-12-10 低融点ろう材とその使用方法

Country Status (1)

Country Link
JP (1) JPS58100995A (ru)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6530514B2 (en) * 2001-06-28 2003-03-11 Outokumpu Oyj Method of manufacturing heat transfer tubes
US7461770B2 (en) 2003-08-04 2008-12-09 Vacuumschmelze Gmbh & Co. Kg Copper-based brazing alloy and brazing process
EP2813792A1 (en) 2013-06-14 2014-12-17 Mitsubishi Electric Corporation Twisted tube heat exchanger and method for manufacturing twisted tube heat exchanger
JP2015043392A (ja) * 2013-08-26 2015-03-05 三菱マテリアル株式会社 接合体及びパワーモジュール用基板
US9648737B2 (en) 2013-08-26 2017-05-09 Mitsubishi Materials Corporation Bonded body and power module substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021256172A1 (ru) * 2020-06-16 2021-12-23

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6530514B2 (en) * 2001-06-28 2003-03-11 Outokumpu Oyj Method of manufacturing heat transfer tubes
US7461770B2 (en) 2003-08-04 2008-12-09 Vacuumschmelze Gmbh & Co. Kg Copper-based brazing alloy and brazing process
US7654438B2 (en) 2003-08-04 2010-02-02 Vacuumschmelze Gmbh & Co. Kg Copper-based brazing alloy and brazing process
EP2813792A1 (en) 2013-06-14 2014-12-17 Mitsubishi Electric Corporation Twisted tube heat exchanger and method for manufacturing twisted tube heat exchanger
CN104236339B (zh) * 2013-06-14 2017-04-12 三菱电机株式会社 扭管式换热器以及扭管式换热器的制造方法
JP2015043392A (ja) * 2013-08-26 2015-03-05 三菱マテリアル株式会社 接合体及びパワーモジュール用基板
US9648737B2 (en) 2013-08-26 2017-05-09 Mitsubishi Materials Corporation Bonded body and power module substrate
US10173282B2 (en) 2013-08-26 2019-01-08 Mitsubishi Materials Corporation Bonded body and power module substrate

Also Published As

Publication number Publication date
JPS6340639B2 (ru) 1988-08-11

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