JPH0584057B2 - - Google Patents
Info
- Publication number
- JPH0584057B2 JPH0584057B2 JP59068463A JP6846384A JPH0584057B2 JP H0584057 B2 JPH0584057 B2 JP H0584057B2 JP 59068463 A JP59068463 A JP 59068463A JP 6846384 A JP6846384 A JP 6846384A JP H0584057 B2 JPH0584057 B2 JP H0584057B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- torch
- tip
- ball
- supply port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007789 gas Substances 0.000 description 21
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85053—Bonding environment
- H01L2224/85054—Composition of the atmosphere
- H01L2224/85075—Composition of the atmosphere being inert
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明はたとえばLSIなどの集積回路の組立
て工程においてペレツトに対してワイヤをボンデ
イングするワイヤボンデイング装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a wire bonding apparatus for bonding a wire to a pellet in the assembly process of an integrated circuit such as an LSI.
一般に集積回路等の組立てに用いられるワイヤ
ボンデイング装置は、ボンデイングツールに設け
られたキヤピラリにワイヤを挿通し、このワイヤ
の先端を第１のボンデイング点であるペレツトの
パツドに押付けてボンデイングしたのち、キヤピ
ラリもしくはリードフレームを移動して第２のボ
ンデイング点であるリードフレームのリード部に
圧着するようになつている。このとき、上記第１
のボンデイング点に圧着する前に上記ワイヤの先
端にスパーク用トーチによつてボールを形成し、
このボールをパツドに圧着している。ところで、
上記ワイヤはアルミニウムなどの卑金属を用いる
場合、ボール形成時にボールが酸化しやすく、酸
化するとボンデイング性が極度に低下するという
不都合がある。そこで従来においては、第１図に
示すように、キヤピラリ１から導出するワイヤ２
の先端に向けてシールドガス供給管３を設置しシ
ールドガスをワイヤ２の先端に向けて吹付け、ト
ーチ電極４とワイヤ２の先端の領域を大気からシ
ールドし、ボール５の酸化を防止している。な
お、６はボンデイングツール、７はトーチ電源で
ある。
Wire bonding equipment, which is generally used for assembling integrated circuits, inserts a wire into a capillary provided in a bonding tool, presses the tip of the wire against a pellet pad that is the first bonding point, performs bonding, and then inserts the wire into the capillary. Alternatively, the lead frame is moved and crimped to the lead portion of the lead frame, which is the second bonding point. At this time, the first
Form a ball at the tip of the wire with a spark torch before crimping it to the bonding point.
This ball is pressed onto the pad. by the way,
When the wire is made of a base metal such as aluminum, the ball is easily oxidized during ball formation, and oxidation causes a disadvantage in that bonding properties are extremely reduced. Therefore, in the past, as shown in FIG.
A shielding gas supply pipe 3 is installed toward the tip of the wire 2 and the shielding gas is sprayed toward the tip of the wire 2 to shield the area of the torch electrode 4 and the tip of the wire 2 from the atmosphere and prevent the ball 5 from oxidizing. There is. Note that 6 is a bonding tool and 7 is a torch power source.
しかしながら、上記シールドガス供給管３をワ
イヤ２の先端に向けてセツテイングする際、ワイ
ヤ２の先端からの距離や角度などを同一条件で設
置することは困難である。したがつて、大気をシ
ールドガスに巻込みやすい局部的なシールドでは
シールドガスが安定した流量で同一箇所に吹付け
られることが必要なので上述し構造のものは確実
な酸化防止ができないという欠点がある。また、
シールドガス供給管３がワイヤ２の先端近くまで
接近して設置されているためボンデイング作業の
邪魔になるという不都合がある。 However, when setting the shielding gas supply pipe 3 toward the tip of the wire 2, it is difficult to set it under the same conditions such as the distance and angle from the tip of the wire 2. Therefore, in the case of a local shield where the atmosphere is likely to be drawn into the shielding gas, it is necessary that the shielding gas be sprayed at the same location at a stable flow rate, so the structure described above has the disadvantage that it cannot reliably prevent oxidation. . Also,
Since the shielding gas supply pipe 3 is installed close to the tip of the wire 2, it is inconvenient that it interferes with the bonding work.
この発明は、上記事情に着目してなされたもの
で、その目的とするところは、トーチ電極とワイ
ヤの先端の領域を大気から確実にシールドするこ
とができ、ボールの酸化を防止することができる
ワイヤボンデイング装置を提供しようとするもの
である。
This invention was made in view of the above circumstances, and its purpose is to reliably shield the area of the torch electrode and the tip of the wire from the atmosphere, thereby preventing the ball from oxidizing. The present invention aims to provide a wire bonding device.
