JPS5796538A - Processing method for component parts of semiconductor device - Google Patents

Processing method for component parts of semiconductor device

Info

Publication number
JPS5796538A
JPS5796538A JP17208480A JP17208480A JPS5796538A JP S5796538 A JPS5796538 A JP S5796538A JP 17208480 A JP17208480 A JP 17208480A JP 17208480 A JP17208480 A JP 17208480A JP S5796538 A JPS5796538 A JP S5796538A
Authority
JP
Japan
Prior art keywords
lead frame
processing surface
processing
apertures
surface plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17208480A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0231498B2 (enrdf_load_stackoverflow
Inventor
Shigeru Takami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP17208480A priority Critical patent/JPS5796538A/ja
Publication of JPS5796538A publication Critical patent/JPS5796538A/ja
Publication of JPH0231498B2 publication Critical patent/JPH0231498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP17208480A 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device Granted JPS5796538A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17208480A JPS5796538A (en) 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17208480A JPS5796538A (en) 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5796538A true JPS5796538A (en) 1982-06-15
JPH0231498B2 JPH0231498B2 (enrdf_load_stackoverflow) 1990-07-13

Family

ID=15935234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17208480A Granted JPS5796538A (en) 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5796538A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009267312A (ja) * 2008-04-30 2009-11-12 Mitsubishi Electric Corp 半導体装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227271A (en) * 1975-08-25 1977-03-01 Nec Corp Dye bonding device
JPS5545214U (enrdf_load_stackoverflow) * 1978-09-14 1980-03-25
JPS56132747U (enrdf_load_stackoverflow) * 1980-03-05 1981-10-08

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227271A (en) * 1975-08-25 1977-03-01 Nec Corp Dye bonding device
JPS5545214U (enrdf_load_stackoverflow) * 1978-09-14 1980-03-25
JPS56132747U (enrdf_load_stackoverflow) * 1980-03-05 1981-10-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009267312A (ja) * 2008-04-30 2009-11-12 Mitsubishi Electric Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0231498B2 (enrdf_load_stackoverflow) 1990-07-13

Similar Documents

Publication Publication Date Title
ATE20660T1 (de) Magnetische vorrichtung, insbesondere zum umladen.
JPS5796538A (en) Processing method for component parts of semiconductor device
JPS6457452A (en) Disk clamping device
JPS637291A (ja) 保持装置
JPS574840A (en) Attracting conveyor for thin plate for press or the like
JPS567443A (en) Wire bonder
JPS57202037A (en) Pallet for shadow mask removing device
JPS57160815A (en) Article supply method and jig
CN218052158U (zh) 卡扣
JPH04336998A (ja) パンチ機構
JPS5375866A (en) Wafer transfer device
JPS57117434A (en) Plate piece separation method and apparatus
JPS52105817A (en) Removably holding device for focal plate of camera
JPS55101538A (en) Method of separating iron plates
JPS57136672A (en) Flash fixing device
JPS6431169A (en) Recording paper processor
JPS5582444A (en) Manufacture of semiconductor device
JPS57142667A (en) Developing device
JPS5258480A (en) Wafer pick-up device
JPS57177510A (en) Dc solenoid
JPS56152243A (en) Manufacture of semiconductor device
JPS641239A (en) Transfer device for film carrier
JPS6411341A (en) Positioning of semiconductor wafer
JPS6414007A (en) Deburring method and device therefor
JPS5477975A (en) Vacuum attracting conveying apparatus