JPS5545214U - - Google Patents

Info

Publication number
JPS5545214U
JPS5545214U JP12674278U JP12674278U JPS5545214U JP S5545214 U JPS5545214 U JP S5545214U JP 12674278 U JP12674278 U JP 12674278U JP 12674278 U JP12674278 U JP 12674278U JP S5545214 U JPS5545214 U JP S5545214U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12674278U
Other languages
Japanese (ja)
Other versions
JPS5749388Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12674278U priority Critical patent/JPS5749388Y2/ja
Publication of JPS5545214U publication Critical patent/JPS5545214U/ja
Application granted granted Critical
Publication of JPS5749388Y2 publication Critical patent/JPS5749388Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
JP12674278U 1978-09-14 1978-09-14 Expired JPS5749388Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12674278U JPS5749388Y2 (enrdf_load_stackoverflow) 1978-09-14 1978-09-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12674278U JPS5749388Y2 (enrdf_load_stackoverflow) 1978-09-14 1978-09-14

Publications (2)

Publication Number Publication Date
JPS5545214U true JPS5545214U (enrdf_load_stackoverflow) 1980-03-25
JPS5749388Y2 JPS5749388Y2 (enrdf_load_stackoverflow) 1982-10-29

Family

ID=29088857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12674278U Expired JPS5749388Y2 (enrdf_load_stackoverflow) 1978-09-14 1978-09-14

Country Status (1)

Country Link
JP (1) JPS5749388Y2 (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5114316A (enrdf_load_stackoverflow) * 1974-06-28 1976-02-04 Oce Van Der Grinten Nv
JPS5785133U (enrdf_load_stackoverflow) * 1980-11-14 1982-05-26
JPS5796538A (en) * 1980-12-08 1982-06-15 Toshiba Corp Processing method for component parts of semiconductor device
JPH01179336A (ja) * 1987-12-30 1989-07-17 Sanken Electric Co Ltd ワイヤボンディング装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5114316A (enrdf_load_stackoverflow) * 1974-06-28 1976-02-04 Oce Van Der Grinten Nv
JPS5785133U (enrdf_load_stackoverflow) * 1980-11-14 1982-05-26
JPS5796538A (en) * 1980-12-08 1982-06-15 Toshiba Corp Processing method for component parts of semiconductor device
JPH01179336A (ja) * 1987-12-30 1989-07-17 Sanken Electric Co Ltd ワイヤボンディング装置

Also Published As

Publication number Publication date
JPS5749388Y2 (enrdf_load_stackoverflow) 1982-10-29

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