この発明は上記目的を達成するために、第１の
発明は、ワイヤの先端にボールを形成させるトー
チ電極を有するスパーク用トーチ本体と上記トー
チ電極のワイヤの先端側の領域と対向する部位を
大気から遮断するシールドガスの供給口体とを支
持部材により一体的に挟持し、上記トーチ電極と
供給口体を前記ワイヤの先端に近接可能に設けた
ことにある。そして、シールドガスによつてボー
ルの酸化を防止するようにしたことにある。
In order to achieve the above object, the present invention provides a sparking torch main body having a torch electrode that forms a ball at the tip of the wire, and a portion of the torch electrode that faces the area on the tip side of the wire in the atmosphere. The torch electrode and the supply port body for shielding gas are integrally held between supporting members, and the torch electrode and the supply port body are provided so as to be close to the tip of the wire. Another advantage is that the shield gas prevents the ball from oxidizing.
以下、この発明の実施例を図面にもとづいて説
明する。
Embodiments of the present invention will be described below based on the drawings.
第２図および第３図は第１の実施例を示すもの
で、１１はボンデイングツールであり、この先端
にはキヤピラリ１２が設けられている。そして、
このキヤピラリ１２にはアルミニウム線からなる
ワイヤ１３が挿通され、この先端はキヤピラリ１
２のから突出されている。そして、このキヤピラ
リ１２はボンデイングツール１１と一体に上下動
するようになつている。このボンデイングツール
１１の隣側にはスパーク用トーチ本体１４が設け
られ、これはトーチ支持部材１５によつ支持さ
れ、往復運動または回動して上記キヤピラリ１２
に進退するようになつている。また、このスパー
ク用トーチ本体１４の先端には平板状のトーチ電
極１７が設けられている。このスパーク用トーチ
本体１４の上部にはシールドガスの供給口体２３
が設けられている。この供給口体２３は断面が矩
形状で、先端には末広がりの吹出し口２４が設け
られている。 FIGS. 2 and 3 show a first embodiment, in which 11 is a bonding tool, and a capillary 12 is provided at the tip of the bonding tool. and,
A wire 13 made of aluminum wire is inserted into the capillary 12, and the tip of the wire 13 is inserted into the capillary 12.
It stands out from 2. This capillary 12 is designed to move up and down together with the bonding tool 11. A sparking torch main body 14 is provided adjacent to the bonding tool 11, and this is supported by a torch support member 15 and reciprocates or rotates to connect the capillary 12.
It is starting to advance and retreat. Further, a flat torch electrode 17 is provided at the tip of this sparking torch body 14. At the top of this spark torch body 14 is a shield gas supply port body 23.
is provided. This supply port body 23 has a rectangular cross section, and is provided with an outlet 24 that widens toward the end.
そして、スパーク用トーチ本体１４とシールド
ガスの供給口体２３とは前記トーチ支持部材１５
によつて一体的に挟持されている。さらに、供給
口体２３の末端はガスチユーブ１８を介してシー
ルドガス供給源、例えば、窒素、アルゴンなどの
不活性ガスボンベ（図示しない）に接続され、供
給口体２からシールドガスをトーチ電極１７方向
に吹き付けるようになつている。なお、１９はス
パーク用トーチ本体１４から突出する端子であ
り、この端子１９および上記ワイヤ１３はトーチ
電源２０に接続されている。 The spark torch main body 14 and the shield gas supply port body 23 are connected to the torch support member 15.
It is integrally held by. Furthermore, the end of the supply port body 23 is connected to a shielding gas supply source, for example, an inert gas cylinder (not shown) such as nitrogen or argon, through the gas tube 18, and the shielding gas is supplied from the supply port body 2 toward the torch electrode 17. It is supposed to be sprayed. Note that 19 is a terminal protruding from the sparking torch main body 14, and this terminal 19 and the wire 13 are connected to a torch power source 20.
しかして、ワイヤ１３をペレツト２１のパツド
部にボンデイングする場合には、まず、スパーク
用トーチ本体１４が前進してトーチ電極１７がキ
ヤピラリ１２の下端に対向する。このとき、キヤ
ピラリ１２に挿通されたワイヤ１３の先端はキヤ
ピラリ１２の下端に近接する。一方、シールドガ
ス供給源からのシールドガスはガスチユーブ１８
を介して供給口体２３から吹出しているため、ト
ーチ電極１７のワイヤ１３の領域はシールドガス
によつて大気から遮断されている。この状態てト
ーチ電極１７に電圧が印加されると、スパークが
発生し、ワイヤ１３の先端にボール２２が形成さ
れる。すなわち、ボール２２は窒素またはアルゴ
ンなどの不活性ガスからなるシールドガスによつ
て覆われているため表面酸化を防止することがで
き、ペレツト２１のパツド部へのボンデイング性
を向上し、確実に圧着する。 When bonding the wire 13 to the pad portion of the pellet 21, first, the sparking torch main body 14 moves forward so that the torch electrode 17 faces the lower end of the capillary 12. At this time, the tip of the wire 13 inserted into the capillary 12 comes close to the lower end of the capillary 12. On the other hand, the shielding gas from the shielding gas supply source is supplied to the gas tube 18.
