JPH0231498B2 - - Google Patents
Info
- Publication number
- JPH0231498B2 JPH0231498B2 JP55172084A JP17208480A JPH0231498B2 JP H0231498 B2 JPH0231498 B2 JP H0231498B2 JP 55172084 A JP55172084 A JP 55172084A JP 17208480 A JP17208480 A JP 17208480A JP H0231498 B2 JPH0231498 B2 JP H0231498B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- magnetic force
- lead frame
- package
- assembled parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17208480A JPS5796538A (en) | 1980-12-08 | 1980-12-08 | Processing method for component parts of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17208480A JPS5796538A (en) | 1980-12-08 | 1980-12-08 | Processing method for component parts of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5796538A JPS5796538A (en) | 1982-06-15 |
JPH0231498B2 true JPH0231498B2 (enrdf_load_stackoverflow) | 1990-07-13 |
Family
ID=15935234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17208480A Granted JPS5796538A (en) | 1980-12-08 | 1980-12-08 | Processing method for component parts of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5796538A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009267312A (ja) * | 2008-04-30 | 2009-11-12 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5918861B2 (ja) * | 1975-08-25 | 1984-05-01 | 日本電気株式会社 | ダイボンデイング装置 |
JPS5749388Y2 (enrdf_load_stackoverflow) * | 1978-09-14 | 1982-10-29 | ||
JPS6031262Y2 (ja) * | 1980-03-05 | 1985-09-18 | 富士通株式会社 | ヒ−タ− |
-
1980
- 1980-12-08 JP JP17208480A patent/JPS5796538A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5796538A (en) | 1982-06-15 |
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