JPS5789232A - Forming device of spherical lump - Google Patents
Forming device of spherical lumpInfo
- Publication number
- JPS5789232A JPS5789232A JP55165349A JP16534980A JPS5789232A JP S5789232 A JPS5789232 A JP S5789232A JP 55165349 A JP55165349 A JP 55165349A JP 16534980 A JP16534980 A JP 16534980A JP S5789232 A JPS5789232 A JP S5789232A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- discharge
- tip
- spherical
- forming device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85053—Bonding environment
- H01L2224/85054—Composition of the atmosphere
- H01L2224/85075—Composition of the atmosphere being inert
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01007—Nitrogen [N]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01018—Argon [Ar]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To obtain a spherical lump forming device which is able to produce spherical lumps in a stable manner, able to be easily attached to an existing wire bonding device and has a good operating performance. CONSTITUTION:A discharge electrode 1 is composed of a pipe, and at the same time, on the tip facing the bottom end of a bonding tool 3 which holds an aluminum wire 2, only the bottom end of the pipe extends as it is to form a discharge terminal 4. For this reason, the wire 2 faces the discharge terminla 4 on the top, and when a subscribed voltage is impressed between the wire 2 and the discharge terminal 4, discharge occurs between the tip of the wire 2 and the discharge terminal 4, and the tip of the wire 2 is melted. At this time, gases of Ar, N2, etc. are discharged from the tip of the discharge electrode 1, discharge space is filled with inert gas, and therefore, the tip of the molten wire can be always turned into a stably spherical lump 5 without being oxidized.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55165349A JPS5789232A (en) | 1980-11-26 | 1980-11-26 | Forming device of spherical lump |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55165349A JPS5789232A (en) | 1980-11-26 | 1980-11-26 | Forming device of spherical lump |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5789232A true JPS5789232A (en) | 1982-06-03 |
JPS6333296B2 JPS6333296B2 (en) | 1988-07-05 |
Family
ID=15810662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55165349A Granted JPS5789232A (en) | 1980-11-26 | 1980-11-26 | Forming device of spherical lump |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5789232A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58131743A (en) * | 1982-01-29 | 1983-08-05 | Shinkawa Ltd | Method of ball formation for wire bonder and device thereof |
JPS58212145A (en) * | 1982-06-03 | 1983-12-09 | Toshiba Corp | Wire bonding method |
JPS5917254A (en) * | 1982-07-20 | 1984-01-28 | Shinkawa Ltd | Forming method for ball in wire bonder |
JPS5926246U (en) * | 1982-08-10 | 1984-02-18 | 海上電機株式会社 | Spark electrode for aluminum ball forming |
JPS60211951A (en) * | 1984-04-06 | 1985-10-24 | Toshiba Corp | Wire-bonding device |
JPS60213038A (en) * | 1984-04-09 | 1985-10-25 | Toshiba Corp | Wire bonding device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51147174A (en) * | 1975-05-15 | 1976-12-17 | Welding Inst | Method and apparatus for connecting wires |
-
1980
- 1980-11-26 JP JP55165349A patent/JPS5789232A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51147174A (en) * | 1975-05-15 | 1976-12-17 | Welding Inst | Method and apparatus for connecting wires |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58131743A (en) * | 1982-01-29 | 1983-08-05 | Shinkawa Ltd | Method of ball formation for wire bonder and device thereof |
JPS58212145A (en) * | 1982-06-03 | 1983-12-09 | Toshiba Corp | Wire bonding method |
JPH0341981B2 (en) * | 1982-06-03 | 1991-06-25 | ||
JPS5917254A (en) * | 1982-07-20 | 1984-01-28 | Shinkawa Ltd | Forming method for ball in wire bonder |
JPS5926246U (en) * | 1982-08-10 | 1984-02-18 | 海上電機株式会社 | Spark electrode for aluminum ball forming |
JPS60211951A (en) * | 1984-04-06 | 1985-10-24 | Toshiba Corp | Wire-bonding device |
JPH0584057B2 (en) * | 1984-04-06 | 1993-11-30 | Tokyo Shibaura Electric Co | |
JPS60213038A (en) * | 1984-04-09 | 1985-10-25 | Toshiba Corp | Wire bonding device |
Also Published As
Publication number | Publication date |
---|---|
JPS6333296B2 (en) | 1988-07-05 |
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