The area of the wire 13 of the torch electrode 17 is shielded from the atmosphere by the shield gas. When a voltage is applied to the torch electrode 17 in this state, a spark is generated and a ball 22 is formed at the tip of the wire 13. In other words, since the ball 22 is covered with a shielding gas made of an inert gas such as nitrogen or argon, surface oxidation can be prevented, improving the bonding properties of the pellet 21 to the pad, and ensuring secure compression. do.
以上説明したように、この発明によれば、ワイ
ヤの先端にボールを形成させるスパーク用トーチ
本体にシールドガスの供給口体を一体的に挟持し
て設け、トーチ電極とワイヤの先端の領域をシー
ルドガスによつて大気から遮断するようにしたか
ら、ボールの酸化を防止することができ、ボンデ
イング性を向上することができる。
As explained above, according to the present invention, a shielding gas supply port body is integrally sandwiched between the sparking torch body that forms a ball at the tip of the wire, and the region of the torch electrode and the tip of the wire is shielded. Since the ball is shielded from the atmosphere by gas, oxidation of the ball can be prevented and bonding properties can be improved.
さらに、トーチ電極の放電部分は高温かつ放電
端子による電子の移動に伴い損耗が激しいが、ス
パーク用トーチ本体とシールドガスの供給口体と
を別体に構成することにより、トーチ電極にＷ
（タングステン）などの高耐熱材料を用い、供給
口体を成形性のよい材料で製作することができ、
トーチ電極が損耗した場合にはトーチ電極のみを
交換することができ、トーチ電極の損耗を最小限
に抑制しつつ経済的にも有利であるという効果を
奏する。 Furthermore, the discharge part of the torch electrode is subject to high temperatures and wear and tear due to the movement of electrons by the discharge terminal, but by configuring the sparking torch body and the shield gas supply port separately, the torch
By using high heat-resistant materials such as (tungsten), the supply port body can be made of materials with good moldability.
When the torch electrode is worn out, only the torch electrode can be replaced, and the wear and tear on the torch electrode can be minimized while being economically advantageous.
第１図は従来のワイヤボンデイング装置を示す
正面図、第２図および第３図はこの発明の第１の
実施例を示し、第２図は正面図、第３図はその斜
視図である。
１２……キヤピラリ、１３……ワイヤ、１４…
…スパーク用トーチ本体、２３……供給口体、１
７……トーチ電極。
FIG. 1 is a front view showing a conventional wire bonding apparatus, FIGS. 2 and 3 are a first embodiment of the present invention, FIG. 2 is a front view, and FIG. 3 is a perspective view thereof. 12... Capillary, 13... Wire, 14...
... Spark torch body, 23 ... Supply port body, 1
7...Torch electrode.
Claims (1)
ルを形成し、このボールを被接合部材に圧着させ
るワイヤボンデイング装置において、上記ワイヤ
の先端にボールを形成させるトーチ電極を有する
スパーク用トーチ本体と上記トーチ電極のワイヤ
の先端側の領域と対向する部位を大気から遮断す
るシールドガスの供給口体とを支持部材により一
体的に挟持し、上記トーチ電極と供給口体を前記
ワイヤの先端に近接可能に設けたことを特徴とす
るワイヤボンデイング装置。1. A wire bonding device that forms a ball at the tip of a wire inserted into a capillary and press-bonds the ball to a member to be bonded, a sparking torch body having a torch electrode that forms a ball at the tip of the wire, and the torch electrode. A shielding gas supply port body for shielding a region facing the tip side of the wire from the atmosphere is integrally held between supporting members, and the torch electrode and the supply port body are provided so as to be close to the tip of the wire. A wire bonding device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59068463A JPS60211951A (en) | 1984-04-06 | 1984-04-06 | Wire-bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59068463A JPS60211951A (en) | 1984-04-06 | 1984-04-06 | Wire-bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60211951A JPS60211951A (en) | 1985-10-24 |
| JPH0584057B2 true JPH0584057B2 (en) | 1993-11-30 |
Family
ID=13374403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59068463A Granted JPS60211951A (en) | 1984-04-06 | 1984-04-06 | Wire-bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60211951A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4327633B2 (en) * | 2004-03-25 | 2009-09-09 | 富士通株式会社 | Bonding equipment |
| US7658313B2 (en) | 2006-07-03 | 2010-02-09 | Kabushiki Kaisha Shinkawa | Ball forming device in a bonding apparatus and ball forming method |
| JP2008034811A (en) | 2006-07-03 | 2008-02-14 | Shinkawa Ltd | Ball forming device in wire bonding device, and bonding device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5789232A (en) * | 1980-11-26 | 1982-06-03 | Hitachi Ltd | Forming device of spherical lump |
-
1984
- 1984-04-06 JP JP59068463A patent/JPS60211951A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5789232A (en) * | 1980-11-26 | 1982-06-03 | Hitachi Ltd | Forming device of spherical lump |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60211951A (en) | 1985-10-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |